MEMORY OPERATION BASED ON BLOCK-ASSOCIATED TEMPERATURE

    公开(公告)号:US20230418475A1

    公开(公告)日:2023-12-28

    申请号:US17848061

    申请日:2022-06-23

    Abstract: Various embodiments provide for performing a memory operation, such as a memory block compaction operation or block folding or refresh operation, based on a temperature associated with a memory block of a memory device. For instance, some embodiments provide for techniques that can cause performance of a block compaction operation on a memory block at a temperature that is at least at or higher than a predetermined temperature value. Additionally, some embodiments provide for techniques that can cause performance of a block folding/refresh operation, at a temperature that is at or higher than the predetermined temperature value, on one or more blocks on which data was written at a temperature lower than the predetermined temperature value.

    THERMAL-AWARE SOURCE CODE COMPILATION
    6.
    发明申请
    THERMAL-AWARE SOURCE CODE COMPILATION 有权
    热电源代码编译

    公开(公告)号:US20130104110A1

    公开(公告)日:2013-04-25

    申请号:US13711236

    申请日:2012-12-11

    Abstract: Thermal-aware source code compilation including: receiving, by a compiler, an identification of a target computing system, the identification of the target computing system specifying temperature sensors that measure temperature of a memory module; compiling the source code into an executable application including inserting in the executable application computer program instructions for thermal-aware execution, the computer program instructions, when executed on the target computing system, carry out the steps of: retrieving temperature measurements of one or more of the target computing system's temperature sensors; determining, in real-time in dependence upon the temperature measurements, whether a memory module is overheated; if a memory module is overheated, entering a thermal-aware execution state including, for each memory allocation in the executable application, allocating memory on a different memory module than the overheated memory module; and upon the temperature sensors indicating the memory module is no longer overheated, exiting the thermal-aware execution state.

    Abstract translation: 热感知源代码编译包括:由编译器接收目标计算系统的标识,指定测量存储器模块温度的温度传感器的目标计算系统的识别; 将源代码编译成可执行应用程序,包括在可执行应用程序中插入用于热感知执行的计算机程序指令,当在目标计算系统上执行时,计算机程序指令执行以下步骤:检索以下步骤中的一个或多个的温度测量: 目标计算机系统的温度传感器; 根据温度测量实时确定存储器模块是否过热; 如果存储器模块过热,则进入热感知执行状态,包括对于可执行应用程序中的每个存储器分配,在与过热存储器模块不同的存储器模块上分配存储器; 并且在指示存储器模块的温度传感器不再过热时,退出热敏感执行状态。

Patent Agency Ranking