Abstract:
A memory system includes an interface and storage circuitry. The interface is configured to communicate with a plurality of memory cells that store data by setting the memory cells to analog voltages representative of respective storage values. The storage circuitry is configured to receive data for storage, to measure a temperature at a time of programming the received data, and, to program the received data to the memory cells using a first programming scheme when the measured temperature falls within a predefined normal temperature range, and otherwise to program the received data to the memory cells using a second programming scheme having a lower net storage utilization than the first programming scheme.
Abstract:
In certain embodiments, a system includes first and second resistive components and a touch sensor controller. The first component is positioned on a first sense line connected to an in-cell touch sensor. The first resistive component is set to a value modifying an RC time constant of a first electrode of the touch sensor. The second resistive component is positioned on a second sense line connected to the in-cell touch sensor. The second component is set to a value modifying an RC time constant of a second electrode of the touch sensor. The value of the modified RC time constant of the first electrode is within 100% of the value of the modified RC time constant of the second electrode. The controller receives signals from the first and second sense lines, such that the first and second resistive components are between the controller and the first and second electrodes, respectively.
Abstract:
Aspects of the disclosure pertain to a system and method for providing a flash memory cache input/output throttling mechanism based upon temperature parameters for promoting improved flash life. The mechanism restricts flash memory cache caching of inputs/outputs associated with Least Recently Used data and Most Recently Used data when a temperature of the flash memory is at or above a threshold temperature.
Abstract:
Various embodiments provide for performing a memory operation, such as a memory block compaction operation or block folding or refresh operation, based on a temperature associated with a memory block of a memory device. For instance, some embodiments provide for techniques that can cause performance of a block compaction operation on a memory block at a temperature that is at least at or higher than a predetermined temperature value. Additionally, some embodiments provide for techniques that can cause performance of a block folding/refresh operation, at a temperature that is at or higher than the predetermined temperature value, on one or more blocks on which data was written at a temperature lower than the predetermined temperature value.
Abstract:
The present system for modeling intelligent sensor selection and placement takes signal and sensor information and calculates a statistical inference. As signal data passes through a series of processors, it is transformed by functions to account for signal emission, sensor reception, environmental factors, and noise. This produces a simulation of what the emitted signal would appear to be at a given sensor. The system may be used to select the most effective sensors for a given area or to determine the best sensor coverage for a given area.
Abstract:
Thermal-aware source code compilation including: receiving, by a compiler, an identification of a target computing system, the identification of the target computing system specifying temperature sensors that measure temperature of a memory module; compiling the source code into an executable application including inserting in the executable application computer program instructions for thermal-aware execution, the computer program instructions, when executed on the target computing system, carry out the steps of: retrieving temperature measurements of one or more of the target computing system's temperature sensors; determining, in real-time in dependence upon the temperature measurements, whether a memory module is overheated; if a memory module is overheated, entering a thermal-aware execution state including, for each memory allocation in the executable application, allocating memory on a different memory module than the overheated memory module; and upon the temperature sensors indicating the memory module is no longer overheated, exiting the thermal-aware execution state.
Abstract:
A circuit for monitoring the power supply for a memory system which is arranged to inhibit operation of the memory system during a power supply failure while maintaining a temporary supply of power to the memory system.
Abstract:
THE ELECTRONIC SENSING SYSTEM SELECTIVELY ENERGIZES AN ELECTRICAL APPARATUS A PREDETERMINED TIME AFTER THE ELECTRICAL POWER IS APPLIED TO THE SYSTEM AND IN SYNCHRONISM WITH A SIGNAL INDICATING THE APPARATUS IS READY TO BE ENERGIZED. THE ELECTRICAL APPARATUS IS DE-ENERGIZED IN RESPONSE TO BOTH A SUDDEN DECREASE IN AMPLITUDE OF A MONITORED VOLTAGE WHICH ACTIVATES A TRIGGER CIRCUIT, AND IN SYNCHRONISM WITH A SUBSEQUENT SIGNAL INDICATING THE APPARATUS IS READY TO BE DE-ENERGIZED. A SENSING CIRCUIT COMPARES THE VOLTAGE BEING MONITORED WITH A REFERENCE DERIVED FROM THIS VOLTAGE TO ACTIVATE THE TRIGGER CIRCUIT.
Abstract:
An information handling system detects an initial insertion of an alternating current (AC) adapter, and determines an identifier associated with the AC adapter. The system may also determine a parameter for attenuating noise generated by the AC adapter based on the identifier, and attenuate the noise generated by the AC adapter by applying the parameter.