公开(公告)号：US08674517B2

公开(公告)日：2014-03-18

申请号：US13328175

申请日：2011-12-16

申请人： Laurent-Luc Chapelon ,  Mohamed Bouchoucha

发明人： Laurent-Luc Chapelon ,  Mohamed Bouchoucha

IPC分类号： H01L23/488 ,  H01L21/50

CPC分类号： H01L24/16 ,  H01L23/481 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/13199 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05099 ,  H01L2924/00 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： A semiconductor device includes an assembly of two integrated circuits. The assembly has a layer of photoresist filling the space between the two integrated circuits, and at least one electrically conducting pillar within the resist and electrically coupling the two integrated circuits.

摘要翻译： 半导体器件包括两个集成电路的组件。 组件具有填充两个集成电路之间的空间的光致抗蚀剂层，以及抗蚀剂内的至少一个导电柱，并电耦合两个集成电路。

公开(公告)号：US20120153475A1

公开(公告)日：2012-06-21

申请号：US13328175

申请日：2011-12-16

申请人： Laurent-Luc Chapelon ,  Mohamed Bouchoucha

发明人： Laurent-Luc Chapelon ,  Mohamed Bouchoucha

IPC分类号： H01L23/488 ,  H01L21/50

CPC分类号： H01L24/16 ,  H01L23/481 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/13199 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05099 ,  H01L2924/00 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： A semiconductor device includes an assembly of two integrated circuits. The assembly has a layer of photoresist filling the space between the two integrated circuits, and at least one electrically conducting pillar within the resist and electrically coupling the two integrated circuits.

摘要翻译： 半导体器件包括两个集成电路的组件。 组件具有填充两个集成电路之间的空间的光致抗蚀剂层，以及抗蚀剂内的至少一个导电柱，并电耦合两个集成电路。