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公开(公告)号:US20140168901A1
公开(公告)日:2014-06-19
申请号:US14237975
申请日:2012-08-09
申请人: Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
发明人: Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
IPC分类号: H05K7/20
CPC分类号: H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
摘要: A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.
摘要翻译: 功率模块包括密封体,其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封,散热构件被布置成面对散热表面 以及设置在密封体和散热构件之间的绝缘层。 绝缘层具有层叠体,其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成,其中混合具有良好导热性的填料,并且被设置成与散热构件接触 以及至少全部的散热面,以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。
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公开(公告)号:US09439332B2
公开(公告)日:2016-09-06
申请号:US14237975
申请日:2012-08-09
申请人: Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
发明人: Eiichi Ide , Eiji Nishioka , Toshiaki Ishii , Junpei Kusukawa , Kinya Nakatsu , Tokihito Suwa
IPC分类号: H05K7/20 , H01L23/36 , H01L23/433 , H01L23/495 , B60L1/00 , B60L3/00 , B60L11/12 , B60L11/14 , B60L15/00 , B60L1/02 , B60L15/20 , H02M7/00 , H01L21/56 , H01L23/00 , H01L23/473
CPC分类号: H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
摘要: A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.
摘要翻译: 功率模块包括密封体,其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封,散热构件被布置成面对散热表面 以及设置在密封体和散热构件之间的绝缘层。 绝缘层具有层叠体,其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成,其中混合具有良好导热性的填料,并且被设置成与散热构件接触 以及至少全部的散热面,以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。
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