公开(公告)号：US20140168901A1

公开(公告)日：2014-06-19

申请号：US14237975

申请日：2012-08-09

申请人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

发明人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/209 ,  B60L1/003 ,  B60L1/02 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L15/2036 ,  B60L2200/26 ,  B60L2200/42 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/24 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/525 ,  B60L2250/16 ,  B60L2250/24 ,  B60L2250/26 ,  B60L2260/28 ,  H01L21/565 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37157 ,  H01L2224/3716 ,  H01L2224/3718 ,  H01L2224/3754 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/203 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/003 ,  H05K7/20927 ,  Y02P90/60 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  Y02T10/7275 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.

摘要翻译： 功率模块包括密封体，其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封，散热构件被布置成面对散热表面 以及设置在密封体和散热构件之间的绝缘层。 绝缘层具有层叠体，其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成，其中混合具有良好导热性的填料，并且被设置成与散热构件接触 以及至少全部的散热面，以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。

公开(公告)号：US09439332B2

公开(公告)日：2016-09-06

申请号：US14237975

申请日：2012-08-09

申请人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

发明人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/433 ,  H01L23/495 ,  B60L1/00 ,  B60L3/00 ,  B60L11/12 ,  B60L11/14 ,  B60L15/00 ,  B60L1/02 ,  B60L15/20 ,  H02M7/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/473

CPC分类号： H05K7/209 ,  B60L1/003 ,  B60L1/02 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L15/2036 ,  B60L2200/26 ,  B60L2200/42 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/24 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/525 ,  B60L2250/16 ,  B60L2250/24 ,  B60L2250/26 ,  B60L2260/28 ,  H01L21/565 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37157 ,  H01L2224/3716 ,  H01L2224/3718 ,  H01L2224/3754 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/203 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/003 ,  H05K7/20927 ,  Y02P90/60 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  Y02T10/7275 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.

摘要翻译： 功率模块包括密封体，其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封，散热构件被布置成面对散热表面 以及设置在密封体和散热构件之间的绝缘层。 绝缘层具有层叠体，其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成，其中混合具有良好导热性的填料，并且被设置成与散热构件接触 以及至少全部的散热面，以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。

公开(公告)号：US08723306B2

公开(公告)日：2014-05-13

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US20130119525A1

公开(公告)日：2013-05-16

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US08952525B2

公开(公告)日：2015-02-10

申请号：US13983291

申请日：2011-03-04

申请人： Eiichi Ide ,  Takeshi Tokuyama ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Tokihito Suwa ,  Yuujiro Kaneko

发明人： Eiichi Ide ,  Takeshi Tokuyama ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Tokihito Suwa ,  Yuujiro Kaneko

IPC分类号： H01L23/367 ,  H01L21/52 ,  H01L23/36 ,  H01L23/42 ,  H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L23/3675 ,  H01L21/52 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.

摘要翻译： 半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。 壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部 。 设置在壁部的散热部分别设置成面对多个半导体器件块。 多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个 引线框架和多个散热部分。

公开(公告)号：US20140197532A1

公开(公告)日：2014-07-17

申请号：US13983291

申请日：2011-03-04

申请人： Eiichi Ide ,  Takeshi Tokuyama ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Tokihito Suwa ,  Yuujiro Kaneko

发明人： Eiichi Ide ,  Takeshi Tokuyama ,  Nobutake Tsuyuno ,  Kinya Nakatsu ,  Tokihito Suwa ,  Yuujiro Kaneko

IPC分类号： H01L23/367 ,  H01L21/52

CPC分类号： H01L23/3675 ,  H01L21/52 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.

摘要翻译： 半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。 壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部 。 设置在壁部的散热部分别设置成面对多个半导体器件块。 多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个 引线框架和多个散热部分。

公开(公告)号：US09433134B2

公开(公告)日：2016-08-30

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H05K7/14 ,  H01L25/11 ,  H01L25/18 ,  H01L23/367 ,  H01L23/433 ,  H01L23/00 ,  H02M7/00 ,  H01L23/473

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

公开(公告)号：US08659130B2

公开(公告)日：2014-02-25

申请号：US13640512

申请日：2011-04-26

申请人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

发明人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

IPC分类号： H01L23/62

CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/34 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/209 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

摘要翻译： 电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料， 所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。 壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成 辐射板。 中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。 密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。

公开(公告)号：US20130062751A1

公开(公告)日：2013-03-14

申请号：US13640512

申请日：2011-04-26

申请人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

发明人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

IPC分类号： H01L23/34 ,  H01L21/58

CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/34 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/209 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

摘要翻译： 电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料， 所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。 壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成 辐射板。 中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。 密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。

公开(公告)号：US20140118934A1

公开(公告)日：2014-05-01

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。