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1.发明申请INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF A POLYMER SUBSTRATE 有权具有粘合到聚合物基底的聚合物侧的集成电路装置公开(公告)号：US20120126418A1
公开(公告)日：2012-05-24
申请号：US12954397
申请日：2010-11-24
申请人： Chien-Te Feng , Shih-Chin Lin
发明人： Chien-Te Feng , Shih-Chin Lin
CPC分类号： H01L24/32 , H01L21/563 , H01L23/481 , H01L23/4985 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/13009 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16237 , H01L2224/29339 , H01L2224/32225 , H01L2224/32237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/81409 , H01L2224/81411 , H01L2224/81413 , H01L2224/81416 , H01L2224/81418 , H01L2224/8142 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81457 , H01L2224/8146 , H01L2224/81463 , H01L2224/81464 , H01L2224/81469 , H01L2224/81473 , H01L2224/81476 , H01L2224/81478 , H01L2224/83385 , H01L2224/85409 , H01L2224/85411 , H01L2224/85413 , H01L2224/85416 , H01L2224/85418 , H01L2224/8542 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85457 , H01L2224/8546 , H01L2224/85463 , H01L2224/85464 , H01L2224/85469 , H01L2224/85473 , H01L2224/85476 , H01L2224/85478 , H01L2924/00014 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit (IC) device includes a polymer substrate having a topside surface and a bottomside surface opposite the topside surface, a plurality of through-holes that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads on the bottomside surface positioned over the plurality of through-holes. At least one IC die having an active topside including a plurality of bond pads and a second side is affixed to the topside surface. Bonding features are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.
摘要翻译： 集成电路（IC）装置包括具有顶侧表面和与顶侧表面相对的底部表面的聚合物基板，从顶侧表面延伸到底部表面的多个通孔，以及多个底部金属焊盘 底部表面定位在多个通孔上。 具有包括多个接合焊盘的活动顶面和第二侧的至少一个IC管芯固定到顶侧表面。 接合特征耦合到多个接合焊盘，用于将多个接合焊盘中的相应接合焊盘连接到多个底部金属焊盘。 接合特征延伸到通孔中以接触底部金属焊盘。
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2.发明授权Integrated circuit device having die bonded to the polymer side of a polymer substrate 有权具有芯片的集成电路器件与聚合物衬底的聚合物侧接合公开(公告)号：US08456021B2
公开(公告)日：2013-06-04
申请号：US12954397
申请日：2010-11-24
申请人： Chien-Te Feng , Shih-Chin Lin
发明人： Chien-Te Feng , Shih-Chin Lin
IPC分类号： H01L21/31
CPC分类号： H01L24/32 , H01L21/563 , H01L23/481 , H01L23/4985 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/13009 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16237 , H01L2224/29339 , H01L2224/32225 , H01L2224/32237 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/81409 , H01L2224/81411 , H01L2224/81413 , H01L2224/81416 , H01L2224/81418 , H01L2224/8142 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81457 , H01L2224/8146 , H01L2224/81463 , H01L2224/81464 , H01L2224/81469 , H01L2224/81473 , H01L2224/81476 , H01L2224/81478 , H01L2224/83385 , H01L2224/85409 , H01L2224/85411 , H01L2224/85413 , H01L2224/85416 , H01L2224/85418 , H01L2224/8542 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85457 , H01L2224/8546 , H01L2224/85463 , H01L2224/85464 , H01L2224/85469 , H01L2224/85473 , H01L2224/85476 , H01L2224/85478 , H01L2924/00014 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit (IC) device includes a polymer substrate having a topside surface and a bottomside surface opposite the topside surface, a plurality of through-holes that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads on the bottomside surface positioned over the plurality of through-holes. At least one IC die having an active topside including a plurality of bond pads and a second side is affixed to the topside surface. Bonding features are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.
摘要翻译： 集成电路（IC）装置包括具有顶侧表面和与顶侧表面相对的底部表面的聚合物基板，从顶侧表面延伸到底部表面的多个通孔，以及多个底部金属焊盘 底部表面定位在多个通孔上。 具有包括多个接合焊盘的活动顶面和第二侧的至少一个IC管芯固定到顶侧表面。 接合特征耦合到多个接合焊盘，用于将多个接合焊盘中的相应接合焊盘连接到多个底部金属焊盘。 接合特征延伸到通孔中以接触底部金属焊盘。
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