摘要:
The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.
摘要:
Here disclosed is an ink jet apparatus having an ink-circulating/dispersing function. The apparatus provides ink with dispersion as required, and circulates the ink through a tube to an ink-collecting tank. During this circulation, a required amount of the ink is fed to a printer head to form a predetermined pattern on a surface of a substrate. By virtue of the circulating/dispersing function, the apparatus can cope well with easy-to-aggregate ink having poor stability in terms of printing, thereby protecting a printer head or an ink-spouting section from clogging during ink jet printing. Such stabilized ink jet printing contributes to manufacturing highly reliable electronic components with an increased yield of products.
摘要:
A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 &mgr;m or more to 10 &mgr;m or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.
摘要:
A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 μm or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.
摘要:
A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.
摘要:
A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.
摘要:
A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.
摘要:
The invention relates to an electric double layer capacitor for large capacity used in regeneration or electric power storage for various electric appliances and electric vehicles, and its manufacturing method. As the resin to be used in the current collector, by adding low softening point resin, polytetrafluoroethylene resin, latex resin or the like, the flexibility, thick coating performance and winding performance are improved. By preparing the electrode solution for making such current collector by using a high pressure dispersion machine, the capacity and density of the current collector can be enhanced substantially. According to this manufacturing method, the electric double layer capacitor may be further increased in size, increased in capacity and lowered in cost.
摘要:
The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.
摘要:
The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.