摘要:
The invention relates to an electronic component (1), in particular a current sensor, having a resistance element (5) made of a resistance material, a first connection part (3) made of a conductor material for introducing an electrical current into the resistance element (5), and a second connection part (4) made of a conductor material for discharging the electrical current from the resistance element (5). According to the invention, the component (1) has a temperature-measuring device (8) for measuring a temperature difference between the resistance element (5), on the one hand, and at least one of the two connection parts (3, 4), on the other hand, in order to derive the current from the temperature difference.
摘要:
The invention relates to an electronic component (1), in particular a current sensor, having a resistance element (5) made of a resistance material, a first connection part (3) made of a conductor material for introducing an electrical current into the resistance element (5), and a second connection part (4) made of a conductor material for discharging the electrical current from the resistance element (5). According to the invention, the component (1) has a temperature-measuring device (8) for measuring a temperature difference between the resistance element (5), on the one hand, and at least one of the two connection parts (3, 4), on the other hand, in order to derive the current from the temperature difference.
摘要:
A process for producing thermally isolated semiconductor die and die produced by the process, plus improved apparatus using the die are disclosed. The process generally comprises the steps of: forming a desired semiconductor component or circuit in a semiconductor wafer (preferably a silicon wafer of crystal orientation) having a protective layer (SiO.sub.2) on one surface; forming platinum silicide contact windows in said protective layer where external connections to the semiconductor component or circuit is necessary; forming support leads of a layer of adhesive material (which also may have resistive properties, such as Nichrome) and a layer of a structurally strong metal of high electrical conductivity and low thermal conductivity (preferably 304 stainless steel) along predetermined paths extending outwardly toward the edge of the die from said contact windows; simultaneously with the forming of the adhesive layer of said support leads, forming one or more thin film resistors in predetermined regions of said die atop said SiO.sub.2 protective layer, if desired; removing said SiO.sub.2 protective layer from a region defined by said support leads, an island or islands in which said semiconductor component or circuit and said resistors are formed and a surrounding frame; and, removing said silicon from the region between said island or islands and said frame. The resulting semiconductor die comprises a frame surrounding one or more islands in which semiconductor components or circuits are formed, and which support resistors, if included. The islands are entirely supported by the support leads extending between the frame and the islands. In addition to providing support, the support leads also provide for electrical connection to the semiconductor components or circuits and to the resistors. The semiconductor die may be mounted in a package that also forms part of the invention. The package includes a ceramic substrate having an aperture in its center and alignment mesas and ridges on one surface. The ceramic substrate is formed so as to be mounted on the metal header of a conventional semiconductor canister housing. Depending upon their specific nature the resulting die are useful in and/or improve a variety of electrical apparatus. They are particularly useful as the dual RMS sensor element of an RMS converter. They can also be formed so as to be useful as radiation sensors. Or, they can be formed so as to provide a thermal platform whose temperature is controlled and stabilized at a predetermined value. All of these dies and the improved circuits resulting from their use also form part of the invention.
摘要:
A signal whose RMS value is to be accurately determined is first converted into DC form by a relatively inaccurate RMS converter, such as a thermal RMS converter (15). The result is a first converter signal (Y.sub.1), which is stored for recirculation in a suitable device, such as a sample and hold circuit (17). The first converter signal is also doubled (2Y.sub.1) and stored (41). Thereafter the first converter signal stored in the storage device is recirculated to the converter to create a second converter signal (Y.sub.2). Then, the second converter signal is subtracted (43) from the doubled first converter (2Y.sub.1 -Y.sub.2) to produce a highly accurate RMS output signal.
摘要:
Techniques described herein address these and other issues by utilizing two or more sensors to take temperature measurements from which a temperature-differential or instantaneous temperature rate-of-change, can be determined. In turn, this can be used to make a highly accurate model of the relationship between the temperature, temperature-differential, and clock circuitry frequency, to accurately estimate the frequency rate-of-change for frequency correction/compensation.
摘要:
The purpose of the present invention is to provide a mounting substrate having reduced size and cost, and a current measurement device for a storage battery. In order to achieve the purpose, this mounting substrate is characterized by having: a heat generating element; a temperature sensor for measuring the temperature of the heat generating element; and a slit that surrounds at least a part of the heat generating element and the temperature sensor. Furthermore this current measurement device for a storage battery measures currents flowing in a plurality of cell sense circuits that measure voltages of a plurality of storage batteries, and the sell sense circuits are provided on the mounting substrate that has the heat generating element, the temperature sensor that measures the temperature of the heat generating element, and the slit that surrounds at least the part of the heat generating element and the temperature sensor, the cell sense circuits being provided with a current calculation unit that obtains the currents on the basis of measurement results obtained by the temperature sensor.
摘要:
In a method for determining the electrical loadability of power lines by temperature measurement, the temperature is measured with at least one sensor arranged on the power line and connected to a data processing system, wherein the time-dependent temperature of the power line is determined by an existing or a weighted load parameter, and wherein based on the electrical current and the temperature measured by the sensor, taking into account either the existing or a weighted load parameter, a time-dependent electrical load is determined in the data processing system.
摘要:
The electric resistor of this invention is comprised of a Si-Ge alloy thin film containing amorphous and microcrystal phases which serve as an electric resistance, thereby keeping the resistance value ratio substantially constant and uninfluenced by frequency changes which range from d.c. to 32 GHz. In addition, the power detector of this invention uses a thermocouple which is made by connecting the conductor film with the above-mentioned alloy thin film having great thermoelectric power. The thermocouple is provided with beam lead electrodes at cold junction areas to thereby produce large temperature differences between the hot and cold junctions, so that the thermocouple is provided with a sufficient thermal gradient to detect very low power with high accuracy.
摘要:
A signal whose RMS value is to be accurately determined is first converted into DC form by a relatively inaccurate RMS converter, such as a thermal RMS converter (15). The result is a first converter signal (Y.sub.1), which is stored for recirculation in a suitable storage device, such as a sample and hold circuit (17). Thereafter, the signal stored in the storage device is recirculated to the converter to create a second converter signal (Y.sub.2). Then, the second converter signal is subtracted from the doubled value of the first converter signal (2Y.sub.1 -Y.sub.2) to produce a corrected RMS signal (X). The difference between the first converter signal (Y.sub.1) and the corrected RMS signal (X) is then determined. This error signal (E) is stored. Next, a decision is made as to whether or not a fast mode of operation is to be followed. If it is not to be followed the corrected RMS signal is displayed. If the fast mode is to be followed, the signal whose RMS value is to be accurately determined is reapplied to the RMS converter. The result is a third converter signal from which the error signal is subtracted to produce a corrected signal that accurately represents the RMS value of the reapplied signal. This corrected signal is then displayed or applied to other downstream subsystems, such as signal analyzers or recorders. The fast mode steps are then repeated.
摘要:
An RMS converter of the type wherein the energy of the input signal is dissipated in a first resistor and a second signal, in a form which lends itself to measurement, is generated which dissipates an equal amount of heat in a second resistor, the second signal being derived from measurement of temperature differential between the first and second resistors. This converter is characterised by a circuit for applying power to both resistors so that the total power received by each resistor remains substantially constant.