公开(公告)号：WO2018004857A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/033090

申请日：2017-05-17

Applicant: INTEL CORPORATION

Inventor： TANG, Zhizhong ,  JAIN, Syadwad ,  HU, Wei ,  SCHROEDER, Michael A. ,  SIDHU, Rajen S. ,  DEPPISCH, Carl L. ,  NARDI, Patrick ,  LOFGREEN, Kelly P. ,  DUBEY, Manish

IPC: H01L23/373 ,  H05K7/20 ,  C09K5/06

Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Abstract translation: 本文公开的装置和方法可以包括具有设置在导电泡沫内的孔的导电泡沫。 导电泡沫可以在未压缩厚度和压缩厚度之间压缩。 压缩厚度可以是未压缩厚度的百分之九十五或更少。 在一个示例中，填充物可以设置在导电泡沫的孔中。 填充物可以包括第一热导率。 第一个导热系数可以大于空气的导热系数。

公开(公告)号：WO2017030704A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/042641

申请日：2016-07-15

Applicant: INTEL CORPORATION

Inventor： KRAJNIAK, Jan ,  DEPPISCH, Carl L. ,  MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  HUA, Fay ,  WEI, Yuying ,  CANHAM, Beverly J. ,  LU, Jiongxin ,  RENAVIKAR, Mukul P.

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/488

CPC classification number: H01L23/49833 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/1339 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/8102 ,  H01L2224/81594 ,  H01L2224/816 ,  H01L2224/81611 ,  H01L2224/8169 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2924/1511 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/141 ,  H05K3/363 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01038 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/05341 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed.

Abstract translation: 这里的实施例可以涉及内插器（PoINT）架构上的补丁。 在实施例中，PoINT架构可以包括贴片和插入器之间的多个焊接点。 焊点可以包括相对高温的焊球和至少部分地围绕焊料球的相对低温的焊膏。 可以描述和/或要求保护其他实施例。