公开(公告)号：WO2015147844A1

公开(公告)日：2015-10-01

申请号：PCT/US2014/032084

申请日：2014-03-27

Applicant: INTEL CORPORATION ,  MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  OSBORN, Tyler N. ,  SIDHU, Rajen S. ,  BEKAR, Ibrahim ,  JADHAV, Susheel G.

Inventor： MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  OSBORN, Tyler N. ,  SIDHU, Rajen S. ,  BEKAR, Ibrahim ,  JADHAV, Susheel G.

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L24/73 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/0569 ,  H01L2224/11 ,  H01L2224/13014 ,  H01L2224/13026 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/29026 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/73104 ,  H01L2224/92143 ,  H01L2924/014

Abstract: Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.

Abstract translation: 这里描述了与具有增加的z高度和降低的回流温度的互连相关的装置，工艺和系统。 在实施例中，互连可以包括焊球和焊膏以将焊球耦合到衬底。 焊球和/或焊膏可以由具有较低熔点的合金和具有较高熔点的合金构成。

公开(公告)号：WO2017030704A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/042641

申请日：2016-07-15

Applicant: INTEL CORPORATION

Inventor： KRAJNIAK, Jan ,  DEPPISCH, Carl L. ,  MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  HUA, Fay ,  WEI, Yuying ,  CANHAM, Beverly J. ,  LU, Jiongxin ,  RENAVIKAR, Mukul P.

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/488

CPC classification number: H01L23/49833 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/1339 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/8102 ,  H01L2224/81594 ,  H01L2224/816 ,  H01L2224/81611 ,  H01L2224/8169 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2924/1511 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/141 ,  H05K3/363 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01038 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/05341 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed.

Abstract translation: 这里的实施例可以涉及内插器（PoINT）架构上的补丁。 在实施例中，PoINT架构可以包括贴片和插入器之间的多个焊接点。 焊点可以包括相对高温的焊球和至少部分地围绕焊料球的相对低温的焊膏。 可以描述和/或要求保护其他实施例。