公开(公告)号：WO2013075384A1

公开(公告)日：2013-05-30

申请号：PCT/CN2012/000023

申请日：2012-01-06

Applicant: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD ,  WANG, Xinchao ,  LIANG, ZHIZHONG

Inventor： WANG, Xinchao ,  LIANG, ZHIZHONG

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31

CPC classification number: H01L23/3128 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/49589 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A ball grid array (BGA) packaging structure is disclosed. The BGA packaging structure includes a metal substrate, a first outer die pad (1) formed based on the metal substrate, and a first die (5) coupled to a top surface of the outer die pad (1). The BGA packaging structure also includes a plurality of outer leads (2) formed based on the metal substrate, and a metal layer containing a plurality of inner leads (4) corresponding to the plurality of outer leads (2) and extending to proximity of the die (5). The metal layer is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads (4) is significantly reduced. Further, the BGA packaging structure includes metal wires (6) connecting die (5) and the plurality of outer leads (2) and a plurality of solder balls (9) attached to a back surface of the plurality of outer leads (2) and the die pad (1). The die (5), the plurality of inner leads (4), and metal wires (6) are sealed with a molding compound (10).

Abstract translation: 公开了一种球栅阵列（BGA）封装结构。 所述BGA封装结构包括金属基板，基于所述金属基板形成的第一外管芯焊盘（1）和与所述外管芯焊盘（1）的顶表面相连接的第一管芯（5）。 BGA封装结构还包括基于金属衬底形成的多个外部引线（2）和包含对应于多个外部引线（2）并且延伸到接近的多个内部引线（4）的金属层 死（5）。 通过多层电镀工艺在金属基板上形成金属层，使得多个内部引线（4）的引线间距显着减小。 此外，BGA封装结构包括连接管芯（5）和多个外引线（2）的金属线（6）和附接到多个外引线（2）的后表面的多个焊球（9）和 芯片焊盘（1）。 模具（5），多个内引线（4）和金属丝（6）用模塑料（10）密封。

公开(公告)号：WO2013037188A1

公开(公告)日：2013-03-21

申请号：PCT/CN2012/001162

申请日：2012-08-28

Applicant: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD ,  WANG, Xinchao ,  LIANG, Zhizhong

Inventor： WANG, Xinchao ,  LIANG, Zhizhong

IPC: H01L23/495 ,  H01L21/48

CPC classification number: H01L23/49861 ,  H01L21/4828 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

Abstract: A method is provided for manufacturing an islandless lead frame structure (100) in a semiconductor packaging process. The method includes providing a metal substrate having a top surface and a back surface, forming a first photoresist film on the top surface of the metal substrate, and forming a top surface etching pattern in the first photoresist film using photolithography. The method also includes forming a plurality of leads (1). Outer leads of the plurality of leads (1) on the back surface extend toward an area surrounded by the outer leads such that a length of the outer leads is larger than a length of inner leads of the plurality of leads (1) on the top surface. Further, the method includes removing the first photoresist film and the second photoresist film, and encapsulating the etched metal substrate using a molding compound (2) exposing top surfaces and back surfaces of the plurality leads (1).

Abstract translation: 提供了一种用于在半导体封装工艺中制造无孤岛引线框架结构（100）的方法。 该方法包括提供具有顶表面和后表面的金属基底，在金属基底的顶表面上形成第一光致抗蚀剂膜，以及使用光刻法在第一光致抗蚀剂膜中形成顶表面蚀刻图案。 该方法还包括形成多个引线（1）。 背面上的多个引线（1）的外引线朝着由外引线包围的区域延伸，使得外引线的长度大于顶部上的多个引线（1）的内引线的长度 表面。 此外，该方法包括去除第一光致抗蚀剂膜和第二光致抗蚀剂膜，并且使用暴露多个引线（1）的顶表面和背表面的模塑料（2）封装蚀刻的金属基板。

公开(公告)号：WO1993007219A1

公开(公告)日：1993-04-15

申请号：PCT/CA1992000437

申请日：1992-09-30

Applicant: THE UNIVERSITY OF TORONTO INNOVATIONS FOUNDATION ,  HESP, Simon ,  LIANG, Zhizhong ,  WOODHAMS, Raymond, T.

Inventor： THE UNIVERSITY OF TORONTO INNOVATIONS FOUNDATION

IPC: C08L95/00

CPC classification number: C08L95/00 ,  C08L95/005 ,  C08L53/00 ,  C08L23/00 ,  C08L2666/02 ,  C08L2666/04

Abstract: Insoluble particulate materials, which may be in solid or liquid form, are dispersed in a continuous non-aqueous phase and the dispersion rendered stable and resistant to phase separation by an in-situ stabilization procedure involving the formation of chemical bonds among the stabilizer components and to dispersed phases to form a network surrounding the particles which is compatible with the continuous phase. The invention has particular application for the formation of stabilized polyolefin-modified bitumen compositions for paving and other applications.

Abstract translation: 可以是固体或液体形式的不溶性颗粒材料分散在连续的非水相中，并且分散体通过涉及在稳定剂组分之间形成化学键的原位稳定程序而稳定并且耐相分离， 到分散相以形成围绕与连续相相容的颗粒的网络。 本发明特别适用于形成用于铺路和其它应用的稳定的聚烯烃改性沥青组合物。