公开(公告)号：WO2008022530A1

公开(公告)日：2008-02-28

申请号：PCT/CN2007/002262

申请日：2007-07-26

申请人： 黄柏山

发明人： 黄柏山

IPC分类号： B23K35/26 ,  H05K3/34

CPC分类号： H05K3/3484 ,  B23K35/262 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/2036 ,  H05K2203/0278

摘要： A tin paste and heat press soldering method for using same. Said tin paste comprises a tin power, a flux and a spacer element, the spacer element ditributed throughout the tin power and the flux. The heat press soldering method includes following steps:provide a heat press machine which has support parts and a press head; provide and position two components on the support parts which are prepared for heat press soldering; provide at least a spacer element in the working range of press head; apply the tin paste on the soldering surface of the components, wherein the tin paste comprises the tin powder and the flux; move the press head to heat-press the soldering surfaces of two components, melt the tin paste to connect two soldering surfaces, wherein the spacer element supporting the press head to provide a space for containing the melt tin paste. The tin paste and the heat press soldering method can apply the tin soldering between FPC and FPC, or between FPC and PCB, and the connection between the component and PCB by press soldering can be realized by using the tin paste with the spacer element.

公开(公告)号：WO2007043536A9

公开(公告)日：2007-06-07

申请号：PCT/JP2006320233

申请日：2006-10-04

申请人： SHOWA DENKO KK ,  KIMURA KAZUYA ,  UCHIDA HIROSHI

发明人： KIMURA KAZUYA ,  UCHIDA HIROSHI

IPC分类号： C08L75/04 ,  C08G18/32 ,  C08K5/54 ,  C08K7/00 ,  C08K7/10 ,  C08K7/16 ,  C08L63/00 ,  C08L83/04 ,  C08L101/00 ,  C09D11/02 ,  C09D11/10 ,  C09D11/102 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K3/28

CPC分类号： H05K3/285 ,  C08G18/0823 ,  C08G18/0852 ,  C08G18/12 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G18/758 ,  C08L75/04 ,  H05K2201/0162 ,  H05K2201/0212 ,  C08G18/282 ,  C08L2666/14

摘要： A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 mm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).

摘要翻译： 热固性树脂组合物具有优异的可印刷性，非粘性，无光泽和电性能。 热固性树脂组合物包含热固性树脂（A）和硅酮粉末（B）。 优选地，有机硅粉末（B）为球形或基本球形，并且具有0.95至1.5的比重和0.01至10mm的粒径。 热固性树脂（A）优选包含含羧基的聚氨酯和热固化性组分。 含羧基聚氨酯是通过使多异氰酸酯化合物（a），多元醇化合物（b）（化合物（c）以外）与含羧基二羟基化合物（c）反应而得到的。

公开(公告)号：WO2006110363A1

公开(公告)日：2006-10-19

申请号：PCT/US2006/012216

申请日：2006-04-04

申请人： 3M INNOVATIVE PROPERTIES COMPANY ,  KAWATE, Yoshihisa ,  MIYA, Takuro ,  KAWATE, Kohichiro

发明人： KAWATE, Yoshihisa ,  MIYA, Takuro ,  KAWATE, Kohichiro

IPC分类号： H01R12/10 ,  H01R4/04

CPC分类号： H01R4/04 ,  H01R12/598 ,  H01R12/61 ,  H01R12/613 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/10356 ,  H05K2201/10977 ,  Y10T29/49117

摘要： To provide a connecting means that can facilitate electrical connection between the circuit boards mounted in an electronic apparatus and can attain the miniaturization of connecting parts. A cable harness body comprising a plurality of cables for electrically connecting circuit boards mounted in an electronic apparatus and the terminal members disposed on both ends of said cables, wherein at least one of said terminal members is comprised of a flexible circuit board and an adhesive layer on the surface of the electric connecting part of said flexible circuit board.

摘要翻译： 为了提供能够促进安装在电子设备中的电路板之间的电连接的连接装置，并且可以实现连接部件的小型化。 一种电缆束体，包括多个电缆，用于电连接安装在电子设备中的电路板和设置在所述电缆的两端的端子构件，其中至少一个所述端子构件包括柔性电路板和粘合层 在所述柔性电路板的电连接部分的表面上。

公开(公告)号：WO2006109120A1

公开(公告)日：2006-10-19

申请号：PCT/IB2006/000711

申请日：2006-02-03

申请人： NOKIA CORPORATION ,  ISHIBASHI, Kazuo

发明人： ISHIBASHI, Kazuo

IPC分类号： H01L23/498 ,  H05K3/34

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit assembly comprising a first circuit board and a second circuit board and an electrical connection between the first board and the second board, wherein the electrical connection comprises an outer coating of a electrically conductive first material and two inner cores of a second material, the first material having a lower melting point than the second material and the two cores being arranged to form a stack in which one of the cores is located between the other of the cores and one of the circuit boards.

摘要翻译： 一种电路组件，包括第一电路板和第二电路板以及第一板和第二板之间的电连接，其中电连接包括导电第一材料的外涂层和第二材料的两个内芯， 第一材料具有比第二材料低的熔点，并且两个芯布置成形成堆叠，其中一个芯位于另一个芯和一个电路板之间。

公开(公告)号：WO2006101263A1

公开(公告)日：2006-09-28

申请号：PCT/JP2006/306597

申请日：2006-03-23

申请人： NIPPON SHOKUBAI CO., LTD. ,  YAMASHITA, Tsuyoshi ,  KUSHINO, Mitsuo ,  KUROSAWA, Mamiko

发明人： YAMASHITA, Tsuyoshi ,  KUSHINO, Mitsuo ,  KUROSAWA, Mamiko

IPC分类号： C08G12/06 ,  C08J3/12 ,  C08J7/04

CPC分类号： H05K3/323 ,  C09D161/24 ,  C09D161/26 ,  C09D161/28 ,  C09D165/00 ,  H05K2201/0212 ,  H05K2201/0221

摘要： The present invention provides a coated fine particle that is flexible and excellent in elasticity and has good adhesion to metals, a manufacturing method thereof, and conductive fine particle having the polymer coated fine particle as a core fine particle. The coated fine particle comprises a core fine particle containing an organic material or an organic and inorganic composite material and a polymer coated layer on a surface of the core fine particle formed by ring-opening reaction and/or polycondensation reaction on the surface of the core fine particle.

摘要翻译： 本发明提供柔性且弹性优异并且对金属具有良好粘合性的涂布微粒，其制造方法和具有聚合物包覆微粒作为核心微粒的导电性微粒。 涂覆的微粒包括含有有机材料或有机和无机复合材料的芯细颗粒，以及通过在芯的表面上的开环反应和/或缩聚反应形成的芯细颗粒的表面上的聚合物涂层 细颗粒

公开(公告)号：WO2005097847A1

公开(公告)日：2005-10-20

申请号：PCT/JP2005/006599

申请日：2005-04-04

申请人： ダイキン工業株式会社 ,  難波義典 ,  澤田又彦 ,  笠井俊二 ,  田頭修二 ,  小野真誠 ,  平良隆博 ,  吉本洋之

发明人： 難波義典 ,  澤田又彦 ,  笠井俊二 ,  田頭修二 ,  小野真誠 ,  平良隆博 ,  吉本洋之

IPC分类号： C08F214/26

CPC分类号： C08F214/26 ,  C08F14/26 ,  C08F214/262 ,  C08F259/08 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0212 ,  Y10T428/3154 ,  C08F2/00

摘要： 成形加工性とマイクロ波帯域での電気的特性とを両立したポリテトラフルオロエチレン粉末を提供する。 　（１）１２ＧＨｚにおける誘電正接が２．０×１０ －４ 以下、かつ、（２）リダクションレシオ１６００における円柱押出し圧力が４５ＭＰａ以下であることを特徴とする変性ポリテトラフルオロエチレン粉末である。

摘要翻译： 公开了在微波范围内同时具有足够成型性和电特性的聚四氟乙烯粉末。 具体公开了一种改性聚四氟乙烯粉末，其特征在于：（1）在12GHz时的介电损耗角正切不大于2.0×10 -4，（2）柱挤出压力不大于45MPa， 减速比1600。

公开(公告)号：WO2005072031A2

公开(公告)日：2005-08-04

申请号：PCT/US2005/003118

申请日：2005-01-19

申请人： WORLD PROPERTIES, INC. ,  SETHUMADHAVAN, Murali ,  LANDI, Vincent, R. ,  BORGES, Luis, D.

发明人： SETHUMADHAVAN, Murali ,  LANDI, Vincent, R. ,  BORGES, Luis, D.

IPC分类号： H05K1/03

CPC分类号： H05K1/032 ,  H05K1/0366 ,  H05K3/4626 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/31663

摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covelently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covelently bound POSS allow for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

摘要翻译： 一种具有设置在基底上的导电层的电路材料，其中所述基底包含有机或无机聚合物，其包含共价结合的多面体倍半硅氧烷（POSS）。 基材还可以包含另外的分散POSS，任何其它填料，包括纤维网。 使用分子结合的POSS可以使具有可接受的介电常数和耗散因子的组合物具有阻燃性。

公开(公告)号：WO01068748A1

公开(公告)日：2001-09-20

申请号：PCT/US2001/008471

申请日：2001-03-16

IPC分类号： C03C25/00 ,  C03C25/10 ,  C03C25/48 ,  C08J5/08 ,  H05K1/03

CPC分类号： C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0212

摘要： The present invention provides an at least partially coated fiber strand comprising a plurality of fibers having a coating composition on at least a portion of a surface of at least one of the fibers, the coating composition comprising: (a) a plurality of discrete particles formed from materials selected from organic materials, inorganic polymeric materials, composite materials and mixtures thereof, the particles having an average particle size, measured according to laser scattering techniques, ranging from 0.1 to 5 microns; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material.

摘要翻译： 本发明提供了一种至少部分涂布的纤维束，其包含在至少一种纤维的表面的至少一部分上具有涂料组合物的多种纤维，所述涂料组合物包含：（a）形成多个离散颗粒 来自选自有机材料，无机聚合物材料，复合材料及其混合物的材料，所述颗粒具有根据激光散射技术测量的平均粒径为0.1至5微米; （b）与所述多个离散颗粒不同的至少一种润滑材料; 和（c）至少一种成膜材料。

公开(公告)号：WO0109054A9

公开(公告)日：2001-08-16

申请号：PCT/US0020459

申请日：2000-07-28

申请人： PPG IND OHIO INC

发明人： NOVICH BRUCE E ,  LAMMON-HILINSKI KAMI ,  ROBERTSON WALTER J ,  WU XIANG ,  VELPARI VEDAGIRI ,  LAWTON ERNEST L ,  RICE WILLIAM B

IPC分类号： C03C25/10 ,  C03C25/00 ,  C03C25/48 ,  C08J5/08 ,  D06M15/507 ,  D06M15/564 ,  D06M15/59 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00

CPC分类号： C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

摘要： The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

摘要翻译： 本发明提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和在300K的温度下具有至少1瓦/米K的热导率的层状颗粒。 本发明还提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和不可水合的层状颗粒。 本发明还提供至少部分涂覆的纤维束，其包含多种纤维，所述纤维束在至少一种所述纤维的至少一部分表面上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 由选自非热膨胀性有机材料，无机聚合物材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有足以使纤维束湿润的平均粒度; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供至少部分涂覆的纤维束，其包含多种玻璃纤维，所述纤维束在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供一种至少部分涂覆的纤维束，其包含多种玻璃纤维，所述玻璃纤维在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）多个中空非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：WO01014484A1

公开(公告)日：2001-03-01

申请号：PCT/JP2000/005766

申请日：2000-08-25

IPC分类号： H05K3/34 ,  C09J4/06 ,  H01L21/60 ,  H05K3/32 ,  H05K3/36 ,  C09J7/02 ,  C09J183/04 ,  H01B1/24

CPC分类号： H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

摘要： An adhesive agent for use in connecting wiring terminals, which comprises a curing agent generating a free radical by heating, a radically polymerizable material, and silicone particles; a method for connecting wiring terminals using the adhesive agent; and a wiring structure using the adhesive agent.

摘要翻译： 一种用于连接接线端子的粘合剂，其包括通过加热产生自由基的固化剂，可自由基聚合的材料和硅氧烷颗粒; 一种使用粘合剂连接接线端子的方法; 以及使用该粘合剂的布线结构。