直接带隙发光的硅基材料及制备方法、芯片上发光器件

    公开(公告)号:WO2019173945A1

    公开(公告)日:2019-09-19

    申请号:PCT/CN2018/078711

    申请日:2018-03-12

    Abstract: 一种实现兼容CMOS工艺的直接带隙发光的硅基材料及其制备方法,该方法包括步骤:准备硅基材料,所述硅基材料为锗材料或者硅锗合金;在所述硅基材料的部分晶格间隙位置填入惰性气体原子和/或原子序数小的原子达到晶格体积膨胀,以实现其能带结构由间接带隙向直接带隙转变,得到直接带隙发光的硅基材料。此外,还提供了一种发光硅基器件。该制备方法兼容CMOS集成电路工艺,实现锗及硅锗合金材料的直接带隙发光,其发光效率比肩InP和GaAs等III-V族直接带隙材料,为实现硅基或锗基光电子集成技术所需的片上光源提供了一种全新的解决方案。

    一种量子点发光二极管及其制备方法

    公开(公告)号:WO2018205741A1

    公开(公告)日:2018-11-15

    申请号:PCT/CN2018/079009

    申请日:2018-03-14

    Inventor: 杨成玉 杨一行

    Abstract: 一种量子点发光二极管及其制备方法。该量子点发光二极管包括依次设置的衬底、底电极、发光功能层以及顶电极,底电极、发光功能层以及顶电极构成的功能层的外表面设置有第一保护层,该第一保护层由含氟丙烯酸酯共聚物制成,具有疏水性,良好的透光性、柔韧性以及散热性,可有效阻止水分和氧气渗透进入量子点发光二极管内部结构,起到良好的保护效果,同时量子点发光二极管工作时可及时散热,有利于器件更好发挥自身性能,提高发光效率和使用寿命。

    A LIGHT EMITTING DEVICE
    34.
    发明申请

    公开(公告)号:WO2018170531A1

    公开(公告)日:2018-09-27

    申请号:PCT/AU2018/000040

    申请日:2018-03-21

    Abstract: The present disclosure relates to a solid-state light emitting device, a solid state light absorbing device and methods for fabricating the same. In particular, the present disclosure relates to a light emitting device comprising: a transition metal dichalcolgenide layer disposed between two layers of a material with a bandgap larger than the transition metal dichalcolgenide layer; a plurality of nanoparticles embedded into the transition metal dichalcolgenide layer and being arranged to form a plurality of allowable energy levels within the bandgap of the transition metal dichalcolgenide layer; and electrodes arranged to apply a voltage across the two layers and the transition metal dichalcolgenide layer, wherein, when a voltage within a predetermined range is applied to the electrodes, photons with a wavelength within a specific wavelength range are emitted by the device and the wavelength range can be varied by varying the voltage across the two layers and the transition metal dichalcolgenide layer.

    SEMICONDUCTOR DEVICE
    35.
    发明申请

    公开(公告)号:WO2018117699A1

    公开(公告)日:2018-06-28

    申请号:PCT/KR2017015267

    申请日:2017-12-21

    Inventor: SEO JAE WON

    Abstract: A semiconductor device according to an embodiment may comprise: a substrate; a first and a second light-emitting structure disposed on the substrate; a first reflective electrode disposed on the first light-emitting structure and a second reflective electrode disposed on the second light-emitting structure; a connection electrode; a first electrode pad; and a second electrode pad. According to an embodiment, the first light-emitting structure may comprise: a first semiconductor layer of first conductive type; a first active layer disposed on the first semiconductor layer; a second semiconductor layer of second conductive type disposed on the first active layer; and a first through-hole extending through the second semiconductor layer and the first active layer and exposing the first semiconductor layer. The second light-emitting structure is spaced apart from the first light-emitting structure and may comprise: a third semiconductor layer of first conductive type; a second active layer disposed on the third semiconductor layer; and a fourth semiconductor layer of second conductive type disposed on the second active layer.

    희토류 금속 산화물 입자가 포함된 적외선 LED 패키지

    公开(公告)号:WO2017131361A3

    公开(公告)日:2017-08-03

    申请号:PCT/KR2017/000292

    申请日:2017-01-09

    Abstract: 본 발명은 희토류 금속 산화물 입자를 포함하는 적외선 LED 패키지에 관한 것으로서, 보다 상세히는, 적외선 LED 칩 및 고분자 수지 내에 하기 화학식 1로 표현되는 화합물을 포함하는 LED 봉지재를 구비하여 700~940 nm의 적외선 파장을 갖는 적외선 LED 패키지. [화학식 1] M a (OH) b (CO 3 ) c O d 여기서, M은 Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn, Mn, Bi 또는 Ac이고, a는 1 또는 2, b는 0 내지 2, c는 0 내지 3, d는 0 내지 3이다. 다만, b, c, 및 d는 동시에 0이 아니고, b 및 c는 동시에 0이거나, 동시에 0이 아니다.

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