Abstract:
The present disclosure relates to a solid-state light emitting device, a solid state light absorbing device and methods for fabricating the same. In particular, the present disclosure relates to a light emitting device comprising: a transition metal dichalcolgenide layer disposed between two layers of a material with a bandgap larger than the transition metal dichalcolgenide layer; a plurality of nanoparticles embedded into the transition metal dichalcolgenide layer and being arranged to form a plurality of allowable energy levels within the bandgap of the transition metal dichalcolgenide layer; and electrodes arranged to apply a voltage across the two layers and the transition metal dichalcolgenide layer, wherein, when a voltage within a predetermined range is applied to the electrodes, photons with a wavelength within a specific wavelength range are emitted by the device and the wavelength range can be varied by varying the voltage across the two layers and the transition metal dichalcolgenide layer.
Abstract:
A semiconductor device according to an embodiment may comprise: a substrate; a first and a second light-emitting structure disposed on the substrate; a first reflective electrode disposed on the first light-emitting structure and a second reflective electrode disposed on the second light-emitting structure; a connection electrode; a first electrode pad; and a second electrode pad. According to an embodiment, the first light-emitting structure may comprise: a first semiconductor layer of first conductive type; a first active layer disposed on the first semiconductor layer; a second semiconductor layer of second conductive type disposed on the first active layer; and a first through-hole extending through the second semiconductor layer and the first active layer and exposing the first semiconductor layer. The second light-emitting structure is spaced apart from the first light-emitting structure and may comprise: a third semiconductor layer of first conductive type; a second active layer disposed on the third semiconductor layer; and a fourth semiconductor layer of second conductive type disposed on the second active layer.
Abstract:
In one embodiment, the LED package comprises: (a) a submount comprising a substrate, at least one electrical interface, and a non-conductive reflective material disposed over substantially all of submount except for the at least one electrical interface; and (b) an LED chip having sides and at least one contact, the LED chip being flip-chip mounted to the submount such that the at least one contact is electrically connected to the at least one electrical interface, the LED chip covering a substantial portion of the at least one electrical interface, substantially all of the chip extending above the reflective material.
Abstract:
본 발명은 희토류 금속 산화물 입자를 포함하는 적외선 LED 패키지에 관한 것으로서, 보다 상세히는, 적외선 LED 칩 및 고분자 수지 내에 하기 화학식 1로 표현되는 화합물을 포함하는 LED 봉지재를 구비하여 700~940 nm의 적외선 파장을 갖는 적외선 LED 패키지. [화학식 1] M a (OH) b (CO 3 ) c O d 여기서, M은 Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn, Mn, Bi 또는 Ac이고, a는 1 또는 2, b는 0 내지 2, c는 0 내지 3, d는 0 내지 3이다. 다만, b, c, 및 d는 동시에 0이 아니고, b 및 c는 동시에 0이거나, 동시에 0이 아니다.
Abstract:
Residual internal stress within optoelectronic devices such as light-emitting diodes and laser diodes is reduced to improve internal quantum efficiency and thereby increase light output.
Abstract:
A system and method for fabricating a perovskite film is provided, the system including a housing for use as a CVD furnace having first and second sections coupled with first and second temperature control units, respectively. The first and second sections correspond substantially to the upstream and downstream of gases, respectively. One or more substrates are loaded in the second section and controlled by the second temperature control unit, and an evaporation unit containing an organic halide material is loaded in the first section and controlled by the first temperature control unit. Each of the substrates is pre-deposited with a metal halide material. The inside of the housing is pumped down to a low pressure.