Abstract:
The present invention relates to combinations of materials and fabrication techniques which are useful in the fabrication of filled, metal-comprising gates for use in planar and 3D Field Effect Transistor (FET) structures. The FET structures described are of the kind needed for improved performance in semiconductor device structures produced at manufacturing nodes which implement semiconductor feature sizes in the 15nm range or lower.
Abstract:
Embodiments of the invention relate to component structures which are useful as apparatus in plasma processing chambers. Portions of the component structures are bonded together using oxyfluoride-comprising glazes, glass ceramics, and combinations thereof. The bonding material is resistant to halogen-containing plasmas and exhibits desirable mechanical properties.
Abstract:
We have developed a method and apparatus for cooling electromagnetic lens coils of the kind used in charged particle beams. The method and apparatus provide not only a symmetrical cooling effect around the optical axis of the charged particle beam, but also provide improved uniformity of heat transfer. This improved uniformity enables control over the optical axis of the charged particle beam within about 1 nm for high current charged particle beam columns, wherein the current ranges from about 100 nanoamps to about 1000 nanoamps. The use of a squat and wide electromagnetic lens coil in combination with an essentially flat modular cooling panel, which provides uniform cooling to the electromagnetic lens coil, not only enables control over the optical axis of the charged particle beam, but also provides mechanical stability for the charged particle beam column.
Abstract:
We have discovered that adding H 2 to a precursor gas composition including SiH 4 , NH 3 , and N 2 is effective at improving the wet etch rate and the wet etch rate uniformity across the substrate surface off a-SiN x :H films which are deposited on a substrate by PECVD. Wet etch rate is an indication of film density. Typically, the lower the wet etch rate, the denser the film. The addition of H 2 to the SiH 4 / NH 3 / N 2 precursor gas composition did not significantly increase the variation in deposited film thickness across the surface of the substrate. The a-SiN x :H films described herein are particularly useful as TFT gate dielectrics in the production of flat panel displays. The uniformity of the film across the substrate enables the production of flat panel displays having surface areas of 25,000 cm 2 and larger.
Abstract translation:我们已经发现,向包含SiH 4 N,NH 3和N 2的前体气体组合物中加入H 2 N 2, 在通过PECVD沉积在衬底上的衬底表面上改善湿蚀刻速率和湿蚀刻速率均匀性是有效的。 湿蚀刻速率是膜密度的指示。 通常,湿蚀刻速率越低,膜越致密。 向SiH 4 N 3 / NH 3 / N 2 N前体气体组合物中加入H 2 O没有显着增加 衬底表面沉积膜厚度的变化。 本文所述的a-SiN x X:H膜在制造平板显示器时特别适用于TFT栅极电介质。 跨过衬底的膜的均匀性使得能够生产具有25,000cm 2以上的表面积的平板显示器。
Abstract:
We have developed an improved vapor-phase deposition method and apparatus for the application of films / coatings on substrates. The method provides for the addition of a precise amount of each of the reactants to be consumed in a single reaction step of the coating formation process. In addition to the control over the amount of reactants added to the process chamber, the present invention requires precise control over the total pressure (which is less than atmospheric pressure) in the process chamber, the partial vapor pressure of each vaporous component present in the process chamber, the substrate temperature, and typically the temperature of a major processing surface within said process chamber. Control over this combination of variables determines a number of the characteristics of a film/coating or multi-layered film/coating formed using the method. By varying these process parameters, the roughness and the thickness of the films/coatings produced can be controlled.
Abstract:
A method of forming an interconnect structure for semiconductor or MEMS structures at a 10 nm Node (16 nm HPCD) down to 5 nm Node (7 nm HPCD), or lower, where the conductive contacts of the interconnect structure are fabricated using solely subtractive techniques applied to conformal layers of conductive materials.
Abstract:
Zori style fashion shoes which hold a decorative insert. The zori straps are tubular in nature, with a transparent upper surface. An opening between the right and left straps enables the insertion of a decorative insert. A one piece decorative insert extends into the right strap and the left strap. The wearer of the shoe can remove and replace an insert with another of a different design. A transparent hook like tongue may extend from one strap to another, to protect the insert from soiling. Optionally, the straps may have a springy section of material applied at the end near the arch section of the shoe.
Abstract:
The present invention relates to a shoe, including sandals, for men, women, and children, wherein the shoe includes a shoe display strip which traverses from an ankle strap of the shoe to a forefoot area of the shoe, along a centerline of a sole of the shoe, and wherein a top-facing surface of the shoe display strip includes a fashion design mounting base material which enables the attachment of at least one fashion design attachment. The fashion design attachment may be present in a pouch of showcase which is attached to the fashion design mounting base material, or may be attached directly to the fashion design mounting base material.
Abstract:
A method of fabricating a self-aligned buried bit line in a structure which makes up a portion of a vertical channel DRAM. The materials and processes used enable self- alignment of elements of the buried bit line during the fabrication process. In addition, the materials and processes used enable for formation of individual DRAM cells which have a buried bit line width which is 16 nm or less.
Abstract:
A beam exposure writing strategy method and system are disclosed for exposing a desired pattern on a substrate, by raster scanning a beam such as a particle beam, across a major field on the substrate. The beam is also vector scanned across a minor field of the substrate superimposed along the major field raster scan. The beam is selectively blanked and unblanked as the beam is being scanned. The unblanked flashes of the beam are modulated in coordination with the raster and vector scanning to expose the desired pattern on the substrate. The disclosed system and method generating an adjustable length microvector having a maximum range of at least about N time a nominal length λ, where N is equal to four and λ is substantially equal to a dimension of a nominal flash area, the nominal flash location dimension being substantially greater than a major field cell dimension.