METHOD OF MANUFACTURING A COBALT CONTAINING THIN FILM

    公开(公告)号:WO2019132113A1

    公开(公告)日:2019-07-04

    申请号:PCT/KR2018/002428

    申请日:2018-02-28

    Applicant: DNF CO., LTD.

    Abstract: The present invention relates to a method of manufacturing a cobalt containing thin film. According to the present invention, it is possible to provide a capping layer which is deposited on a metal wiring at a high deposition rate and planarized without deforming a shape of the cavity or a shape of the metal wiring due to a high aspect ratio in a highly integrated semiconductor device. Further, according to the present invention, it is possible to more improve the reliability of the metal wiring by providing a high-density, high-purity cobalt containing thin film by remarkably improving gap fill characteristics.

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