公开(公告)号：WO2011081696A3

公开(公告)日：2011-09-22

申请号：PCT/US2010052189

申请日：2010-10-11

Applicant: NAT SEMICONDUCTOR CORP ,  LEE SHAW WEI ,  LEE YEE KIM ,  NG EIN SUN ,  LEE LEE HAN MENG EUGENE ,  CHIN TING SOON PETER

Inventor： LEE SHAW WEI ,  LEE YEE KIM ,  NG EIN SUN ,  LEE LEE HAN MENG EUGENE ,  CHIN TING SOON PETER

IPC: H01L23/48 ,  H01L23/49 ,  H01L23/495

CPC classification number: H01L23/49582 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和封装方法，其改进将裸片向下焊接到裸片附接焊盘的焊线的可靠性。 在一个方面，引线框架（其可以呈面板形式）的顶表面的选定部分被电镀（例如，镀银）以促进引线键合。 电镀覆盖了芯片附着垫的一些但不是全部芯片附着表面。 在一些优选实施例中，管芯附接垫上的电镀布置为围绕管芯支撑表面的未镀制的中心区域的外围环。 在其他实施例中，模具连接垫上的镀层采用不完全覆盖模具支撑表面的条或其他几何图案的形式。 裸片支撑表面的未镀制的部分被粗糙化以改善裸片与裸片附着垫的粘附，由此减少裸片附着垫分层的可能性以及与羽绒键合的键合线相关联的相关风险。 所描述的引线框架可以用在各种封装中。 最常见的情况是，芯片附着于芯片附着焊盘的芯片支撑表面，并通过适当的引线键合与引线框架引线电连接。 裸片的接合焊盘（通常为接地焊盘（一个或多个））中的至少一个向下接合至裸片附接焊盘。 然后，模具，键合引线和引线框架的至少部分通常用塑料密封剂材料封装，同时使裸片附接垫的接触表面暴露以便于将裸片附着垫电耦合到外部装置。

公开(公告)号：WO2011049764A3

公开(公告)日：2011-11-17

申请号：PCT/US2010052061

申请日：2010-10-08

Applicant: NAT SEMICONDUCTOR CORP ,  LEE SHAW WEI ,  NG EIN SUN ,  LIU CHUE SIAK ,  LEE YEE KIM ,  LEE LEE HAN MENG EUGENE

Inventor： LEE SHAW WEI ,  NG EIN SUN ,  LIU CHUE SIAK ,  LEE YEE KIM ,  LEE LEE HAN MENG EUGENE

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2224/85181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和方法，这些布置和方法提高了管芯接地接合或其他外部接触的可靠性。 在一个方面，管芯上的选定接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 系杆连接到从连杆的粘合区域下沉的暴露的模具附连垫。 在一些实施例中，接合区域和引线在管芯和管芯附着垫之上处于基本相同的高度。 裸片，键合引线和引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附着焊盘的接触表面暴露，以便于将裸片附着焊盘电耦合到外部器件。

公开(公告)号：WO2011081696A2

公开(公告)日：2011-07-07

申请号：PCT/US2010/052189

申请日：2010-10-11

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Shaw Wei ,  LEE, Yee Kim ,  NG, Ein Sun ,  LEE, Lee Han Meng, @ Eugene ,  CHIN, Ting Soon, Peter

Inventor： LEE, Shaw Wei ,  LEE, Yee Kim ,  NG, Ein Sun ,  LEE, Lee Han Meng, @ Eugene ,  CHIN, Ting Soon, Peter

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/49

CPC classification number: H01L23/49582 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和封装方法，其提高将管芯下模焊接到管芯附接焊盘的接合线的可靠性。 在一个方面，引线框架（其可以是面板形式）的顶表面的选定部分被电镀（例如镀银），以便于引线接合。 电镀覆盖了芯片附着垫的一些但不是全部的芯片附着表面。 在一些优选实施例中，管芯附接垫上的镀层被布置为围绕模具支撑表面的未镀覆的中心区域的周边环。 在其他实施例中，管芯附接垫上的电镀采用不完全覆盖管芯支撑表面的棒或其它几何图案的形式。 模具支撑表面的未镀层的部分被粗糙化以改善模具与管芯附接垫的粘附，从而降低管芯附着垫分层的可能性以及与下焊接接合线的相关风险。 所描述的引线框架可以用于各种封装。 最常见的是，模具附接到管芯附接垫的管芯支撑表面，并且通过适当的引线接合电连接到引线框架引线。 管芯的接合焊盘（通常为接地焊盘）中的至少一个被下接合到管芯附接焊盘。 然后，模具，接合线和引线框架的至少一部分通常用塑料密封剂材料封装，同时使裸片附接垫的接触表面暴露以便于将管芯附接垫电耦合到外部设备。

公开(公告)号：WO2011049764A2

公开(公告)日：2011-04-28

申请号：PCT/US2010/052061

申请日：2010-10-08

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Shaw Wei ,  NG, Ein Sun ,  LIU, Chue Siak ,  LEE, Yee Kim ,  LEE, Lee Han Meng @ Eugene

Inventor： LEE, Shaw Wei ,  NG, Ein Sun ,  LIU, Chue Siak ,  LEE, Yee Kim ,  LEE, Lee Han Meng @ Eugene

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2224/85181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和方法，其提高了将管芯接地或其它外部触头的引线接合的可靠性。 在一个方面，模具上的选择的接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 连接杆连接到从连接杆的接合区域下降的暴露的管芯附接垫。 在一些实施例中，接合区域和引线在模具和管芯附接垫上方处于基本相同的高度。 管芯，接合线以及引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附接焊盘的接触表面暴露以便于将管芯附着垫电耦合到外部设备。