利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

22 条记录 (耗时 0.016 秒)

    STACKED PACKAGE WITH ELECTRICAL CONNECTIONS CREATED USING HIGH THROUGHPUT ADDITIVE MANUFACTURING
    1.
    发明申请
    STACKED PACKAGE WITH ELECTRICAL CONNECTIONS CREATED USING HIGH THROUGHPUT ADDITIVE MANUFACTURING 审中-公开

    公开(公告)号：WO2019066998A1

    公开(公告)日：2019-04-04

    申请号：PCT/US2017/054682

    申请日：2017-09-30

    申请人： INTEL CORPORATION ,  EID, Feras ,  SWAN, Johanna M. ,  LIFF, Shawna M.

    发明人： EID, Feras ,  SWAN, Johanna M. ,  LIFF, Shawna M.

    IPC分类号： H01L23/367 ,  H01L23/04 ,  H01L23/00 ,  H01L23/42 ,  H01L23/40

    摘要： A device package and a method of forming the device package are described. The device package includes one or more dies disposed on a first substrate. The device packages further includes one or more interconnects vertically disposed on the first substrate, and a mold layer disposed over and around the first die, the one or more interconnects, and the first substrate. The device package has a second die disposed on a second substrate, wherein the first substrate is electrically coupled to the second substrate with the one or more interconnects, and wherein the one or more interconnects are directly disposed on at least one of a top surface of the first substrate and a bottom surface of the second substrate without an adhesive layer. The device package may include one or more interconnects having one or more different thicknesses or heights at different locations on the first substrate.

    ACTIVE VENTING GARMENT USING PIEZOELECTRIC ELEMENTS
    2.
    发明申请
    ACTIVE VENTING GARMENT USING PIEZOELECTRIC ELEMENTS 审中-公开
    利用压电元件进行活性通气的服装

    公开(公告)号：WO2018009164A1

    公开(公告)日：2018-01-11

    申请号：PCT/US2016/040902

    申请日：2016-07-02

    申请人： INTEL CORPORATION ,  ALEKSOV, Aleksandar ,  OSTER, Sasha N. ,  EID, Feras ,  LIFF, Shawna M. ,  SOUNART, Thomas L. ,  SWAN, Johanna M. ,  BICEN, Baris ,  RAO, Valluri R.

    发明人： ALEKSOV, Aleksandar ,  OSTER, Sasha N. ,  EID, Feras ,  LIFF, Shawna M. ,  SOUNART, Thomas L. ,  SWAN, Johanna M. ,  BICEN, Baris ,  RAO, Valluri R.

    IPC分类号： A41D13/002 ,  A41D1/00 ,  A41D27/24

    摘要： Embodiments of the invention include an active venting system. According to an embodiment of the invention, the active venting system may include a substrate having one or more seams formed through the substrate. In order to open the vents defined by the seams through the substrate, a piezoelectric layer may be formed proximate to one or more of the seams. Additional embodiments may include a first electrode and a second electrode that contact the piezoelectric layer in order to provide a voltage differential across the piezoelectric layer. In an embodiment the active venting system may be integrated into a garment. In such an embodiment, the garment may also include an electronics module for controlling the actuators. Additionally, conductive traces may be printed on the garment or sewn into the garment to provide electrical connections from the electronics module to each of the piezoelectric actuators.

    摘要翻译： 本发明的实施例包括主动通气系统。 根据本发明的实施例，主动通气系统可以包括具有穿过基板形成的一个或多个接缝的基板。 为了打开由接缝限定的通过基板的通风口，可以在接近一个或多个接缝处形成压电层。 另外的实施例可以包括接触压电层的第一电极和第二电极，以便在压电层两端提供电压差。 在一个实施例中，主动通气系统可以被集成到服装中。 在这样的实施例中，服装还可以包括用于控制致动器的电子模块。 另外，导电迹线可以被印刷在衣服上或缝合到衣服中以提供从电子模块到每个压电致动器的电连接。

    THERMAL MANAGEMENT IN PACKAGED VCSELS
    3.
    发明申请
    THERMAL MANAGEMENT IN PACKAGED VCSELS 审中-公开
    包装VCSELS中的热管理

    公开(公告)号：WO2013074122A1

    公开(公告)日：2013-05-23

    申请号：PCT/US2011/061423

    申请日：2011-11-18

    申请人： INTEL CORPORATION ,  EID, Feras ,  LIFF, Shawna M. ,  BRAUNISCH, Henning

    发明人： EID, Feras ,  LIFF, Shawna M. ,  BRAUNISCH, Henning

    IPC分类号： H01S5/024 ,  H01S3/04 ,  H01S5/183

    CPC分类号： H01S5/02476 ,  H01S5/02236 ,  H01S5/183 ,  H01S5/423

    摘要： Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip.

    摘要翻译： 提供了垂直腔表面发射激光（VCSEL）芯片的热管理系统。 本发明的实施例提供了具有设置在衬底表面上并与衬底电互连的垂直腔表面发射激光器芯片的衬底，设置在衬底表面上并且靠近垂直腔表面发射激光器芯片的至少三个侧面的热框架， 以及设置在垂直腔表面发射激光芯片和热框架的至少三个侧面之间的热界面材料。 衬底还可以包括可操作地耦合到另一集成电路芯片并且能够驱动VCSEL芯片的收发器芯片。

    IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS
    4.
    发明申请
    IMPROVING MECHANICAL AND THERMAL RELIABILITY IN VARYING FORM FACTORS 审中-公开

    公开(公告)号：WO2018125209A1

    公开(公告)日：2018-07-05

    申请号：PCT/US2016/069497

    申请日：2016-12-30

    申请人： INTEL CORPORATION ,  STRONG, Veronica A ,  OSTER, Sasha N. ,  LIFF, Shawna M.

    发明人： STRONG, Veronica A ,  OSTER, Sasha N. ,  LIFF, Shawna M.

    IPC分类号： H01L23/482 ,  H01L23/488 ,  H01L23/00

    摘要： A system for packaging integrated circuits includes an integrated circuit having one or more integrated circuit terminals. The system for packaging integrated circuits also includes a substrate having one or more substrate terminals. The system for packaging integrated circuits further includes an electrically conductive adhesive in communication with the integrated circuit terminals and the substrate terminals. The electrically conductive adhesive establishes an electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals. The electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals are enclosed in a dielectric. The system for packaging integrated circuits includes a second adhesive in communication with the integrated circuit and the substrate, wherein the second adhesive couples the integrated circuit and substrate together.

    ALIGNMENT OF SINGLE AND MULTI-MODE OPTICAL FIBERS USING PIEZOELECTRIC ACTUATORS
    6.
    发明申请
    ALIGNMENT OF SINGLE AND MULTI-MODE OPTICAL FIBERS USING PIEZOELECTRIC ACTUATORS 审中-公开
    使用压电执行器来调整单模和多模光纤

    公开(公告)号：WO2018004696A1

    公开(公告)日：2018-01-04

    申请号：PCT/US2016/040871

    申请日：2016-07-01

    申请人： INTEL CORPORATION ,  SWAN, Johanna M. ,  ALEKSOV, Aleksandar ,  OSTER, Sasha N. ,  EID, Feras ,  BICEN, Baris ,  SOUNART, Thomas L. ,  LIFF, Shawna M. ,  RAO, Valluri R.

    发明人： SWAN, Johanna M. ,  ALEKSOV, Aleksandar ,  OSTER, Sasha N. ,  EID, Feras ,  BICEN, Baris ,  SOUNART, Thomas L. ,  LIFF, Shawna M. ,  RAO, Valluri R.

    IPC分类号： G02B6/26 ,  G02B6/35 ,  G02B6/36

    摘要： Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.

    摘要翻译： 本发明的实施例包括允许光纤原位对准的光电子封装。 在一个实施例中，光电子封装可以包括有机衬底。 实施例包括形成在有机衬底中的空腔。 另外，光电子封装可以包括在有机衬底上形成的致动器，其在腔体上延伸。 在一个实施例中，致动器可以包括第一电极，形成在第一电极上的压电层以及形成在压电层上的第二电极。 根据本发明的另外的实施例，致动器可以包括第一部分和第二部分。 为了允许由热膨胀驱动的电阻加热和致动，梁的第一部分的横截面积可以大于梁的第二部分的横截面积。