公开(公告)号：WO2007146775A3

公开(公告)日：2008-04-24

申请号：PCT/US2007070715

申请日：2007-06-08

Applicant: TEXAS INSTRUMENTS INC ,  HUDDLESTON WYATT ALLEN ,  O'CONNOR SHAWN M

Inventor： HUDDLESTON WYATT ALLEN ,  O'CONNOR SHAWN M

IPC: H01L25/00 ,  H01L23/48

CPC classification number: H01L24/97 ,  H01L24/16 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multi-chip semiconductor package (10) and methods of manufacture are disclosed. In described embodiments, a first semiconductor chip (14) is affixed to a package substrate (12) and a second semiconductor chip (16) is affixed to at least a portion of a surface of the first semiconductor chip, forming an overhang (22). Underpinning (28) is interposed for supporting the overhang in order to resist deflection during assembly.

Abstract translation: 公开了一种多芯片半导体封装（10）及其制造方法。 在所描述的实施例中，第一半导体芯片（14）固定到封装基板（12）上，并且第二半导体芯片（16）固定到第一半导体芯片的表面的至少一部分上，形成突出端（22） 。 插入支架（28）用于支撑突出端以防止组装过程中的偏转。

公开(公告)号：WO2007146775A2

公开(公告)日：2007-12-21

申请号：PCT/US2007/070715

申请日：2007-06-08

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  HUDDLESTON, Wyatt, Allen ,  O'CONNOR, Shawn, M.

Inventor： HUDDLESTON, Wyatt, Allen ,  O'CONNOR, Shawn, M.

IPC: H01L21/00

CPC classification number: H01L24/97 ,  H01L24/16 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multi-chip semiconductor package (10) and methods of manufacture are disclosed. In described embodiments, a first semiconductor chip (14) is affixed to a package substrate (12) and a second semiconductor chip (16) is affixed to at least a portion of a surface of the first semiconductor chip, forming an overhang (22). Underpinning (28) is interposed for supporting the overhang in order to resist deflection during assembly.

Abstract translation: 公开了一种多芯片半导体封装（10）及其制造方法。 在所描述的实施例中，第一半导体芯片（14）固定到封装基板（12）上，并且第二半导体芯片（16）固定到第一半导体芯片的表面的至少一部分上，形成突出端（22） 。 插入支架（28）用于支撑悬伸以防止组装过程中的偏转。