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    METHOD FOR PLACING COMPONENTS ON A CIRCUIT CARRIER
    1.
    发明申请
    METHOD FOR PLACING COMPONENTS ON A CIRCUIT CARRIER 审中-公开

    公开(公告)号：WO2005081610A3

    公开(公告)日：2005-09-01

    申请号：PCT/EP2005/050675

    申请日：2005-02-16

    Applicant: MARCONI COMMUNICATIONS GMBH ,  KONRATH, Willibald ,  SCHMELCHER, Haiko

    Inventor： KONRATH, Willibald ,  SCHMELCHER, Haiko

    IPC: H05K13/08

    Abstract: For placing circuit components on a circuit carrier: a) the location of a component (1) to be placed is determined; b) a manipulating device (6) for seizing the component (1) is placed at the determined location; C) the manipulating device (6) is operated for seizing the component (1); and d) it is verified using a camera (12) that the component (1) has been seized by the manipulating device (6), and e) the manipulating device is moved to the circuit carrier for placing the component.

    METHOD FOR MANUFACTURING A HIGH-FREQUENCY ASSEMBLY
    3.
    发明申请
    METHOD FOR MANUFACTURING A HIGH-FREQUENCY ASSEMBLY 审中-公开
    制造高频组件的方法

    公开(公告)号：WO2005032221A3

    公开(公告)日：2005-08-18

    申请号：PCT/EP2004052116

    申请日：2004-09-09

    Applicant: MARCONI COMM GMBH ,  KONRATH WILLIBALD ,  SCHMELCHER HAIKO

    Inventor： KONRATH WILLIBALD ,  SCHMELCHER HAIKO

    IPC: H05K13/02 ,  H05K13/04

    CPC classification number: H05K13/0469 ,  H05K13/08 ,  Y10T29/4913

    Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-­specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency- specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

    Abstract translation: 在高频组件的制造中，使用放置设备将多个部件（其中至少一个部件是频率特定的）相对于彼此放置并相互连接。 在频率特定组件（12,30）的样本中，寻找编码频率的特征（23,24）。 如果在样本中发现特征（23,24; 26）并且被判断为正确，则内置样本; 否则标本被拒绝。

    GLUING METHOD AND DEVICE
    4.
    发明申请
    GLUING METHOD AND DEVICE 审中-公开
    GLUING方法和装置

    公开(公告)号：WO2004098258A1

    公开(公告)日：2004-11-11

    申请号：PCT/EP2004/050672

    申请日：2004-04-30

    Applicant: MARCONI COMMUNICATIONS GMBH ,  KONRATH, Willibald ,  SCHOLL, Klaus ,  SCHMELCHER, Haiko ,  GORTZEN, Ralf ,  NAHRING, Martin ,  MULLER, Ulf

    Inventor： KONRATH, Willibald ,  SCHOLL, Klaus ,  SCHMELCHER, Haiko ,  GORTZEN, Ralf ,  NAHRING, Martin ,  MULLER, Ulf

    IPC: H05K13/04

    CPC classification number: H05K13/0469 ,  H05K3/305 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T156/1089

    Abstract: For gluing a circuit component (51) onto a circuit board (6), the circuit component (51) having a bottom area for bringing into contact with the circuit board with at least one edge (52, 53), the distance (d]) between the edge and a first line (56, 57) parallel to said edge and an amount of adhesive to be applied per length unit along said line (56, 57) are determined such that when placing the circuit component (51) on the circuit board (6) the adhesive advances to said edge (52, 53) but not to a second circuit component (54, 55) adjacent to said edge; the adhesive is applied ill the selected quantity along said first line (56, 57) and along further lilies (58) which are parallel to said first line and further away from said edge (52, 53); then the circuit component (51) is placed on the circuit board (6).

    Abstract translation: 为了将电路部件（51）胶合到电路板（6）上，电路部件（51）具有用于与电路板接触的底部区域，具有至少一个边缘（52,53），距离（d） ）和平行于所述边缘的第一线（56,57）之间，并且沿着所述线（56,57）每长度单元施加的粘合剂的量被确定为使得当将电路部件（51）放置在 电路板（6），粘合剂前进到所述边缘（52,53），但不延伸到与所述边缘相邻的第二电路部件（54,55）; 所述粘合剂沿着所述第一线（56,57）施加选定数量，并沿着与所述第一线平行并且远离所述边缘（52,53）的更多的百合（58）施加; 则将电路部件（51）放置在电路板（6）上。

    A PACKAGE FOR BEAMLEAD SEMICONDUCTOR DEVICES
    5.
    发明申请
    A PACKAGE FOR BEAMLEAD SEMICONDUCTOR DEVICES 审中-公开
    一种用于BEAMLEAD半导体器件的封装

    公开(公告)号：WO2006114406A1

    公开(公告)日：2006-11-02

    申请号：PCT/EP2006/061788

    申请日：2006-04-24

    Applicant: ERICSSON AB ,  KONRATH, Willibald ,  SCHMELCHER, Haiko

    Inventor： KONRATH, Willibald ,  SCHMELCHER, Haiko

    IPC: H01L21/673 ,  F15C5/00 ,  H01L23/043 ,  H01L27/146 ,  H01L33/00 ,  H01L31/0203

    CPC classification number: H05K13/0084 ,  H01L2221/68313

    Abstract: A package (200) for storing and providing supply of beamlead semiconductor devices (202, 204, 206) in a pick-and-place manufacturing process of Application Specific Integrated Circuits, ASICs, wherein the beamlead semiconductor devices (202, 204, 206) are picked directly from said package (200). The package (200) comprises a container part (302) and a lid part (304), said container part (302) comprising plurality of regularly displaced, substantially flat-bottom recesses and said lid part (304) being detachably attached to said container part (302). At least a top surface of said container part (302) is made of electric conductive material and said top surface (400) of said container part (302) is covered with a non-reflective coating and the lid part (304) is transparent in at least these areas, which are located above the recesses.

    Abstract translation: 一种用于在专用集成电路（ASIC）的拾取和制造工艺中存储并提供光束半导体器件（202,204,206）的封装（200），其中所述光束半导体器件（202,204,206） 被直接从所述包装（200）拾取。 包装（200）包括容器部分（302）和盖部分（304），所述容器部分（302）包括多个规则移位的基本上平底的凹部，所述盖部分（304）可拆卸地附接到所述容器 部分（302）。 所述容器部分（302）的至少顶表面由导电材料制成，并且所述容器部分（302）的所述顶表面（400）被非反射涂层覆盖，并且所述盖部分（304）在 至少这些区域位于凹槽之上。

    METHOD FOR PLACING COMPONENTS ON A CIRCUIT CARRIER
    6.
    发明申请
    METHOD FOR PLACING COMPONENTS ON A CIRCUIT CARRIER 审中-公开
    在电路载波上放置元件的方法

    公开(公告)号：WO2005081610A2

    公开(公告)日：2005-09-01

    申请号：PCT/EP2005050675

    申请日：2005-02-16

    Applicant: MARCONI COMM GMBH ,  KONRATH WILLIBALD ,  SCHMELCHER HAIKO

    Inventor： KONRATH WILLIBALD ,  SCHMELCHER HAIKO

    IPC: H05K13/04 ,  H05K13/08 ,  H05K13/00

    CPC classification number: H05K13/08 ,  H05K13/0413

    Abstract: For placing circuit components on a circuit carrier: a) the location of a component (1) to be placed is determined; b) a manipulating device (6) for seizing the component (1) is placed at the determined location; C) the manipulating device (6) is operated for seizing the component (1); and d) it is verified using a camera (12) that the component (1) has been seized by the manipulating device (6), and e) the manipulating device is moved to the circuit carrier for placing the component.

    Abstract translation: 为了将电路元件放置在电路载体上：a）确定要放置的元件（1）的位置; b）用于抓住部件（1）的操纵装置（6）被放置在确定的位置; C）操纵操纵装置（6）以操纵部件（1）; 以及d）使用照相机（12）验证部件（1）已被操纵装置（6）占用，并且e）操纵装置移动到用于放置部件的电路托架。

    METHOD FOR ASSEMBLING A CIRCUIT
    8.
    发明申请
    METHOD FOR ASSEMBLING A CIRCUIT 审中-公开
    组装电路的方法

    公开(公告)号：WO2004110126A1

    公开(公告)日：2004-12-16

    申请号：PCT/EP2004/051034

    申请日：2004-06-04

    Applicant: MARCONI COMMUNICATIONS GMBH ,  MULLER, Ulf ,  KONRATH, Willibald ,  SCHOLL, Klaus ,  SCHMELCHER, Haiko ,  GORTZEN, Ralf ,  NAHRING, Martin

    Inventor： MULLER, Ulf ,  KONRATH, Willibald ,  SCHOLL, Klaus ,  SCHMELCHER, Haiko ,  GORTZEN, Ralf ,  NAHRING, Martin

    IPC: H05K13/04

    CPC classification number: H05K13/0015 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133

    Abstract: In a procedure for automatically placing components (20 to 23) of a circuit on a base plate (6) based on predefined position data, a) the position of at least one first reference mark (24) formed at the base plate (6) is detected; b) a target position for placing a substrate (20) on the base plate (6) is calculated based on the detected position of the first reference mark (24) and the position data, and the substrate (20) is placed at the calculated position; C) the position of at least one second reference mark (26) formed at the substrate (20) is detected and d) a target position for placing a further component (21, 22) on the substrate (20) is calculated based on the detected position of the second reference mark (26) and the position data predefined for said component (21, 22), and the component (21, 22) is placed at the calculated target position.

    Abstract translation: 在基于预定义的位置数据自动将电路的组件（20至23）自动放置在基板（6）上的步骤中，a）形成在基板（6）处的至少一个第一参考标记（24）的位置， 被检测到 b）基于第一参考标记（24）的检测位置和位置数据计算用于将基板（20）放置在基板（6）上的目标位置，并且将基板（20）置于计算出的位置 位置; C）检测在衬底（20）上形成的至少一个第二参考标记（26）的位置，并且d）用于将另外的组件（21,22）放置在衬底（20）上的目标位置基于 检测到第二参考标记（26）的位置和为所述部件（21,22）预定义的位置数据，并且将部件（21,22）放置在计算的目标位置。

    METHOD FOR MANUFACTURING A HIGH-FREQUENCY ASSEMBLY
    10.
    发明申请
    METHOD FOR MANUFACTURING A HIGH-FREQUENCY ASSEMBLY 审中-公开
    制造高频组件的方法

    公开(公告)号：WO2005032221A2

    公开(公告)日：2005-04-07

    申请号：PCT/EP2004/052116

    申请日：2004-09-09

    Applicant: MARCONI COMMUNICATIONS GMBH ,  KONRATH, Willibald ,  SCHMELCHER, Haiko

    Inventor： KONRATH, Willibald ,  SCHMELCHER, Haiko

    IPC: H05K

    CPC classification number: H05K13/0469 ,  H05K13/08 ,  Y10T29/4913

    Abstract: In the manufacture of a high-frequency assembly, a plurality of components, at least one (12) of which is frequency-­specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency- specific component (12, 30) a feature (23, 24) which encodes the frequency is looked for. The specimen is built in if the feature (23, 24; 26) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

    Abstract translation: 在高频组件的制造中，使用放置装置相对于彼此放置其中至少一个（12）是频率特定的多个部件，并且互连。 在频率特定组件（12,30）的样本中，寻找编码频率的特征（23,24）。 如果在样本中发现特征（23,24; 26），并且判断为正确，则建立标本; 否则样品被拒绝。

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