公开(公告)号：WO2013010067A2

公开(公告)日：2013-01-17

申请号：PCT/US2012046640

申请日：2012-07-13

Applicant: 3M INNOVATIVE PROPERTIES CO ,  SEBASTIAN MUTHU ,  TAN FONG LIANG

Inventor： SEBASTIAN MUTHU ,  TAN FONG LIANG

IPC: H01L21/306

CPC classification number: C23F1/30 ,  C09K13/04 ,  G06F3/044

Abstract: A double ITO structure, containing sequential layers of indium tin oxide (ITO), silicon dioxide (SiO2) (which may include a dopant material) and ITO, is selectively protected by a patterned photo-resist mask. The sequential layers are etched together in a single etching step using an etchant composition which is an acidic solution containing a transition metal chloride and hydrochloric acid (HCl). Thus, the double ITO structure is etched using a substantially fluoride-free etchant composition.

Abstract translation: 包含铟锡氧化物（ITO），二氧化硅（SiO 2）（其可以包括掺杂剂材料）和ITO的顺序层的双ITO结构被图案化的光刻胶掩模选择性地保护。 使用蚀刻剂组合物在单个蚀刻步骤中将顺序层蚀刻在一起，该蚀刻剂组合物是含有过渡金属氯化物和盐酸（HCl）的酸性溶液。 因此，使用基本上不含氟化物的蚀刻剂组合物来蚀刻双ITO结构。

公开(公告)号：WO2012112873A3

公开(公告)日：2012-12-27

申请号：PCT/US2012025613

申请日：2012-02-17

Applicant: 3M INNOVATIVE PROPERTIES CO ,  PALANISWAMY RAVI ,  JESUDOSS AROKIARAJ ,  NARAG ALEJANDRO ALDRIN AGCAOILI II ,  FOO SIANG SIN ,  TAN FONG LIANG ,  PEE WEI MENG ,  OUDERKIRK ANDREW J ,  MOONEY JUSTINE A

Inventor： PALANISWAMY RAVI ,  JESUDOSS AROKIARAJ ,  NARAG ALEJANDRO ALDRIN AGCAOILI II ,  FOO SIANG SIN ,  TAN FONG LIANG ,  PEE WEI MENG ,  OUDERKIRK ANDREW J ,  MOONEY JUSTINE A

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L23/4985 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/49872 ,  H01L24/17 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/10106

Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.

Abstract translation: 柔性聚合物介电层具有第一和第二主表面。 第一主表面上具有导电层。 介电层具有至少一个从第二主表面延伸到第一主表面的通孔。 导电层包括电分离的第一和第二部分，其被配置为支撑发光半导体器件并将其电连接到导电层。

公开(公告)号：WO2012061183A2

公开(公告)日：2012-05-10

申请号：PCT/US2011/057977

申请日：2011-10-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PALANISWAMY, Ravi, ,  JESUDOSS, Arokiaraj, ,  NARAG, Alejandro Aldrin II Agcaoili ,  WHITE, James R., ,  TAN, Fong Liang, ,  OUDERKIRK, Andrew J., ,  MOONEY, Justine A., ,  KREUTTER, Nathan P., ,  NIE, Qihong, ,  GAO, Jian Xia,

Inventor： PALANISWAMY, Ravi, ,  JESUDOSS, Arokiaraj, ,  NARAG, Alejandro Aldrin II Agcaoili ,  WHITE, James R., ,  TAN, Fong Liang, ,  OUDERKIRK, Andrew J., ,  MOONEY, Justine A., ,  KREUTTER, Nathan P., ,  NIE, Qihong, ,  GAO, Jian Xia,

IPC: H05K1/18

CPC classification number: H05K1/0206 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/189 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces and at least one via extending through the dielectric layer from the first to the second major surface, with a conductive layer on each of the first and second major surfaces and in the via. The conductive layer in the via supports a light emitting semiconductor device and is electrically isolated from the conductive layer on the first major surface of the dielectric layer.

Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有第一和第二主表面的柔性介电层和至少一个从第一主表面延伸穿过介电层的通孔，导电层 在第一和第二主表面和通孔中的每一个上。 通孔中的导电层支撑发光半导体器件，并且与电介质层的第一主表面上的导电层电隔离。

公开(公告)号：WO2012061182A1

公开(公告)日：2012-05-10

申请号：PCT/US2011/057975

申请日：2011-10-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PALANISWAMY, Ravi, ,  JESUDOSS, Arokiaraj, ,  NARAG, Alejandro Aldrin II Agcaoili ,  FOO, Saing Sin ,  TAN, Fong Liang, ,  OUDERKIRK, Andrew J., ,  MOONEY, Justine A.,

Inventor： PALANISWAMY, Ravi, ,  JESUDOSS, Arokiaraj, ,  NARAG, Alejandro Aldrin II Agcaoili ,  FOO, Saing Sin ,  TAN, Fong Liang, ,  OUDERKIRK, Andrew J., ,  MOONEY, Justine A.,

IPC: H05K1/18

CPC classification number: H01L33/647 ,  H01L24/17 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物介电层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。

公开(公告)号：WO2012061184A1

公开(公告)日：2012-05-10

申请号：PCT/US2011/057980

申请日：2011-10-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PALANISWAMY, Ravi ,  JESUDOSS, Arokiaraj ,  NARAG, Alejandro Aldrin II Agcaoili ,  WHITE, James R. ,  TAN, Fong Liang ,  OUDERKIRK, Andrew J. ,  MOONEY, Justine A. ,  KREUTTER, Nathan P. ,  NIE, Qihong ,  GAO, Jian Xia

Inventor： PALANISWAMY, Ravi ,  JESUDOSS, Arokiaraj ,  NARAG, Alejandro Aldrin II Agcaoili ,  WHITE, James R. ,  TAN, Fong Liang ,  OUDERKIRK, Andrew J. ,  MOONEY, Justine A. ,  KREUTTER, Nathan P. ,  NIE, Qihong ,  GAO, Jian Xia

IPC: H05K1/18

CPC classification number: H01S5/024 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有在第一主表面上具有导电层的第一和第二主表面的柔性介电层以及具有导电层的第一主表面中的至少一个空腔 在支撑发光半导体器件的腔中。 空腔中的导电层与电介质层的第二主表面电隔离。

公开(公告)号：WO2013010067A3

公开(公告)日：2013-01-17

申请号：PCT/US2012/046640

申请日：2012-07-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  SEBASTIAN, Muthu ,  TAN, Fong, Liang

Inventor： SEBASTIAN, Muthu ,  TAN, Fong, Liang

IPC: H01L21/306

Abstract: A double ITO structure, containing sequential layers of indium tin oxide (ITO), silicon dioxide (SiO 2 ) (which may include a dopant material) and ITO, is selectively protected by a patterned photo-resist mask. The sequential layers are etched together in a single etching step using an etchant composition which is an acidic solution containing a transition metal chloride and hydrochloric acid (HCl). Thus, the double ITO structure is etched using a substantially fluoride-free etchant composition.

公开(公告)号：WO2012112873A2

公开(公告)日：2012-08-23

申请号：PCT/US2012/025613

申请日：2012-02-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PALANISWAMY, Ravi ,  JESUDOSS, Arokiaraj ,  NARAG, Alejandro, Aldrin, Agcaoili, II ,  FOO, Siang Sin ,  TAN, Fong Liang ,  PEE, Wei Meng ,  OUDERKIRK, Andrew J. ,  MOONEY, Justine A.

Inventor： PALANISWAMY, Ravi ,  JESUDOSS, Arokiaraj ,  NARAG, Alejandro, Aldrin, Agcaoili, II ,  FOO, Siang Sin ,  TAN, Fong Liang ,  PEE, Wei Meng ,  OUDERKIRK, Andrew J. ,  MOONEY, Justine A.

CPC classification number: H01L23/4985 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/49872 ,  H01L24/17 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/189 ,  H05K2201/10106

Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.

Abstract translation: 柔性聚合物介电层具有第一和第二主表面。 第一主表面上具有导电层。 电介质层具有从第二主表面延伸到第一主表面的至少一个通孔。 导电层包括电分离的第一和第二部分，其被配置为将发光半导体器件支撑并电连接到导电层。

公开(公告)号：WO2012023902A1

公开(公告)日：2012-02-23

申请号：PCT/SG2010/000303

申请日：2010-08-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  PALANISWAMY, Ravi ,  TAN, Fong, Liang

Inventor： PALANISWAMY, Ravi ,  TAN, Fong, Liang

IPC: H05K3/10 ,  H01L23/48 ,  H05K3/46

CPC classification number: H05K3/108 ,  H05K1/0393 ,  H05K3/281

Abstract: A structure comprising a flexible dielectric film supporting on at least one side a thermoplastic polyimide layer, and on it a conductive layer, is treated by an "semi- additive" process. The "semi-additive" process comprises forming a patterned photo¬ resist layer, filling gaps in the photo-resist layer with conductive material, removing the photo-resist and exposed portions of the laminated conductive layer, and covering the structure with a coverlay. The inventors have realized that the process of laminating the copper layer onto the thermoplastic polyimide layer roughens the surface of the thermoplastic polyimide layer, thus anchoring the copper layer to the polyimide, which means that when the conductive material is deposited into the gaps in the photo-resist, conductive bodies are formed which are strongly anchored to the thermoplastic polyimide layer, and which can be used as electrodes of a flexible circuit.

Abstract translation: 包括在至少一个侧面上支撑热塑性聚酰亚胺层的柔性电介质薄膜及其上的导电层的结构通过“半添加剂”方法进行处理。 “半添加”工艺包括形成图案化的光致抗蚀剂层，用导电材料填充光刻胶层中的间隙，去除光刻胶和层压导电层的暴露部分，并用覆盖物覆盖结构。 发明人已经认识到，将铜层层压到热塑性聚酰亚胺层上的过程使热塑性聚酰亚胺层的表面粗糙化，从而将铜层锚定到聚酰亚胺上，这意味着当导电材料沉积到照片中的间隙中时 形成能够牢固地固定在热塑性聚酰亚胺层上的导电体，可以作为柔性电路的电极使用。

公开(公告)号：WO2012061183A3

公开(公告)日：2012-08-16

申请号：PCT/US2011057977

申请日：2011-10-27

Applicant: 3M INNOVATIVE PROPERTIES CO ,  PALANISWAMY RAVI ,  JESUDOSS AROKIARAJ ,  NARAG ALEJANDRO ALDRIN II AGCAOILI ,  WHITE JAMES R ,  TAN FONG LIANG ,  OUDERKIRK ANDREW J ,  MOONEY JUSTINE A ,  KREUTTER NATHAN P ,  NIE QIHONG ,  GAO JIAN XIA

Inventor： PALANISWAMY RAVI ,  JESUDOSS AROKIARAJ ,  NARAG ALEJANDRO ALDRIN II AGCAOILI ,  WHITE JAMES R ,  TAN FONG LIANG ,  OUDERKIRK ANDREW J ,  MOONEY JUSTINE A ,  KREUTTER NATHAN P ,  NIE QIHONG ,  GAO JIAN XIA

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/0206 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/189 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.

Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件（26），其包括具有第一和第二主表面的柔性介电层（12）和至少一个通孔（10），该通孔（10）从第一至第 所述第二主表面在所述第一和第二主表面中的每个表面上以及所述通孔中具有导电层（19,20,18）。 通孔中的导电层（18）支撑发光半导体器件（26），并且与电介质层的第一主表面上的导电层（19）电隔离。