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公开(公告)号：WO2013025402A2
公开(公告)日：2013-02-21
申请号：PCT/US2012/049889
申请日：2012-08-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , PALANISWAMY, Ravi, , NARAG, Alejandro Aldrin II Agcaoili , GAO, Jian Xia , MOONEY, Justine A.,
Inventor： PALANISWAMY, Ravi, , NARAG, Alejandro Aldrin II Agcaoili , GAO, Jian Xia , MOONEY, Justine A.,
CPC classification number: H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
Abstract translation: 提供了一种发光半导体器件，该发光半导体器件包括柔性电介质层，电介质层的至少一侧上的导电层，电介质衬底中的至少一个空腔或通孔，以及发光半导体 由空腔或通孔支撑。 还提供了一种支撑制品，其包括柔性介电层，在至少一侧上的导电层以及在介电基板中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着到上述支撑制品上的上述发光半导体器件。
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2.发明申请FLEXIBLE LIGHT EMITTING SEMICONDUCTOR DEVICE HAVING THIN DIELECTRIC SUBSTRATE 审中-公开具有薄介电基板的柔性发光半导体器件
公开(公告)号：WO2012112310A1
公开(公告)日：2012-08-23
申请号：PCT/US2012/023572
申请日：2012-02-02
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , PALANISWAMY, Ravi, , JESUDOSS, Arokiaraj, , OUDERKIRK, Andrew J., , MOONEY, Justine A.,
IPC: H01L33/64 , H05K1/18 , H01L25/075
CPC classification number: H01L33/642 , H01L25/0753 , H01L33/641 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H05K1/0209 , H05K1/189 , H05K2201/062 , H05K2201/09045 , H05K2201/10106 , H01L2924/00 , H01L2924/00014
Abstract: Provided is a flexible light emitting semiconductor device that includes a thin flexible dielectric substrate having first and second major surfaces with a conductive layer on the first and second major surfaces.
Abstract translation: 提供了一种柔性发光半导体器件，其包括具有在第一和第二主表面上具有导电层的第一和第二主表面的薄柔性电介质基片。
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公开(公告)号：WO2012061183A3
公开(公告)日：2012-08-16
申请号：PCT/US2011057977
申请日：2011-10-27
Applicant: 3M INNOVATIVE PROPERTIES CO , PALANISWAMY RAVI , JESUDOSS AROKIARAJ , NARAG ALEJANDRO ALDRIN II AGCAOILI , WHITE JAMES R , TAN FONG LIANG , OUDERKIRK ANDREW J , MOONEY JUSTINE A , KREUTTER NATHAN P , NIE QIHONG , GAO JIAN XIA
Inventor： PALANISWAMY RAVI , JESUDOSS AROKIARAJ , NARAG ALEJANDRO ALDRIN II AGCAOILI , WHITE JAMES R , TAN FONG LIANG , OUDERKIRK ANDREW J , MOONEY JUSTINE A , KREUTTER NATHAN P , NIE QIHONG , GAO JIAN XIA
CPC classification number: H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: Provided is a flexible light emitting semiconductor device (26), such as an LED device, that includes a flexible dielectric layer (12) having first and second major surfaces and at least one via (10) extending through the dielectric layer from the first to the second major surface, with a conductive layer (19, 20, 18) on each of the first and second major surfaces and in the via. The conductive layer (18) in the via supports a light emitting semiconductor device (26) and is electrically isolated from the conductive layer (19) on the first major surface of the dielectric layer.
Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件（26），其包括具有第一和第二主表面的柔性介电层（12）和至少一个通孔（10），该通孔（10）从第一至第 所述第二主表面在所述第一和第二主表面中的每个表面上以及所述通孔中具有导电层（19,20,18）。 通孔中的导电层（18）支撑发光半导体器件（26），并且与电介质层的第一主表面上的导电层（19）电隔离。
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公开(公告)号：WO2012061184A1
公开(公告)日：2012-05-10
申请号：PCT/US2011/057980
申请日：2011-10-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , PALANISWAMY, Ravi , JESUDOSS, Arokiaraj , NARAG, Alejandro Aldrin II Agcaoili , WHITE, James R. , TAN, Fong Liang , OUDERKIRK, Andrew J. , MOONEY, Justine A. , KREUTTER, Nathan P. , NIE, Qihong , GAO, Jian Xia
Inventor： PALANISWAMY, Ravi , JESUDOSS, Arokiaraj , NARAG, Alejandro Aldrin II Agcaoili , WHITE, James R. , TAN, Fong Liang , OUDERKIRK, Andrew J. , MOONEY, Justine A. , KREUTTER, Nathan P. , NIE, Qihong , GAO, Jian Xia
IPC: H05K1/18
CPC classification number: H01S5/024 , H01L24/32 , H01L33/486 , H01L33/64 , H01L33/647 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/183 , H05K1/189 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.
Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有在第一主表面上具有导电层的第一和第二主表面的柔性介电层以及具有导电层的第一主表面中的至少一个空腔 在支撑发光半导体器件的腔中。 空腔中的导电层与电介质层的第二主表面电隔离。
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5.发明申请FLEXIBLE LIGHT EMITTING SEMICONDUCTOR DEVICE HAVING A THREE DIMENSIONAL STRUCTURE 审中-公开具有三维结构的柔性发光半导体器件
公开(公告)号：WO2013078180A1
公开(公告)日：2013-05-30
申请号：PCT/US2012/066020
申请日：2012-11-20
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , NARAG, Alejandro Aldrin II Agcaoili , PALANISWAMY, Ravi , JESUDOSS, Arokiaraj , MOONEY, Justine A.
Inventor： NARAG, Alejandro Aldrin II Agcaoili , PALANISWAMY, Ravi , JESUDOSS, Arokiaraj , MOONEY, Justine A.
CPC classification number: F21V21/14 , F21K9/00 , F21K9/232 , F21V3/00 , F21V29/70 , F21W2107/00 , F21W2121/00 , F21Y2101/00 , F21Y2107/00 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H05K1/028 , H05K1/189 , H05K2201/047 , H05K2201/053 , H05K2201/09063 , H05K2201/10106 , H01L2924/00
Abstract: Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.
Abstract translation: 提供了一种包括柔性电路的制品，其包括具有第一和第二主表面的聚合物电介质层，第一和第二主表面中的一个或两个在其上具有导电层，其中至少一个导电层包括电路， 或更多个位于柔性电路上的发光半导体器件，其中柔性电路成形为形成三维结构。
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Patent Agency Ranking
公开(公告)号：WO2013025402A3
公开(公告)日：2013-05-16
申请号：PCT/US2012049889
申请日：2012-08-08
Applicant: 3M INNOVATIVE PROPERTIES CO , PALANISWAMY RAVI , NARAG ALEJANDRO ALDRIN II AGCAOILI , GAO JIAN XIA , MOONEY JUSTINE A
CPC classification number: H01L33/62 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L33/486 , H01L33/64 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02236 , H01S5/02276 , H01S5/02469 , H01L2924/00
Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.
Abstract translation: 提供了一种发光半导体器件，其包括柔性介电层，介电层的至少一侧上的导电层，电介质基板中的至少一个空腔或通孔，以及由空腔或通孔支撑的发光半导体。 还提供了一种支撑制品，其包括柔性电介质层，至少一侧上的导电层和电介质基底中的至少一个空腔或通孔。 还提供了一种柔性发光半导体器件系统，其包括附着在上述支撑制品上的上述发光半导体器件。
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公开(公告)号：WO2012112873A3
公开(公告)日：2012-12-27
申请号：PCT/US2012025613
申请日：2012-02-17
Applicant: 3M INNOVATIVE PROPERTIES CO , PALANISWAMY RAVI , JESUDOSS AROKIARAJ , NARAG ALEJANDRO ALDRIN AGCAOILI II , FOO SIANG SIN , TAN FONG LIANG , PEE WEI MENG , OUDERKIRK ANDREW J , MOONEY JUSTINE A
Inventor： PALANISWAMY RAVI , JESUDOSS AROKIARAJ , NARAG ALEJANDRO ALDRIN AGCAOILI II , FOO SIANG SIN , TAN FONG LIANG , PEE WEI MENG , OUDERKIRK ANDREW J , MOONEY JUSTINE A
CPC classification number: H01L23/4985 , H01L23/498 , H01L23/49838 , H01L23/49872 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/00 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/112 , H05K1/189 , H05K2201/10106
Abstract: A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer.
Abstract translation: 柔性聚合物介电层具有第一和第二主表面。 第一主表面上具有导电层。 介电层具有至少一个从第二主表面延伸到第一主表面的通孔。 导电层包括电分离的第一和第二部分，其被配置为支撑发光半导体器件并将其电连接到导电层。
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公开(公告)号：WO2012112666A2
公开(公告)日：2012-08-23
申请号：PCT/US2012/025214
申请日：2012-02-15
Applicant: 3M INNOVATE PROPERTIES COMPANY , WATSON, Philip, E. , POON, Yarn Chee , PALANISWAMY, Ravi , AROKIARAJ, Jesudoss , NARAG, Alejandro, Aldrin, Agcaoili, II , TAN, Kim Leong , OUDERKIRK, Andrew, J. , PARKER, Douglas, S. , MOONEY, Justine, A.
Inventor： WATSON, Philip, E. , POON, Yarn Chee , PALANISWAMY, Ravi , AROKIARAJ, Jesudoss , NARAG, Alejandro, Aldrin, Agcaoili, II , TAN, Kim Leong , OUDERKIRK, Andrew, J. , PARKER, Douglas, S. , MOONEY, Justine, A.
CPC classification number: H01L25/0753 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting semiconductor device that includes a substrate having a first area having a first height and a second area having a second height different from the first height, wherein the first area supports at least a first light emitting semiconductor (LES) and the second area supports at least a second light emitting semiconductor (LES).
Abstract translation: 提供一种发光半导体器件，其包括具有第一区域和第二区域的衬底，所述第一区域具有第一高度，所述第二区域具有不同于所述第一高度的第二高度，其中所述第一区域支撑至少第一区域 发光半导体（LES），并且第二区域支撑至少第二发光半导体（LES）。
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公开(公告)号：WO2012061183A2
公开(公告)日：2012-05-10
申请号：PCT/US2011/057977
申请日：2011-10-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , PALANISWAMY, Ravi, , JESUDOSS, Arokiaraj, , NARAG, Alejandro Aldrin II Agcaoili , WHITE, James R., , TAN, Fong Liang, , OUDERKIRK, Andrew J., , MOONEY, Justine A., , KREUTTER, Nathan P., , NIE, Qihong, , GAO, Jian Xia,
Inventor： PALANISWAMY, Ravi, , JESUDOSS, Arokiaraj, , NARAG, Alejandro Aldrin II Agcaoili , WHITE, James R., , TAN, Fong Liang, , OUDERKIRK, Andrew J., , MOONEY, Justine A., , KREUTTER, Nathan P., , NIE, Qihong, , GAO, Jian Xia,
IPC: H05K1/18
CPC classification number: H05K1/0206 , H01L24/32 , H01L33/486 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/021 , H05K1/189 , H05K2201/09827 , H05K2201/09845 , H05K2201/10106 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces and at least one via extending through the dielectric layer from the first to the second major surface, with a conductive layer on each of the first and second major surfaces and in the via. The conductive layer in the via supports a light emitting semiconductor device and is electrically isolated from the conductive layer on the first major surface of the dielectric layer.
Abstract translation: 提供了一种诸如LED器件的柔性发光半导体器件，其包括具有第一和第二主表面的柔性介电层和至少一个从第一主表面延伸穿过介电层的通孔，导电层 在第一和第二主表面和通孔中的每一个上。 通孔中的导电层支撑发光半导体器件，并且与电介质层的第一主表面上的导电层电隔离。
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公开(公告)号：WO2012061182A1
公开(公告)日：2012-05-10
申请号：PCT/US2011/057975
申请日：2011-10-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY , PALANISWAMY, Ravi, , JESUDOSS, Arokiaraj, , NARAG, Alejandro Aldrin II Agcaoili , FOO, Saing Sin , TAN, Fong Liang, , OUDERKIRK, Andrew J., , MOONEY, Justine A.,
Inventor： PALANISWAMY, Ravi, , JESUDOSS, Arokiaraj, , NARAG, Alejandro Aldrin II Agcaoili , FOO, Saing Sin , TAN, Fong Liang, , OUDERKIRK, Andrew J., , MOONEY, Justine A.,
IPC: H05K1/18
CPC classification number: H01L33/647 , H01L24/17 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/07802 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K1/0203 , H05K1/0277 , H05K1/183 , H05K1/189 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.
Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物介电层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。
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