公开(公告)号：WO2010066366A1

公开(公告)日：2010-06-17

申请号：PCT/EP2009/008558

申请日：2009-12-01

Applicant: MUEHLBAUER AG ,  MUELLER, Michael, Max ,  ZABEL, Helfried ,  MONSER, Hans-Peter

Inventor： MUELLER, Michael, Max ,  ZABEL, Helfried ,  MONSER, Hans-Peter

IPC: H01L21/60 ,  G06K19/077 ,  H01L21/98

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/90 ,  H01L25/50 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2224/83002 ,  H01L2224/83051 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01065 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53265 ,  Y10T29/53539 ,  Y10T156/10 ,  Y10T156/1744 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of producing an electronic module with at least one electronic component and one carrier has the following steps: a structure is provided on the carrier, the structure being suitable for aligning an electronic component on it, so that the electronic component can take a desired target position relative to the structure, the structure is coated with a material to form a liquid meniscus, the liquid meniscus being suitable for receiving the electronic component at least partially, a stock of multiple electronic components is provided at a delivery point for the electronic components, the carrier, with the structure, is moved at least to nearby opposite the delivery point, the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving past near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus, and takes its target position.

Abstract translation: 制造具有至少一个电子部件和一个载体的电子模块的方法具有以下步骤：在载体上提供结构，该结构适于对准其上的电子部件，使得电子部件可以获得期望的 目标位置相对于结构，结构被涂覆有材料以形成液体弯液面，液体弯液面适于至少部分地接收电子部件，在电子部件的传送点处提供多个电子部件的原料 具有该结构的载体至少移动到相对于传送点的附近，传送点传送电子部件中的一个而不接触，而载体上的结构正在靠近传送点移动，使得在相位 电子部件至少部分地接触材料的自由运动，并且具有结构的载体被移动到下部 电子处理点，而电子元件自身与液体半月板上的结构对准，并取得其目标位置。