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    POWER OVER ETHERNET CONTROLLER INTEGRATED CIRCUIT ARCHITECTURE
    1.
    发明申请
    POWER OVER ETHERNET CONTROLLER INTEGRATED CIRCUIT ARCHITECTURE 审中-公开

    公开(公告)号：WO2007084496A3

    公开(公告)日：2007-07-26

    申请号：PCT/US2007/001119

    申请日：2007-01-17

    Applicant: BROADCOM CORPORATION ,  VORENKAMP, Pieter ,  WOO, Agnes ,  TAMMINEEDI, Anil ,  FUJIMORI, Ichiro ,  CHIN, David ,  PERZOW, John

    Inventor： VORENKAMP, Pieter ,  WOO, Agnes ,  TAMMINEEDI, Anil ,  FUJIMORI, Ichiro ,  CHIN, David ,  PERZOW, John

    IPC: H04L12/10

    Abstract: Power over Ethernet (PoE) communication systems provide power and data communications over the same communications link, where a power source device (PSE) provides DC power (for example, 48 volts DC) to a powered device (PD). The DC power is transmitted simultaneously over the same communications medium with the high speed data from one node to the other node. The PSE typically includes a controller that controls the DC power provided to the PD at the second node of the communications link. The PSE controller measures the voltage, current, and temperature of the outgoing and incoming DC supply lines to characterize the power requirements of the PD. In addition, the PSE controller may detect and validate a compatible PD, determine a power classification signature for the validated PD, supply power to the PD, monitor the power, and reduce or remove the power from the PD when the power is no longer requested or required. During detection, if the PSE finds the PD to be non-compatible, the PSE can prevent the application of power to that PD device, protecting the PD from possible damage.

    METHOD OF TREATING EXCESSIVE COLLAGEN FORMATION
    3.
    发明申请
    METHOD OF TREATING EXCESSIVE COLLAGEN FORMATION 审中-公开
    治疗过度胶原蛋白形成的方法

    公开(公告)号：WO2012155212A1

    公开(公告)日：2012-11-22

    申请号：PCT/AU2012/000554

    申请日：2012-05-18

    Applicant: CHIN, David

    Inventor： CHIN, David

    IPC: A61K38/49 ,  A61P19/04

    CPC classification number: A61K38/49

    Abstract: A treatment for fibromatosis is provided and, particularly, a treatment for palmar and/or plantar fascial fibromatosis is provided. The administration of a plasminogen activator locally to the affected tissue has been found to greatly improve the range of motion to the affected region, to reduce the appearance of the formed cords and nodules and to facilitate easier removal of these structures, if required.

    Abstract translation: 提供了纤维瘤病的治疗，特别是提供了用于手掌和/或足底筋膜纤维瘤病的治疗。 已经发现将纤溶酶原激活剂局部施用于受影响的组织，以大大改善对受影响区域的运动范围，以减少形成的线和结节的外观，并且如果需要，便于去除这些结构。

    THIN FOIL SEMICONDUCTOR PACKAGE
    4.
    发明申请
    THIN FOIL SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：WO2010021776A9

    公开(公告)日：2010-02-25

    申请号：PCT/US2009/046000

    申请日：2009-06-02

    Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  BAYAN, Jaime, A. ,  TU, Nghia, Thuc ,  WONG, Will, Kiang ,  CHIN, David

    Inventor： BAYAN, Jaime, A. ,  TU, Nghia, Thuc ,  WONG, Will, Kiang ,  CHIN, David

    IPC: H01L23/48 ,  H01L21/60

    Abstract: The present invention relates to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One such arrangement involves a foil carrier structure, which includes a foil adhered to a carrier having cavities. Some methods of the present invention involve attaching dice to the foil and encapsulating the foil carrier structure in a molding material. In one embodiment, the molding material presses against the foil, which causes portions of the foil to distend into the cavities of the carrier. As a result, recessed and raised areas are formed in the foil. Afterwards, the carrier is removed and portions of the raised areas in the foil are removed through one of a variety of techniques, such as grinding. This process helps define and electrical isolate contact pads in the foil. The resulting molded foil structure may then be singulated into multiple semiconductor packages.

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