公开(公告)号：WO2012106141A1

公开(公告)日：2012-08-09

申请号：PCT/US2012/022305

申请日：2012-01-24

Applicant: CREE, INC. ,  LOWES, Theodore, D. ,  TARSA, Eric, J. ,  KELLER, Bernd, P. ,  EMERSON, David, T.

Inventor： LOWES, Theodore, D. ,  TARSA, Eric, J. ,  KELLER, Bernd, P. ,  EMERSON, David, T.

IPC: G09F9/33

CPC classification number: G09F9/33 ,  G09F9/3026 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An LED component (400) includes, according to a first embodiment, a monolithic substrate (405), an array of LED chips (415) disposed on a surface of the substrate, and an optical lens (420) overlying the LED chips (415) and having a lens base (420a) attached to the substrate, where the LED chips (415) are positioned to provide a peak emission shifted from a perpendicular centerline of the lens base (420a). The LED component includes, according to a second embodiment, a monolithic substrate, an array of LED chips disposed on a surface of the substrate, and an array of optical lenses, each optical lens overlying at least one of the LED chips and having a lens base attached to the substrate, where at least one of the LED chips is positioned to provide a peak emission shifted from a perpendicular centerline of the respective lens base.

Abstract translation: 根据第一实施例，LED组件（400）包括单片基板（405），设置在基板的表面上的LED芯片阵列（415）和覆盖LED芯片（415）的光学透镜（420） ），并且具有附接到所述基板的透镜基座（420a），其中所述LED芯片（415）被定位以提供从所述透镜基座（420a）的垂直中心线偏移的峰值发射。 根据第二实施例，LED组件包括单片基板，设置在基板的表面上的LED芯片阵列和光学透镜阵列，每个光学透镜覆盖至少一个LED芯片并具有透镜 基底，其中至少一个LED芯片被定位成提供从相应透镜基底的垂直中心线偏移的峰值发射。

公开(公告)号：WO2007127029A3

公开(公告)日：2007-11-08

申请号：PCT/US2007/008503

申请日：2007-04-04

Applicant: CREE, INC. ,  HUSSELL, Christopher, P. ,  BERGMANN, Michael, J. ,  COLLINS, Brian, T. ,  EMERSON, David, T.

Inventor： HUSSELL, Christopher, P. ,  BERGMANN, Michael, J. ,  COLLINS, Brian, T. ,  EMERSON, David, T.

IPC: H01L33/00

Abstract: A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

公开(公告)号：WO2013085816A1

公开(公告)日：2013-06-13

申请号：PCT/US2012/067326

申请日：2012-11-30

Applicant: CREE, INC.

Inventor： EMERSON, David, T. ,  LYDON, Justin ,  ROSADO, Ray ,  BRITT, Jeffrey, Carl

IPC: H01L33/48 ,  H01L33/58

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm 2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.

Abstract translation: 提供了具有减小的尺寸和改善的光输出的发光器件和方法。 在一个实施例中，发光器件包括具有大约6平方毫米（mm 2）或更小的面积的底座。 该装置还可以包括在底座上的发光芯片和设置在发光芯片上并位于底座上的透镜。 该装置可操作用于发射大约100流明或更高的光。

公开(公告)号：WO2012050994A2

公开(公告)日：2012-04-19

申请号：PCT/US2011/054560

申请日：2011-10-03

Applicant: CREE, INC. ,  HUSSELL, Christopher, P. ,  EMERSON, David, T. ,  BRITT, Jeffrey, C.

Inventor： HUSSELL, Christopher, P. ,  EMERSON, David, T. ,  BRITT, Jeffrey, C.

IPC: H01L33/64 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/08 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49113 ,  H01L2924/12032 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.

Abstract translation: 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。

公开(公告)号：WO2010056619A1

公开(公告)日：2010-05-20

申请号：PCT/US2009/063693

申请日：2009-11-09

Applicant: CREE, INC. ,  COLLINS, Brian, T. ,  HUSSELL, Christopher, P. ,  EMERSON, David, T. ,  LE TOQUIN, Ronan, P.

Inventor： COLLINS, Brian, T. ,  HUSSELL, Christopher, P. ,  EMERSON, David, T. ,  LE TOQUIN, Ronan, P.

IPC: C09K11/08 ,  C09K11/77

CPC classification number: C09K11/7734 ,  C04B35/58 ,  C04B35/581 ,  C04B35/584 ,  C04B35/591 ,  C04B35/593 ,  C04B35/5935 ,  C04B35/597 ,  C04B2235/3224 ,  C04B2235/3852 ,  C04B2235/3865 ,  C04B2235/3869 ,  C04B2235/3873 ,  C04B2235/445 ,  C09K11/025 ,  C09K11/0883 ,  C09K11/7728

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract translation: 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得到的组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。

公开(公告)号：WO2004059809A2

公开(公告)日：2004-07-15

申请号：PCT/US2003/040377

申请日：2003-12-18

Applicant: CREE, INC. ,  HABERERN, Kevin, W. ,  BERGMANN, Michael, J. ,  ROSADO, Raymond ,  EMERSON, David, T.

Inventor： HABERERN, Kevin, W. ,  BERGMANN, Michael, J. ,  ROSADO, Raymond ,  EMERSON, David, T.

IPC: H01S5/323

CPC classification number: H01L33/145 ,  H01S5/021 ,  H01S5/0421 ,  H01S5/0425 ,  H01S5/22 ,  H01S5/2205 ,  H01S5/2206 ,  H01S5/2214 ,  H01S5/2231 ,  H01S5/2275 ,  H01S5/32341 ,  H01S2301/176

Abstract: Methods of forming a semiconductor device can include forming a semiconductor structure on a substrate, the semiconductor structure having mesa sidewalls and a mesa surface opposite the substrate. A contact layer can be formed on the mesa surface wherein the contact layer has sidewalls and a contact surface opposite the mesa surface and wherein the contact layer extends across substantially an entirety of the mesa surface. A passivation layer can be formed on the mesa sidewalls and on portions of the contact layer sidewalls adjacent the mesa surface, and the passivation layer can expose substantially an entirety of the contact surface of the contact layer.

Abstract translation: 形成半导体器件的方法可以包括在衬底上形成半导体结构，半导体结构具有台面侧壁和与衬底相对的台面。 接触层可以形成在台面表面上，其中接触层具有侧壁和与台面表面相对的接触表面，并且其中接触层在基本上整个台面表面上延伸。 可以在台面侧壁和邻近台面表面的接触层侧壁的部分上形成钝化层，并且钝化层可以暴露接触层的基本上整个接触表面。

公开(公告)号：WO2012100060A3

公开(公告)日：2012-07-26

申请号：PCT/US2012/021879

申请日：2012-01-19

Applicant: CREE, INC. ,  EMERSON, David, T. ,  BERGMANN, Michael, J. ,  HUSSELL, Christopher, P.

Inventor： EMERSON, David, T. ,  BERGMANN, Michael, J. ,  HUSSELL, Christopher, P.

IPC: F21S2/00 ,  G02F1/13357

Abstract: Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.

公开(公告)号：WO2012071139A2

公开(公告)日：2012-05-31

申请号：PCT/US2011/058603

申请日：2011-10-31

Applicant: CREE, INC. ,  HUSSELL, Christopher, P. ,  ANDREWS, Peter, Scott ,  REIHERZER, Jesse, Colin ,  EMERSON, David, T.

Inventor： HUSSELL, Christopher, P. ,  ANDREWS, Peter, Scott ,  REIHERZER, Jesse, Colin ,  EMERSON, David, T.

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.

Abstract translation: 公开了发光器件和方法。 在一个实施例中，发光器件可以包括衬底和设置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。

公开(公告)号：WO2009123726A3

公开(公告)日：2009-10-08

申请号：PCT/US2009/002039

申请日：2009-03-31

Applicant: CREE, INC. ,  CHITNIS, Ashay ,  EDMOND, John ,  BRITT, Jeffrey, C. ,  KELLER, Bernd, P. ,  EMERSON, David, T. ,  BERGMANN, Michael, John ,  CABALU, Jasper, S.

Inventor： CHITNIS, Ashay ,  EDMOND, John ,  BRITT, Jeffrey, C. ,  KELLER, Bernd, P. ,  EMERSON, David, T. ,  BERGMANN, Michael, John ,  CABALU, Jasper, S.

IPC: H01L33/50

Abstract: A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some light from the LEDs passes through the conversion material and is converted. The light emission from the LED chips comprises light from the conversion material, typically in combination with LED light. The emission characteristics of at least some of the LED chips is measured and at least some of the conversion material over the LEDs is removed to alter the emission characteristics of the LED chips. The invention is particularly applicable to fabricating LED chips on a wafer where the LED chips have light emission characteristics that are within a range of target emission characteristics. This target range can fall within an emission region on a CIE curve to reduce the need for binning of the LEDs from the wafer. The emission characteristics of the LED chips in the wafer can be tuned to the desired range by micro-machining the conversion material over the LEDs.

公开(公告)号：WO2008091319A2

公开(公告)日：2008-07-31

申请号：PCT/US2007/024366

申请日：2007-11-20

Applicant: CREE, INC. ,  SERUTO, James ,  CHITNIS, Ashay ,  IBBETSON, James ,  KELLER, Bernd ,  EMERSON, David, T. ,  EDMOND, David, T. ,  BERGMAN, Michael, J. ,  CABALU, Jasper, S. ,  BRITT, Jeffrey, C. ,  CHAKRABORTY, Arpan ,  TARSA, Eric, J. ,  FU, Yankun

Inventor： SERUTO, James ,  CHITNIS, Ashay ,  IBBETSON, James ,  KELLER, Bernd ,  EMERSON, David, T. ,  EDMOND, David, T. ,  BERGMAN, Michael, J. ,  CABALU, Jasper, S. ,  BRITT, Jeffrey, C. ,  CHAKRABORTY, Arpan ,  TARSA, Eric, J. ,  FU, Yankun

IPC: H01L33/00

CPC classification number: H01L33/508 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/387 ,  H01L33/44 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Abstract translation: 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层至少埋置一些基座。 然后平坦化涂层以暴露至少一些埋置基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过线键接触暴露的基座。 本发明公开了用于制造具有倒装芯片键合在载体衬底上的LED和用于制造其他半导体器件的LED芯片的类似方法。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。