公开(公告)号：WO1998026452A1

公开(公告)日：1998-06-18

申请号：PCT/CA1997000946

申请日：1997-12-09

Applicant: MICROBONDS, INC.

Inventor： MICROBONDS, INC. ,  WANG, Daniel

IPC: H01L23/49

CPC classification number: H01L24/49 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/0665 ,  H01L2224/45688 ,  H01L2924/05432

Abstract: A method of increasing the packaging density of input/output interconnections on a semiconductor chip (10) includes creating a plurality of terminal pads on a substrate of the chip (10), providing an array of a plurality of bonding pads (11) on the surface of such chip (10) and connecting the bonding pads (11) and the terminal pads by means of insulated bond wires (13). The bonding pads are not limited to the periphery of the chip. The connections for the bond wires (13) are preferably made using the ball bonding process. Preferably, the bond wires (13) are made of aluminum and are coated with an aluminum oxide insulation (14).

Abstract translation: 一种增加半导体芯片（10）上的输入/输出互连的封装密度的方法包括在芯片（10）的衬底上形成多个端子焊盘，提供多个焊盘（11）的阵列 （10）的表面，并且通过绝缘接合线（13）连接接合焊盘（11）和端子焊盘。 接合焊盘不限于芯片的外围。 接合线（13）的连接优选使用球接合工艺制成。 优选地，接合线（13）由铝制成并且涂覆有氧化铝绝缘体（14）。