公开(公告)号：WO2007143115A2

公开(公告)日：2007-12-13

申请号：PCT/US2007012979

申请日：2007-06-01

Applicant: NEOCONIX INC ,  WILLIAMS JOHN D

Inventor： WILLIAMS JOHN D

IPC: H01R12/00

CPC classification number: H01R13/245 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R4/04 ,  H01R12/57 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/48

Abstract: A scalable, low cost, reliable, compliant, low profile, low insertion force, high-density, separable and reconnectable connector for high speed, high performance electronic circuitry and semiconductors. The electrical connector can be used to make, for example, electrical connections from components such as a Printed Circuit Board (PCB) to another PCB, MPU, NPU, or other semiconductor device. A normalized working range for an array of elastic contacts of the interposer can be about 0.2 to 1.0. A reversible normalized working range is maintained through multiple connections and reconnections using a highly elastic material for the contact arms. In one aspect, a first electrical component having a first array pitch can be connected to a second electrical component having a second array pitch.

Abstract translation: 适用于高速，高性能电子电路和半导体的可扩展，低成本，可靠，兼容，低外形，低插入力，高密度，可分离和可重新连接的连接器。 电连接器可以用于例如从诸如印刷电路板（PCB）到另一PCB，MPU，NPU或其它半导体器件的组件的电连接。 插入器的弹性接触阵列的归一化工作范围可以为约0.2至1.0。 通过使用用于接触臂的高弹性材料的多个连接和重新连接来维持可逆的归一化工作范围。 在一个方面，具有第一阵列间距的第一电气部件可以连接到具有第二阵列间距的第二电气部件。

公开(公告)号：WO2004093252B1

公开(公告)日：2005-07-21

申请号：PCT/US2004011074

申请日：2004-04-09

Applicant: NEOCONIX INC ,  BROWN DIRK D ,  WILLIAMS JOHN D ,  YAO HONGJUN ,  ALI HASSAN O ,  RADZA ERIC

Inventor： BROWN DIRK D ,  WILLIAMS JOHN D ,  YAO HONGJUN ,  ALI HASSAN O ,  RADZA ERIC

IPC: G01R1/04 ,  G01R1/067 ,  G01R3/00 ,  H01L23/32 ,  H01L23/48 ,  H01R3/00 ,  H01R12/50 ,  H01R13/03 ,  H01R13/24 ,  H01R43/00 ,  H01R43/20 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC classification number: H05K3/4092 ,  G01R1/0416 ,  G01R3/00 ,  H01L23/32 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/714 ,  H01R13/03 ,  H01R13/2407 ,  H01R13/2492 ,  H01R43/007 ,  H01R43/205 ,  H05K3/326 ,  H05K7/1069 ,  H01L2924/00

Abstract: An electrical connector includes an electrical contact array (17) having a plurality of contact elements (15) where each contact element has at least one conductive, resilient spring portion.

Abstract translation: 电连接器包括具有多个接触元件（15）的电接触阵列（17），其中每个接触元件具有至少一个导电弹性弹簧部分。

公开(公告)号：WO2007124113A2

公开(公告)日：2007-11-01

申请号：PCT/US2007009760

申请日：2007-04-19

Applicant: NEOCONIX INC ,  DITTMANN LARRY E ,  WILLIAMS JOHN D ,  LONG WILLIAM B ,  CHEN TINGBAO

Inventor： DITTMANN LARRY E ,  WILLIAMS JOHN D ,  LONG WILLIAM B ,  CHEN TINGBAO

IPC: H01R12/24

CPC classification number: H01R12/716 ,  H01R12/721 ,  H01R12/775 ,  H01R12/88

Abstract: The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.

Abstract translation: 本发明提供了一种具有弹簧接触元件的夹具，用于接收并固定具有暴露的电迹线的扁平柔性电缆到诸如印刷电路板上的电路。 本发明的夹具具有用于增强平坦柔性电缆上的暴露的电迹线与夹具中的弹簧接触元件的对准和对准的特征。 本发明的另一方面是通过在其上布置有弹簧接触元件的基板的相对侧上的接触焊盘阵列将夹具内的高密度接触阵列连接到电路板的能力。 本发明的一个示例性应用是将手机中的相机模块连接到电话中的印刷电路板或类似电气设备。

公开(公告)号：WO2007056169A3

公开(公告)日：2007-10-11

申请号：PCT/US2006043000

申请日：2006-11-03

Applicant: NEOCONIX INC ,  WILLIAMS JOHN D

Inventor： WILLIAMS JOHN D

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/526 ,  H01R13/2407 ,  H05K3/202 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10378 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive layers and holes through the substrate. The first and second conductive layers are adhered to opposite sides of the flexible substrate and have a plurality of raised contact elements in registration with at least a subset of the holes. At least some contact elements on the first and second conductive layers that oppose each other are in electrical communication with one another by way of the plating.

Abstract translation: 兼容，可扩展，热电机械，柔性电连接器。 在一种配置中，柔性电连接器包括柔性基板，第一和第二导电层以及连续施加在导电层上的电镀层和通过基板的孔。 第一和第二导电层粘附到柔性基板的相对侧上，并且具有多个与至少一个孔的子集对准的凸起接触元件。 第一和第二导电层上彼此相对的至少一些接触元件通过电镀彼此电连通。

公开(公告)号：WO2005057652A3

公开(公告)日：2006-01-05

申请号：PCT/US2004040868

申请日：2004-12-07

Applicant: NEOCONIX INC

Inventor： BROWN DIRK D ,  WILLIAMS JOHN D ,  RADZA ERIC M

IPC: G01R1/067 ,  G01R3/00 ,  H01L23/00 ,  H01L23/32 ,  H01L23/48 ,  H01R13/03 ,  H01R13/24 ,  H01R43/00 ,  H01R43/20 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H01R12/22

CPC classification number: H01L24/72 ,  G01R1/06711 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/32 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/714 ,  H01R13/03 ,  H01R13/2407 ,  H01R13/2492 ,  H01R43/007 ,  H01R43/205 ,  H05K3/326 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00 ,  H01L2224/48

Abstract: A connector, and method for forming same, for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

Abstract translation: 用于电连接到形成在半导体器件上的焊盘的连接器及其形成方法包括：衬底和形成在衬底上的导电材料的接触元件阵列。 每个接触元件包括附接到基底的顶表面的基部和从基部延伸并具有突出在基底上方的远端的弯曲弹簧部分。 弯曲的弹簧部分被形成为远离接触平面弯曲并且具有设置成在接合半导体器件的相应焊盘时提供受控的擦拭动作的曲率。

公开(公告)号：WO2013010089A8

公开(公告)日：2014-05-22

申请号：PCT/US2012046693

申请日：2012-07-13

Applicant: MICROBIOTIX INC ,  MOIR DONALD T ,  AIELLO DANIEL ,  PEET NORTON P ,  WILLIAMS JOHN D ,  TORHAN MATTHEW

Inventor： MOIR DONALD T ,  AIELLO DANIEL ,  PEET NORTON P ,  WILLIAMS JOHN D ,  TORHAN MATTHEW

IPC: A61K31/235 ,  A61K31/16

CPC classification number: C07D471/04 ,  A61K31/165 ,  A61K31/275 ,  A61K31/343 ,  A61K31/353 ,  A61K31/357 ,  A61K31/36 ,  A61K31/4015 ,  A61K31/402 ,  A61K31/4184 ,  A61K31/437 ,  A61K31/47 ,  A61K31/472 ,  A61K31/4741 ,  A61K45/06 ,  C07C235/20 ,  C07D207/27 ,  C07D215/06 ,  C07D217/12 ,  C07D235/26 ,  C07D311/58 ,  C07D317/58 ,  C07D319/08 ,  A61K2300/00

Abstract: Organic compounds showing the ability to inhibit effector toxin secretion or translocation mediated by bacterial type III secretion systems are disclosed. The disclosed type III secretion system inhibitor compounds are useful for combating infections by Gram-negative bacteria such as Salmonella spp., Shigella flexneri, Pseudomonas spp., Yersinia spp., enteropathogenic and enteroinvasive Escherichia coli, and Chlamydia spp. having such type III secretion systems.

Abstract translation: 公开了显示抑制由细菌III型分泌系统介导的效应物毒素分泌或易位的能力的有机化合物。 所公开的III型分泌系统抑制剂化合物可用于抵抗革兰氏阴性菌如沙门氏菌属，志贺氏菌属，假单胞菌属，耶尔森氏菌属，肠致病性肠炎和肠毒素性大肠杆菌和衣原体属的感染。 具有这种III型分泌系统。

公开(公告)号：WO2004093252A2

公开(公告)日：2004-10-28

申请号：PCT/US2004011074

申请日：2004-04-09

Applicant: EPIC TECHNOLOGY INC ,  BROWN DIRK D ,  WILLIAMS JOHN D ,  YAO HONGJUN ,  ALI HASSAN O ,  RADZA ERIC

Inventor： BROWN DIRK D ,  WILLIAMS JOHN D ,  YAO HONGJUN ,  ALI HASSAN O ,  RADZA ERIC

IPC: G01R1/04 ,  G01R1/067 ,  G01R3/00 ,  H01L23/32 ,  H01L23/48 ,  H01R3/00 ,  H01R12/50 ,  H01R13/03 ,  H01R13/24 ,  H01R43/00 ,  H01R43/20 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H01R

CPC classification number: H05K3/4092 ,  G01R1/0416 ,  G01R3/00 ,  H01L23/32 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/714 ,  H01R13/03 ,  H01R13/2407 ,  H01R13/2492 ,  H01R43/007 ,  H01R43/205 ,  H05K3/326 ,  H05K7/1069 ,  H01L2924/00

Abstract: An electrical connector includes an electrical contact array having a plurality of contact elements. Each contact element has at least one conductive, resilient spring portion formed in a conductive, resilient sheet, each spring portion being biased outwardly from the sheet. The electrical contact array is arranged in a predetermined pattern corresponding to an electrical device to be connected. The conductive sheet is bonded to a first surface of a dielectric substrate, each spring portion extending outwardly away from the dielectric substrate. The spring portions are electrically connected to conductors that are at least one of embedded in or extending through the dielectric substrate. At least some of the plurality of contact elements are singulated from one another on the dielectric substrate by a chemical etchant.

Abstract translation: 电连接器包括具有多个接触元件的电接触阵列。 每个接触元件具有形成在导电弹性片中的至少一个导电弹性弹簧部分，每个弹簧部分从片材向外偏压。 电接触阵列以与要连接的电气设备相对应的预定图案布置。 导电片接合到电介质基片的第一表面上，每个弹簧部分向外延伸离开电介质基片。 弹簧部分电连接到至少一个嵌入或延伸通过电介质基板的导体。 多个接触元件中的至少一些通过化学蚀刻剂在电介质基板上彼此分离。

公开(公告)号：WO2013052263A3

公开(公告)日：2013-06-20

申请号：PCT/US2012055683

申请日：2012-09-16

Applicant: MICROBIOTIX INC ,  NGUYEN SON T ,  DING XIAOYUAN ,  WILLIAMS JOHN D ,  OPPERMAN TIMOTHY J

Inventor： NGUYEN SON T ,  DING XIAOYUAN ,  WILLIAMS JOHN D ,  OPPERMAN TIMOTHY J

IPC: A61K31/4178

CPC classification number: A01N43/90 ,  A01N43/38 ,  A01N43/40 ,  A01N43/50 ,  A01N43/54

Abstract: The invention provides fungicide and/or antifungal organic compounds and compositions thereof that kill or inhibit growth of cells of one or more microbial pathogens, such as pathogenic fungi species (including opportunistic pathogenic species) by administration to an individual (human or other mammal), plant, or foodstuff that is susceptible to infection by or has been infected with cells of the fungal species.

Abstract translation: 本发明提供杀真菌剂和/或抗真菌有机化合物及其组合物，其通过给予个体（人或其他哺乳动物）杀死或抑制一种或多种微生物病原体（例如致病真菌物种（包括机会致病物种））细胞的生长， 植物或食物，其易感染或已被真菌物种的细胞感染。

公开(公告)号：WO2011046646A2

公开(公告)日：2011-04-21

申请号：PCT/US2010041632

申请日：2010-07-10

Applicant: MICROBIOTIX INC ,  BASU ARNAB ,  MILLS DEBRA M ,  PEET NORTON P ,  WILLIAMS JOHN D

Inventor： BASU ARNAB ,  MILLS DEBRA M ,  PEET NORTON P ,  WILLIAMS JOHN D

IPC: A61K31/5513

CPC classification number: A61K31/5513 ,  A61K31/18 ,  C07D213/74 ,  C07D215/40 ,  C07D243/12 ,  C07D249/10 ,  C07D307/71 ,  C07D405/06 ,  C07D405/12 ,  C07D405/14 ,  C07D409/04 ,  C07D471/04 ,  C07D491/22 ,  A61K2300/00

Abstract: Organic compounds showing the ability to inhibit viral glycoprotein (GP)-mediated entry of a filovirus into a host cell are disclosed. The disclosed filovirus entry inhibitor compounds are useful for treating, preventing, or reducing the spread of infections by filovirus including the type species Marburg virus (MARV) and Ebola virus (EBOV). Preferred inhibitors of the invention provide therapeutic agents for combating the Ivory Coast, Sudan, Zaire, Bundibugyo, and Reston Ebola virus strains.

Abstract translation: 公开了显示抑制病毒糖蛋白（GP）介导的病毒入宿主细胞的能力的有机化合物。 所公开的叶病毒入侵抑制剂化合物可用于治疗，预防或减少包括类型物种马尔堡病毒（MARV）和埃博拉病毒（EBOV）的病毒感染的扩散。 本发明优选的抑制剂提供用于对抗科特迪瓦海岸，苏丹，扎伊尔，Bundibugyo和Reston埃博拉病毒毒株的治疗剂。

公开(公告)号：WO2010056914A8

公开(公告)日：2010-07-15

申请号：PCT/US2009064270

申请日：2009-11-12

Applicant: MICROBIOTIX INC ,  UNIV NEW JERSEY MED ,  MOIR DONALD T ,  AIELLO DANIEL ,  BARNES MARJORIE H ,  WILLIAMS JOHN D ,  BISWAS SUBHASIS B

Inventor： MOIR DONALD T ,  AIELLO DANIEL ,  BARNES MARJORIE H ,  WILLIAMS JOHN D ,  BISWAS SUBHASIS B

IPC: A01N43/16 ,  A61K31/35

CPC classification number: A61K31/35 ,  A01N43/16 ,  A01N43/52 ,  A01N43/707 ,  A01N43/82 ,  A61K45/06 ,  A61K2300/00

Abstract: Organic compounds are described that inhibit bacterial helicase activity and growth of bacterial cells on surfaces.

Abstract translation: 描述了抑制细菌解旋酶活性和表面上细菌细胞生长的有机化合物。