公开(公告)号：WO1997015076A1

公开(公告)日：1997-04-24

申请号：PCT/US1996016809

申请日：1996-10-17

Applicant: PROLINX LABS CORPORATION

Inventor： PROLINX LABS CORPORATION ,  LAN, James, J., D. ,  CHIANG, Steve, S. ,  WU, Paul, Y., F. ,  SHEPHERD, William, H. ,  XIE, John, Y. ,  JIANG, Hang

IPC: H01L23/12

CPC classification number: H01L24/73 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/49173 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/85399

Abstract: An integrated circuit package (210) comprising a substrate that has a dielectric layer and a micro-filled via formed substantially in the center of a hole in the dielectric layer is disclosed. The IC package substrate has at least one chip bonding pad and one ball attach pad (201) that are electrically coupled to each other by the micro-filled via. The micro-filled via is formed of a material called a "micro-filled via material" that includes a binding material and optionally includes a number of particles dispersed in the binding material. The binding material can be any material, such as a polymer that is either conductive or nonconductive. The particles can be formed of any conductive material, such as a conductive polymer or a conductive metal.

Abstract translation: 公开了一种集成电路封装（210），其包括具有介质层和基本上形成在电介质层中的孔的中心的微填充通孔的基板。 IC封装衬底具有至少一个芯片焊盘和一个通过微填充通孔彼此电耦合的球附着焊盘（201）。 微填充通孔由称为“微填充通孔材料”的材料形成，其包括粘合材料，并且任选地包括分散在粘合材料中的多个颗粒。 粘合材料可以是任何材料，例如导电或不导电的聚合物。 颗粒可以由任何导电材料形成，例如导电聚合物或导电金属。

公开(公告)号：WO1997013393A1

公开(公告)日：1997-04-10

申请号：PCT/US1996015975

申请日：1996-10-04

Applicant: PROLINX LABS CORPORATION

Inventor： PROLINX LABS CORPORATION ,  LAN, James, J., D. ,  CHIANG, Steve, S. ,  SHEPHERD, William, H. ,  WU, Paul, Y., F. ,  XIE, John, Y.

IPC: H05K01/00

CPC classification number: H05K3/4069 ,  H01L23/5382 ,  H01L23/5384 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/0293 ,  H05K3/0023 ,  H05K3/105 ,  H05K3/4644 ,  H05K2203/105 ,  H05K2203/1115 ,  H05K2203/173 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A micro filled material (801) includes a binding material (802) and optionally includes a number of particles (803). The binding material (802) and the particles (803) can be formed of any conductive or nonconductive material. Using such a micro filled via material (801), an electrical conductor is formed in a substrate (825) for supporting one or more electronic components using the following steps: placing the micro filled via material (801) between two conductive layers (810, 820) at various locations in a substrate (825) at which an electrical conductor is to be formed; and optionally programming the micro filled via material (801) to reduce the resistance of, or to form an electrical conductor.

Abstract translation: 微填充材料（801）包括粘合材料（802），并且任选地包括多个颗粒（803）。 粘合材料（802）和颗粒（803）可以由任何导电或非导电材料形成。 使用这种微填充的通孔材料（801），在用于支撑一个或多个电子部件的基板（825）中形成电导体，使用以下步骤：将微填充的通孔材料（801）放置在两个导电层 820）在要形成电导体的基板（825）中的各个位置处; 并且可选地编程微填充通孔材料（801）以降低电导体或形成电导体。