公开(公告)号：WO2015020871A1

公开(公告)日：2015-02-12

申请号：PCT/US2014/049103

申请日：2014-07-31

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： STEPHANOU, Philip Jason ,  KIM, Jitae ,  SHENOY, Ravindra Vaman ,  LAI, Kwan-Yu

IPC: H01F17/00 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/24 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/004 ,  H01F2017/0066 ,  H01F2027/2809

Abstract: A particular device includes a coil and a discontinuous magnetic core. The discontinuous magnetic core includes a first elongated portion, a second elongated portion, and at least two curved portions, where the portions are coplanar and physically separated from each other. The discontinuous magnetic core is arranged to form a discontinuous loop. The discontinuous magnetic core is deposited as a first layer above a dielectric substrate. A first portion of the coil extends above a first surface of the magnetic core. A second portion of the coil extends below a second surface of the magnetic core. The second portion of the coil is electrically coupled to the first portion of the coil. The second surface of the magnetic core is opposite the first surface of the magnetic core.

Abstract translation: 特定装置包括线圈和不连续磁芯。 不连续磁芯包括第一细长部分，第二细长部分和至少两个弯曲部分，其中部分是共面的并且物理上彼此分离。 非连续磁芯被布置成形成不连续的环路。 不连续磁芯作为电介质基片上的第一层沉积。 线圈的第一部分在磁芯的第一表面上方延伸。 线圈的第二部分在磁芯的第二表面的下方延伸。 线圈的第二部分电耦合到线圈的第一部分。 磁芯的第二表面与磁芯的第一表面相对。

公开(公告)号：WO2014022298A1

公开(公告)日：2014-02-06

申请号：PCT/US2013/052547

申请日：2013-07-29

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： SHENOY, Ravindra, V. ,  LAI, Kwan-Yu ,  LASITER, Jon, Bradley ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LO, Chi, Shun ,  KIDWELL, Donald, William ,  STEPHANOU, Philip, Jason ,  BLACK, Justin, Phelps ,  GOUSEV, Evgeni, Petrovich

IPC: H01L23/15 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/15 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y10T29/4902 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/00012

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including embedded wafer level packages. The glass via bars can provide high density electrical interconnections in a package. In some implementations, the glass via bars can include integrated passive components. Methods of fabricating glass via bars are provided. In some implementations, the methods can include patterning and etching photo-patternable glass substrates. Packaging methods employing glass via bars are also provided.

Abstract translation: 本公开提供了可用于紧凑型三维封装（包括嵌入式晶片级封装）的玻璃通孔条的系统，方法和装置。 玻璃通孔棒可以在封装中提供高密度电连接。 在一些实施方案中，玻璃通孔棒可以包括集成的无源部件。 提供制造玻璃通孔条的方法。 在一些实施方案中，所述方法可以包括图案化和蚀刻可光图案化的玻璃基板。 还提供了采用玻璃通孔条的包装方法。

公开(公告)号：WO2014085310A1

公开(公告)日：2014-06-05

申请号：PCT/US2013/071639

申请日：2013-11-25

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： PUSHPARAJ, Victor Louis Arockiaraj ,  SHENOY, Ravindra V. ,  LASITER, Jon Bradley ,  LAI, Kwan-Yu ,  KIDWELL, Donald William ,  LONDERGAN, Ana Rangelova

IPC: C03C17/34 ,  C03C17/36 ,  H01L28/75 ,  H01L28/91

CPC classification number: H05K1/162 ,  B32B3/266 ,  B32B3/30 ,  B32B7/12 ,  C03C17/3435 ,  C03C17/3626 ,  C03C17/3639 ,  C03C17/3649 ,  C03C17/3655 ,  C03C17/3671 ,  C03C17/3697 ,  C23C16/045 ,  C23C16/34 ,  C23C16/45525 ,  C23C28/322 ,  C23C28/34 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L28/75 ,  H01L28/91 ,  H01L2924/0002 ,  Y10T428/24322 ,  Y10T428/24545 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for an adhesive metal nitride layer on glass. In one aspect, a glass substrate having a surface is provided. A via with a depth to width aspect ratio of 5 to 1 or greater extends at least partially through the glass substrate. An adhesive metal nitride layer is disposed on the surface of the glass substrate and on one or more interior surfaces of the via. The adhesive metal nitride layer includes at least one of titanium nitride and tantalum nitride.

Abstract translation: 本公开提供了用于玻璃上的粘合性金属氮化物层的系统，方法和装置。 一方面，提供具有表面的玻璃基板。 深度与宽度纵横比为5比1或更大的通孔至少部分延伸穿过玻璃基底。 粘合金属氮化物层设置在玻璃基板的表面上和通孔的一个或多个内表面上。 粘合性金属氮化物层包括氮化钛和氮化钽中的至少一种。

公开(公告)号：WO2014022418A1

公开(公告)日：2014-02-06

申请号：PCT/US2013/052760

申请日：2013-07-30

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： SHENOY, Ravindra V. ,  LAI, Kwan-Yu ,  STEPHANOU, Philip Jason ,  VELEZ, Mario Francisco ,  KIM, Jonghae ,  GOUSEV, Evgeni Petrovich

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/5389 ,  G09G3/3266 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.

Abstract translation: 本公开提供了可用于紧凑三维封装（包括封装封装（PoP））的用于玻璃通孔条的系统，方法和装置。 玻璃通孔棒可以在PoP中提供高密度电连接。 在一些实施方案中，玻璃通孔棒可以包括集成的无源部件。 还提供了采用玻璃通孔条的包装方法。