公开(公告)号：WO2014065939A1

公开(公告)日：2014-05-01

申请号：PCT/US2013/056614

申请日：2013-08-26

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： ZUO, Chengjie ,  KIM, Jonghae ,  YUN, Changhan, Hobie ,  PARK, Sang-June ,  STEPHANOU, Philip, Jason ,  LO, Chi, Shun ,  MIKULKA, Robert, Paul ,  VELEZ, Mario, Francisco ,  SHENOY, Ravindra, V. ,  NOWAK, Matthew, Michael

IPC: H03H9/24 ,  H03H9/205 ,  H03H9/02

CPC classification number: H03H9/02157 ,  H03H9/02574 ,  H03H9/205 ,  H03H9/2405 ,  H03H2009/02503 ,  H03H2009/02527 ,  H03H2009/241

Abstract: This disclosure provides systems, methods and apparatus related to acoustic resonators that include composite transduction layers (116, 118) for enabling selective tuning of one or more acoustic or electromechanical properties. In one aspect, a resonator structure includes one or more first electrodes (142), one or more second electrodes (144), and a transduction layer (116, 118) arranged between the first and second electrodes. The transduction layer includes a plurality of constituent layers. In some implementations, the constituent layers include one or more first piezoelectric layers and one or more second piezoelectric layers. The transduction layer is configured to, responsive to signals provided to the first and second electrodes, provide at least a first mode of vibration of the transduction layer with a displacement component along the z axis and at least a second mode of vibration of the transduction layer with a displacement component _ along the plane of the x axis and the y axis.

Abstract translation: 本公开提供了涉及声谐振器的系统，方法和装置，其包括用于使得能够选择性地调谐一个或多个声学或机电特性的复合转导层（116,118）。 在一个方面，谐振器结构包括一个或多个第一电极（142），一个或多个第二电极（144）和布置在第一和第二电极之间的换能层（116,118）。 换能层包括多个构成层。 在一些实施方式中，构成层包括一个或多个第一压电层和一个或多个第二压电层。 转导层被配置为响应于提供给第一和第二电极的信号，提供至少第一传感模式的振动，沿着z轴的位移分量和换能层的至少第二振动模式 沿着x轴和y轴的平面具有位移分量。

公开(公告)号：WO2013106783A1

公开(公告)日：2013-07-18

申请号：PCT/US2013/021325

申请日：2013-01-11

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： BLACK, Justin, Phelps ,  SHENOY, Ravindra, V. ,  LASITER, Jon, Bradley ,  STEPHANOU, Philip, Jason

IPC: G02B26/08 ,  H02M1/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B2201/033 ,  B81B2201/047 ,  G02B26/001 ,  G02B26/0841 ,  H02N1/008

Abstract: This disclosure provides systems, methods and apparatus for glass electromechanical systems (EMS) electrostatic devices. In one aspect, a glass EMS electrostatic device includes sidewall electrodes. Structural components of a glass EMS electrostatic device such as stationary support structures, movable masses, coupling flexures, and sidewall electrode supports, can be formed from a single glass body. The glass body can be a photochemically etched. In some implementations, pairs of sidewall electrodes can be arranged in interdigitated comb or parallel plate configurations and can include plated metal layers and narrow capacitive gap spacing.

Abstract translation: 本公开提供了用于玻璃机电系统（EMS）静电装置的系统，方法和装置。 一方面，玻璃EMS静电装置包括侧壁电极。 可以由单个玻璃体形成诸如固定支撑结构，可移动质量块，耦合弯曲部和侧壁电极支架的玻璃EMS静电装置的结构部件。 玻璃体可以光化学蚀刻。 在一些实施方式中，侧壁电极对可以以叉指梳状或平行板结构布置，并且可以包括电镀金属层和窄电容间隙。

公开(公告)号：WO2013032726A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/051196

申请日：2012-08-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, V. ,  BLACK, Justin, Phelps ,  BURNS, David, William ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  BUCHAN, Nicholas, Ian

Inventor： PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, V. ,  BLACK, Justin, Phelps ,  BURNS, David, William ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  BUCHAN, Nicholas, Ian

IPC: H01L23/053

CPC classification number: H01L23/053 ,  B81B2201/047 ,  B81C1/0023 ,  H01L23/055 ,  H01L23/057 ,  H01L23/08 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14609 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

Abstract translation: 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。 在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。

公开(公告)号：WO2012040063A1

公开(公告)日：2012-03-29

申请号：PCT/US2011/052017

申请日：2011-09-16

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  BLACK, Justin, Phelps ,  SHENOY, Ravindra, V. ,  GOUSEV, Evgeni, Petrovich ,  HADJICHRISTOS, Aristotele ,  MYERS, Thomas, Andrew ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LAN, Je-Hsiung, Jeffrey ,  LO, Chi, Shun

Inventor： BLACK, Justin, Phelps ,  SHENOY, Ravindra, V. ,  GOUSEV, Evgeni, Petrovich ,  HADJICHRISTOS, Aristotele ,  MYERS, Thomas, Andrew ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LAN, Je-Hsiung, Jeffrey ,  LO, Chi, Shun

IPC: H01L21/56 ,  G02B26/00

CPC classification number: G02B26/001 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.

Abstract translation: 本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。 第一基板可以是玻璃基板。 第一衬底可以包括导电通孔。 功率组合器电路可以沉积在第一衬底的第一侧上。 功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。 集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。 导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。

公开(公告)号：WO2014062310A2

公开(公告)日：2014-04-24

申请号：PCT/US2013/058801

申请日：2013-09-09

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： SHENOY, Ravindra, V. ,  KIM, Jitae ,  LAI, Kwan-yu ,  LASITER, Jon, Bradley ,  STEPHANOU, Philip, Jason ,  KIDWELL, Donald, William ,  GOUSEV, Evgeni, Petrovich

IPC: H01F17/00 ,  H01F41/04

CPC classification number: H01F27/06 ,  G09G3/3466 ,  G09G5/00 ,  H01F17/0033 ,  H01F21/00 ,  H01F41/005 ,  H01F41/041 ,  H01F41/046 ,  Y10T29/49165 ,  Y10T156/1057

Abstract: This disclosure provides systems, methods, and apparatus for through substrate via inductors. In one aspect, a cavity is defined in a glass substrate. At least two metal bars are in the cavity. A first end of each metal bar is proximate a first surface of the substrate, and a second end of each metal bar is proximate a second surface of the substrate. A metal trace connects a first metal bar and a second metal bar. In some instances, one or more dielectric layers can be disposed on surfaces of the substrate. In some instances, the metal bars and the metal trace define an inductor. The inductor can have a degree of flexibility corresponding to a variable inductance. Metal turns can be arranged in a solenoidal or toroidal configuration. The toroidal inductor can have tapered traces and/or thermal ground planes. Transformers and resonator circuitry can be realized.

Abstract translation: 本公开提供了用于通过基板通孔电感器的系统，方法和装置。 在一个方面，空腔被限定在玻璃基板中。 在空腔中至少有两个金属棒。 每个金属棒的第一端靠近衬底的第一表面，并且每个金属棒的第二端靠近衬底的第二表面。 金属迹线连接第一金属条和第二金属条。 在一些情况下，可以在衬底的表面上设置一个或多个电介质层。 在一些情况下，金属棒和金属迹线限定电感器。 电感器可以具有对应于可变电感的一定程度的灵活性。 金属线圈可以以螺线管或环形配置布置。 环形电感器可以具有锥形迹线和/或热接地平面。 可以实现变压器和谐振器电路。

公开(公告)号：WO2014022298A1

公开(公告)日：2014-02-06

申请号：PCT/US2013/052547

申请日：2013-07-29

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： SHENOY, Ravindra, V. ,  LAI, Kwan-Yu ,  LASITER, Jon, Bradley ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  LO, Chi, Shun ,  KIDWELL, Donald, William ,  STEPHANOU, Philip, Jason ,  BLACK, Justin, Phelps ,  GOUSEV, Evgeni, Petrovich

IPC: H01L23/15 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/15 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  Y10T29/4902 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/00012

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including embedded wafer level packages. The glass via bars can provide high density electrical interconnections in a package. In some implementations, the glass via bars can include integrated passive components. Methods of fabricating glass via bars are provided. In some implementations, the methods can include patterning and etching photo-patternable glass substrates. Packaging methods employing glass via bars are also provided.

Abstract translation: 本公开提供了可用于紧凑型三维封装（包括嵌入式晶片级封装）的玻璃通孔条的系统，方法和装置。 玻璃通孔棒可以在封装中提供高密度电连接。 在一些实施方案中，玻璃通孔棒可以包括集成的无源部件。 提供制造玻璃通孔条的方法。 在一些实施方案中，所述方法可以包括图案化和蚀刻可光图案化的玻璃基板。 还提供了采用玻璃通孔条的包装方法。