Abstract:
The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
Abstract:
The invention relates to a secure document (13), in particular an electronic passport, comprising a support provided on the one hand with active security means (3) comprising a microcircuit linked to an antenna (5) capable of producing an electromagnetic response when it passes through the electromagnetic field of a contactless reader designed to interrogate the identity document (13). The identity document is characterized in that said support is provided on the other hand with passive security means (11, 15) chosen in such a way as to exhibit electrical characteristics, in particular inductive, capacitive and resistive (R, L, C) characteristics suitable for amplifying the electromagnetic response of the active security means (3) so as to take it beyond a threshold allowing the identification of the secure document (13), when the latter is placed in the electromagnetic field of a contactless reader. The invention finds its application in particular in national programmes for issuing passports with enhanced security.
Abstract:
The invention concerns an adapter (10) for electrically connecting a integrated circuit mini-card (12) in a main electronic integrated circuit memory card connector with contact having greater space requirement than the mini-card (12), the mini-card (12) comprising surface contact strips (14) and said adapter (10) comprising a main body (22) capable of being connected to the main connector and a housing (32) for receiving the mini-card (12) emerging at the surface of the main body (22) and including inside bond pads (36) for connection to the electric contacts (14) of the mini-card (12). The invention is characterized in that it comprises a mobile cover (52) which is capable of taking up a position wherein it closes at least partly the housing (32) while maintaining the mini-card (12) in electrically connecting position in the housing (32) and stiffening the structure of the adapter (10).
Abstract:
The invention concerns an electronic device (1) comprising the following steps: permanently fixing by calendering on the side of a wafer defining active surfaces, a rigid dielectric layer (8), thereby forming an assembly (8, 9) capable of being handled; forming perpendicular to the bond pad (6) at least a recess for access (11) to said pad (6); handling said rigid assembly by means of said dielectric layer (8); cutting out the rigid assembly jointly through the dielectric layer (8) and the wafer (9); then connecting after transferring the chip (2), the bond pad (6) to the contact pad (7) above at least part (17) of the dielectric layer.
Abstract:
The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.
Abstract:
The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.
Abstract:
The invention concerns an electronic device (1) comprising the following steps: permanently fixing by calendering on the side of a wafer defining active surfaces, a rigid dielectric layer (8), thereby forming an assembly (8, 9) capable of being handled; forming perpendicular to the bond pad (6) at least a recess for access (11) to said pad (6); handling said rigid assembly by means of said dielectric layer (8); cutting out the rigid assembly jointly through the dielectric layer (8) and the wafer (9); then connecting after transferring the chip (2), the bond pad (6) to the contact pad (7) above at least part (17) of the dielectric layer.
Abstract:
The invention concerns electrical insulation of assembled chips (2), before being bonded into a single unit (9, 13). It comprises steps which consist in: applying a protective dielectric layer on at least an active surface (6) of a chip (3) of the wafer; placing then fixing on its substrate (8) the chip (3), by bonding its rear surface, a periphery of the protective layer (14) forming a barrier (15); and connecting after protecting, at least a contact pad (10) to the corresponding pad (7). The invention is useful for making portable smart objects, such as chip cards or labels.
Abstract:
The invention concerns an intelligent portable object of ISO 7816 format comprising a communication interface (25) and a laminate card body wherein is housed a chip (28). Said card comprises at least a data storage unit (29) co-operating with the chip (28), the storage unit (29) being physically separate from the chip (28) and housed in the card body at a site located at some distance from the main flexural lines of the card and in the neutral fibre of the card, and spacers providing proximate to the components including the chip (28) and the storage unit (29) local control of the bending of the card.
Abstract:
The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.