Abstract:
A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Special polyoxyalkylated precursor solutions are designed to optimize polarizability of the corresponding metal oxide materials by adding dopants including stoichiometric excess amounts of bismuth and tantalum. The RTP baking process is especially beneficial in optimizing the polarizability of the resultant metal oxide.
Abstract:
A non-volatile integrated circuit memory (10, 11, 100, 200) in which the memory cell (10, 11) includes a first transistor gate (19, 36) overlying a first channel region (44A), a ferroelectric material (48) overlying a second channel region (44B), and a second transistor gate (23, 37) overlying a third channel region (44C). The channel regions (44A, 44B, 44C) are connected in series, and preferably are contiguous portions of a single semiconducting channel (44). The first channel (44A) is connected to a plate voltage that is 20 % to 50 % of the coercive voltage of the ferroelectric material. A sense amplifier (110) is connected to the third channel region (44C) via a bit line (108). The rise of the bit line after reading a logic "1" state of the cell is prevented from disturbing the ferroelectric material by shutting off the third channel before the sense amplifier rises.
Abstract:
A liquid precursor containing a metal is applied to a substrate (18), RTP baked, and annealed to form a layered superlattice material (30). To obtain good electrical properties, prebaking the substrate (18) in oxygen in the RTP and anneal are essential, except for high bismuth content precursors. Excess bismuth between 110 % and 140 % of stoichiometry and RTP temperature of 750 DEG C is optimum. The film is formed in two layers (30A, 30B), the first of which uses a stoichiometric precursor and the second of which uses an excess bismuth precursor.
Abstract:
A thin-film zinc oxide varistor (10) for use in integrated circuits and the like is produced by applying a polyoxyalkylated metal complex, such as a metal alkoxycarboxylate, to a substrate (12, 14, and 16) for the formation of a dried non-ohmic layer (18). The method of production includes the steps of providing a substrate and a precursor solution including a polyoxyalkylated zinc complex (P22, P24), coating a portion of the substrate with the precursor solution (P26), drying the coated substrate (P32), and crystallizing the dried thin-film zinc oxide layer (P30). The resultant crystalline zinc oxide varistor layer (18) may be doped with bismuth, yttrium, praseodymium, cobalt, antimony, manganese, silicon, chromium, titanium, potassium, dysprosium, cesium, cerium, and iron to provide a non-ohmic varistor. The varistor layer (10) is annealed at a temperature ranging from about 400 to about 1000 DEG C to provide a layer having a thickness ranging from about 50 nanometers to about 500 nanometers and an average grain size diameter less than about 200 nanometers.
Abstract:
A liquid precursor containing a metal is applied to a first electrode, RTP backed at a temperature of 700 DEG C, and annealed at the same temperature from 3 to 5 hours to form a layered superlattice material. A second electrode is formed to form a capacitor, and a second anneal is performed at a temperature of 700 DEG C. If the material is strontium bismuth tantalate, the precursor contains u mole-equivalents of strontium, v mole-equivalents of bismuth, and w mole-equivalents of tantalum, where 0.8
Abstract:
A ferroelectrique capacitor used in a memory cell section of a ferroelectric memory device comprises a polarization P1 region having a film thickness (d) and an area S1, and a polarization P2 region which is a component in the P1 direction of oblique polarization P2 having only one electrode section and an area S2. The combined hysteresis characteristics of the polarizations P1 and P2 include a twisted hysteresis characteristic. When the memory state of the twisted hysteresis characteristic is "0" and "1", nondestructive readout is possible due to a back switching phenomenon. A ferroelectric memory device of another mode of this invention comprises a ferroelectric capacitor (11) which has a multiplex hysteresis characteristic having at least three stable polarization values attributed to the twisted hysteresis characteristic and is formed by sandwiching a ferroelectric material which stores multilevel voltages resulting from the multiplex hysteresis characteristic as information between electrode materials, dielectric capacitor (12) connected in series to the capacitor (11), and voltage-current converting element (16) which reads out the multilevel information stored in the capacitor (11).
Abstract:
A method of fabricating a layered superlattice DRAM (100) compatible with conventional silicon CMOS technology. A MOSFET (72) is formed on a silicon substrate (71). A thick layer (77D) of BPSG followed by a thin SOG layer (77E) overlies the MOSFET (72). A capacitor (80) is formed by depositing a layer (81) of platinum, annealing, depositing an intermediate layer (84) comprising a layered superlattice material, annealing, depositing a second layer (84) of platinum, then patterning the capacitor (80). Another SOG layer (86) is deposited, contact holes (106, 107) to the MOSFET (72) and capacitor (80) are partially opened, the SOG (86) is annealed, the contact holes (106, 107) are completely opened, and a Pt/Ti/PtSi wiring layer (88, 288) is deposited.
Abstract:
A method and apparatus for programming ferroelectric memory cells (200, 600) which reduces polarizability fatigue effects of switching polarization of the ferroelectric devices (202) associated with the memory cells such as ferroelectric capacitors (202) and transistors (602). Alteration of the pulse width duty cycle associated with signals used to switch ferroelectric device polarization is shown to reduce polarizability fatigue of the ferroelectric material (608) thereby increasing the useful life of ferroelectric memory cells (200, 600). Methods and apparatus for producing a signal pulse duty cycle in the range 2-30 % is disclosed and shown to improve the useful life of the ferroelectric material (608).
Abstract:
A method and apparatus for programming ferroelectric memory cells (100, 200) which reduce fatigue effects of switching polarization of the ferroelectric devices associated with the memory cells such as ferroelectric capacitors (102, 202) and transistors (1002). Alteration of the rise and fall times associated with signals used to switch ferroelectric device polarization reduces fatigue of the ferroelectric material thereby increasing the useful life of ferroelectric memory cells. Slowing the rise and fall times as well as the rate of signal level rise and fall, (signal shape), reduces fatigue effects of switching polarization of ferroelectric devices. Methods and apparatus for producing a triangular ("sawtooth") signal waveform (322), a Gaussian signal waveform (422), and a waveform (522) having exponential rise anf fall times are disclosed.
Abstract:
An integrated memory unit (12, 600) includes a capacitor (30, 30A), a transistor (32, 32A), and saturation means (29, 25, 14, 62, 43, 15, 61; 71A, 72A) for polarizing the ferroelectric material (50, 74) to saturation with a voltage of less than 10 volts. One electrode (47, 49A) of the capacitor and the transistor gate (33, 33A) are the same conductive member. The other electrode may be formed by extensions (71A, 72A) of the transistor source (71) and drain (77) underlying the gate (33A). The capacitor (230, 30A) has a capacitance Cf, and an area Af, and the transistor (232, 32A) forms a gate capacitor (233, 255, 266) having an area Ag and a gate capacitance Cg, a gate overlap b, and a channel depth a. The ferroelectric material (250, 74) has a dielectric constant ELEMENT f and the gate insulator (268, 86) has a dielectric constant ELEMENT g. The memory unit has the parametric relationships: Cf /= 2a, and ELEMENT g >/= ELEMENT f/8.