Abstract:
A liquid precursor containing a metal is applied to a first electrode, RTP backed at a temperature of 700 DEG C, and annealed at the same temperature from 3 to 5 hours to form a layered superlattice material. A second electrode is formed to form a capacitor, and a second anneal is performed at a temperature of 700 DEG C. If the material is strontium bismuth tantalate, the precursor contains u mole-equivalents of strontium, v mole-equivalents of bismuth, and w mole-equivalents of tantalum, where 0.8
Abstract:
A liquid precursor containing a metal is applied to a substrate, RTP baked, and annealed to form a layered superlattice material. Special polyoxyalkylated precursor solutions are designed to optimize polarizability of the corresponding metal oxide materials by adding dopants including stoichiometric excess amounts of bismuth and tantalum. The RTP baking process is especially beneficial in optimizing the polarizability of the resultant metal oxide.
Abstract:
A non-volatile integrated circuit memory (10, 11, 100, 200) in which the memory cell (10, 11) includes a first transistor gate (19, 36) overlying a first channel region (44A), a ferroelectric material (48) overlying a second channel region (44B), and a second transistor gate (23, 37) overlying a third channel region (44C). The channel regions (44A, 44B, 44C) are connected in series, and preferably are contiguous portions of a single semiconducting channel (44). The first channel (44A) is connected to a plate voltage that is 20 % to 50 % of the coercive voltage of the ferroelectric material. A sense amplifier (110) is connected to the third channel region (44C) via a bit line (108). The rise of the bit line after reading a logic "1" state of the cell is prevented from disturbing the ferroelectric material by shutting off the third channel before the sense amplifier rises.
Abstract:
A liquid precursor containing a metal is applied to a substrate (18), RTP baked, and annealed to form a layered superlattice material (30). To obtain good electrical properties, prebaking the substrate (18) in oxygen in the RTP and anneal are essential, except for high bismuth content precursors. Excess bismuth between 110 % and 140 % of stoichiometry and RTP temperature of 750 DEG C is optimum. The film is formed in two layers (30A, 30B), the first of which uses a stoichiometric precursor and the second of which uses an excess bismuth precursor.
Abstract:
A thin-film zinc oxide varistor (10) for use in integrated circuits and the like is produced by applying a polyoxyalkylated metal complex, such as a metal alkoxycarboxylate, to a substrate (12, 14, and 16) for the formation of a dried non-ohmic layer (18). The method of production includes the steps of providing a substrate and a precursor solution including a polyoxyalkylated zinc complex (P22, P24), coating a portion of the substrate with the precursor solution (P26), drying the coated substrate (P32), and crystallizing the dried thin-film zinc oxide layer (P30). The resultant crystalline zinc oxide varistor layer (18) may be doped with bismuth, yttrium, praseodymium, cobalt, antimony, manganese, silicon, chromium, titanium, potassium, dysprosium, cesium, cerium, and iron to provide a non-ohmic varistor. The varistor layer (10) is annealed at a temperature ranging from about 400 to about 1000 DEG C to provide a layer having a thickness ranging from about 50 nanometers to about 500 nanometers and an average grain size diameter less than about 200 nanometers.
Abstract:
A method and apparatus for programming ferroelectric memory cells (200, 600) which reduces polarizability fatigue effects of switching polarization of the ferroelectric devices (202) associated with the memory cells such as ferroelectric capacitors (202) and transistors (602). Alteration of the pulse width duty cycle associated with signals used to switch ferroelectric device polarization is shown to reduce polarizability fatigue of the ferroelectric material (608) thereby increasing the useful life of ferroelectric memory cells (200, 600). Methods and apparatus for producing a signal pulse duty cycle in the range 2-30 % is disclosed and shown to improve the useful life of the ferroelectric material (608).
Abstract:
A method and apparatus for programming ferroelectric memory cells (100, 200) which reduce fatigue effects of switching polarization of the ferroelectric devices associated with the memory cells such as ferroelectric capacitors (102, 202) and transistors (1002). Alteration of the rise and fall times associated with signals used to switch ferroelectric device polarization reduces fatigue of the ferroelectric material thereby increasing the useful life of ferroelectric memory cells. Slowing the rise and fall times as well as the rate of signal level rise and fall, (signal shape), reduces fatigue effects of switching polarization of ferroelectric devices. Methods and apparatus for producing a triangular ("sawtooth") signal waveform (322), a Gaussian signal waveform (422), and a waveform (522) having exponential rise anf fall times are disclosed.
Abstract:
An integrated memory unit (12, 600) includes a capacitor (30, 30A), a transistor (32, 32A), and saturation means (29, 25, 14, 62, 43, 15, 61; 71A, 72A) for polarizing the ferroelectric material (50, 74) to saturation with a voltage of less than 10 volts. One electrode (47, 49A) of the capacitor and the transistor gate (33, 33A) are the same conductive member. The other electrode may be formed by extensions (71A, 72A) of the transistor source (71) and drain (77) underlying the gate (33A). The capacitor (230, 30A) has a capacitance Cf, and an area Af, and the transistor (232, 32A) forms a gate capacitor (233, 255, 266) having an area Ag and a gate capacitance Cg, a gate overlap b, and a channel depth a. The ferroelectric material (250, 74) has a dielectric constant ELEMENT f and the gate insulator (268, 86) has a dielectric constant ELEMENT g. The memory unit has the parametric relationships: Cf /= 2a, and ELEMENT g >/= ELEMENT f/8.
Abstract:
A substrate (17) is prebaked (412) in an oxygen furnace. A thin film (60) of layered superlattice oxide is formed on the substrate (17) by a chemical vapor deposition process (420). The film (60) is RTP baked (424) to provide grains with a mixed phase of A-axis and C-axis orientation. The film (60) may be treated by ion implantation (422) prior to the RTP bake (424) and oxygen furnace annealed (426) after the RTP bake. An electrode (77) is deposited on the layered superlattice thin film (60) and then the film and electrode are oxygen furnace annealed (432).
Abstract:
A ferroelectric, non-volatile memory (336) includes a constant voltage source (85), a bit line (79), a memory cell (70) having a first ferroelectric capacitor (76) connected between the bit line (79) and the constant voltage source (85), a source (105) of a reference voltage, and a latch (74) connected between the bit line (79) and the reference voltage source (105). The latch (74) drives the bit line (79) to the same logic state as the ferroelectric capacitor (76) to read and rewrite the capacitor (76) in a single operation. The reference voltage is between QI/CD and QSW/CD + QI/CD, where QI is the linear capacitance of said first ferroelectric capacitor (76), CD is the capacitance of said bit line (79), and QSW is the switching charge of said first ferroelectric capacitor (76). In one embodiment, the reference voltage is provided by a ferroelectric dummy capacitor (141) having an area smaller than the area of the first capacitor (128) but greater than 1/2 the area of the first capacitor (128).