Abstract:
The present disclosure relates to the fabrication of spin transfer torque memory devices, wherein a spin transfer torque element is connected to a PMOS transistor. In one embodiment, the spin transfer torque element may have a fixed side and a free side with a tunnel barrier layer disposed between the fixed side and the free side, and the PMOS transistor may have a drain structure which is electrically connected to the fixed side of the spin transfer torque element.
Abstract:
Example implementations of the present disclosure relate to improved computational accuracy in a crossbar array. An example system may include a crossbar array, having a plurality of memory elements at junctions, usable in performance of computations. The example system may further include a calculate engine to calculate ideal conductance of memory elements at a plurality of junctions of the crossbar array and a determine engine to determine conductance of the memory elements at the plurality of junctions of the crossbar array. An adjust engine of the example system may be used to adjust conductance of at least one memory element to improve computational accuracy by reduction of a difference between the ideal conductance and the determined conductance of the at least one memory element.
Abstract:
A one-transistor (1T), one-selector (1S), one magnetic tunnel junction (1MTJ), spin torque transfer (STT), spin Hall effect (SHE), magnetic random access memory (MRAM) may be configured to provide separate write current and read current paths. In such a configuration, the write current may pass through a SHE electrode disposed proximate the MTJ device. The direction of write current flow through the SHE electrode determines spin polarization of the write current, the magnetic field orientation of a free magnetic layer in the MTJ device, and consequently the resistance of the MTJ device. The write current can be at a level sufficient to cause the reliable storage of binary information in the MTJ device. The read current, at a lower level than the write current, passes through the MTJ.
Abstract:
Shared source line magnetic tunnel junction (MTJ) bit cells (300A) employing uniform MTJ connection patterns for reduced area are disclosed. In one aspect, a two (2) transistor, two (2) MTJ (2T2MTJ) bit cell includes a shared source line system having first and second source lines. A uniform MTJ connection pattern results in the first source line (SL1) disposed in an upper metal layer and electrically coupled to a free layer of a first MTJ (304), and the second source line (SL2) disposed in a lower metal layer and electrically coupled to a second access transistor (310). Middle segments are disposed in middle metal layers to reserve the middle metal layers for strap segments (368) of a strap cell (300B) that is used to electrically couple the first and second source lines. Electrically coupling the first and second source lines using the strap cell allows each MTJ to logically share a single source line.
Abstract:
Described is an apparatus which comprises: a first transistor; a second transistor having a first terminal coupled to a first terminal of the first transistor; a first conductor coupled to a second terminal of the second transistor; a magnetoelectric (ME) layer coupled to the first conductor; and a ferromagnetic (FM) layer coupled to the ME layer and to a second terminal of the first transistor.
Abstract:
A magnetic memory device (100) comprising a plurality of magnetic units (1), each unit including a first and second magnetic tunnel junctions (2, 2') electrically connecting in series by a current line (3) and a strap (7), the two junctions (2, 2') comprising a first and second storage layer (23, 23') having a first and second storage magnetization (230, 230') respectively and a first and second sense magnetic layer (21, 21') having a first and second senses magnetization (210, 210') respectively; a field line (4) configured to provide an input signal (41) generating a first and second magnetic field (42, 42') for varying the first and second sense magnetization (210, 210'); each magnetic unit (1) being provided with a data state such that the first and second storage magnetizations (230, 230') are aligned in opposed directions; the first and second magnetic field (42, 42') being adapted for varying respectively the first and second sense magnetization (210, 210') in a first and second direction opposed to the first direction.
Abstract:
A device includes a first magnetic tunnel junction (MTJ) element having a first read margin and a second MTJ element having a second read margin. The first read margin is greater than twice the second read margin. The device also includes an access transistor connected between the first MTJ element and the second MTJ element. A gate of the access transistor is coupled to a word line. The first MTJ element, the second MTJ element, and the access transistor form a multi-bit spin torque transfer magnetoresistive random access memory (STT-MRAM) memory cell.
Abstract:
A nonvolatile memory cell includes a volatile selector electrically coupled in series with a nonvolatile memory device. The nonvolatile memory device includes a switching oxide or switching nitride sandwiched between a first bottom electrode and a first top electrode. The volatile selector includes a selector insulator sandwiched between a second bottom electrode and a second top electrode. The selector insulator may be composed of a composite material of a dielectric and fast-diffusing cation metal particles. A memory array including a plurality of the nonvolatile memory cells is also disclosed.
Abstract:
Magnetic random access memory (MRAM) bit cells (200) employing source lines (204) and/or bit lines (206) disposed in multiple, stacked metal layers to reduce MRAM bit cell resistance are disclosed. Related methods and systems are also disclosed. In aspects disclosed herein, MRAM bit cells are provided in a memory array. The MRAM bit cells are fabricated in an integrated circuit (IC) (202) with source lines and/or bit lines formed by multiple, stacked metal layers disposed above a semiconductor layer (210) to reduce the resistance of the source lines. In this manner, if node size in the IC is scaled down, the resistance of the source lines and/or the bit lines can be maintained or reduced to avoid an increase in drive voltage that generates a write current for write operations for the MRAM bit cells.