Abstract:
The present techniques generally relate to fabrication of layered correlated electron materials (CEMs) in which a first group of one or more layers may comprise a first concentrationof a dopant species, and wherein a second group of one or more layers may comprise a second concentration of a dopant species. In other embodiments, a CEM may comprise one or more regions of graded concentration of a dopant species.
Abstract:
Die Erfindung betrifft ein Verfahren zur Herstellung von Schichten von ReRAM-Speichern sowie die Verwendung eines Implanters. Erfindungsgemäß werden für die Herstellung von ReRAM-Speichern TMO-Schichten in einer gewünschten Reihenfolge auf eine Elektrode aufgebracht und dabei mindestens eine TMO-Schicht mittels eines lonenimplanters mit Ionen, beispielsweise Sauerstoffionen beschossen, so dass eine Importation von Ionen in diese TMO-Schicht bewirkt wird.
Abstract:
The disclosed resistive switching memory cell comprises a switchable solid electrolyte matrix comprising a metal oxide/sulphide/selenide comprising at least two metals M1 and M2, and a metal M3 which is mobile in the matrix, wherein - the atomic ratio of M1 to M2 is within the range of 75:25 to 99.99:0.01; - the valence states of M1, M2 and M3 are all positive; - the valence state of M1 is larger than the valence state of M2; and - the valence state of M2 is equal to or larger than the valence state of M3. Most preferred is amorphous silicon dioxide with M2=AI partially replacing M1=Si atoms, and containing M3=Cu.
Abstract:
A resistive memory cell is integrated with a selector. The device structure includes a stack of a first electrode, one of a selector or a resistive switching layer, and a second electrode formed in a device layer of a multilayer structure of a plurality of alternating device layers and separation layers. Each second electrode is separated from other second electrodes. The device structure further includes the other of the resistive switching layer or the selector formed in contact with a plurality of the second electrodes. The device structure further includes a third electrode formed in contact with the resistive switching layer or the selector layer. A method for manufacturing the device structure is also provided.
Abstract:
Resistive RAM (RRAM) devices having increased reliability and related manufacturing methods are described. Greater reliability of RRAM cells over time can be achieved by avoiding direct contact of metal electrodes with the device switching layer. The contact can be avoided by cladding the switching layer in a material such as silicon or using electrodes that may contain metal but have regions that are adjacent the switching layer and lack free metal ions except for possible trace amounts.
Abstract:
본 발명은 제 1 전극, 제 2 전극 및 상기 제 1 전극과 상기 제 2 전극 사이에 형성되는 금속산화물을 포함하는 저항변화 메모리 소자가 제공된다. 구체적으로 상기 금속산화물은 서로 결정방향의 차이를 가지며 경계영역을 이루는 제 1 결정립 및 제 2 결정립을 포함하고, 상기 경계영역에는 상기 금속산화물의 결정면 중 결정학적으로 산소로만 이루어진 면에 해당되는 면지수를 가지는 면이 상기 제 1 결정립 및 상기 제 2 결정립 사이에 개재되고, 상기 경계영역은 상기 제 1 전극과 상기 제 2 전극 간에 전압이 인가될 경우 전기전도가 가능한 경로가 형성되는 면인, 저항변화 메모리 소자가 제공된다.
Abstract:
A resistive memory device includes a first electrode, a memristor coupled in electrical series with the first electrode, a second electrode coupled in electrical series with the memristor, a selector coupled in electrical series with the second electrode, and a third electrode coupled in electric series with the selector. The memristor includes oxygen or nitrogen elements. The selector includes a composite dielectric material of a first dielectric material, a second dielectric material that is different from the first dielectric material, and a dopant material including a cation having a migration rate faster than the oxygen or the nitrogen elements of the memristor. The first dielectric material and the second dielectric material are present in a ratio ranging from 1:9 to 9:1, and a concentration of the dopant material in the composite dielectric material ranges from about 1% up to 50%.
Abstract:
Providing for solid state memory having a non-linear current-voltage (I-V) response is disclosed herein. By way of example, the subject disclosure provides a selector device. The selector device can be formed in series with a non-volatile memory device via a monolithic fabrication process. Further, the selector device can provide a substantially non-linear I-V response suitable to mitigate leakage current for the non-volatile memory device. In various disclosed embodiments, the series combination of the selector device and the non-volatile memory device can serve as one of a set of memory cells in a 1-transistor, many-resistor resistive memory cell array.
Abstract:
Switched memristor digital-to-analog conversion employs a set of switch-selectable programmed resistances corresponding to a digital-to-analog conversion mapping to convert a digital input into an analog output. The digital input is to establish an analog resistance of a plurality of switched memristors connected in series that are switch selectable. The plurality of switched memristors is to provide the set of switch-selectable programmed resistances in accordance with the digital-to-analog conversion mapping.
Abstract:
Providing for solid state memory having a non-linear current-voltage (I-V) response is disclosed herein. By way of example, the subject disclosure provides a selector device. The selector device can be formed in series with a non-volatile memory device via a monolithic fabrication process. Further, the selector device can provide a substantially non-linear I-V response suitable to mitigate leakage current for the non-volatile memory device. In various disclosed embodiments, the series combination of the selector device and the non-volatile memory device can serve as one of a set of memory cells in a 1-transistor, many-resistor resistive memory cell array.