Abstract:
미들 하우징; 일단이 상기 미들 하우징의 좌우 양측에 각각 결합한 제1 프레임과 제2 프레임을 포함하는 프레임; 상기 프레임에 결합하여 전자 부품이 실장되는 본체 하우징; 및 상기 제1 프레임과 상기 제2 프레임 사이의 각도 또는 배치를 조정하는 프레임 조정부를 포함하는 전자기기는 사용자의 목에 거는 밴드의 각도를 변화시킬 수 있는 프레임 조정부를 포함하여, 탈착이 편리하고 착용시에 안정적으로 고정할 수 있다.
Abstract:
Devices or circuits based on spin torque transfer (STT) and Spin Hall effect are disclosed by using a spin Hall effect (SHE) metal layer coupled to a magnetic free layer for various applications. The efficiency or strength of the STT effect based on this combination of SHE and STT can be enhanced by an interface modification between the SHE metal layer and the magnetic free layer or by modifying or engineering the SHE metal layer by doping the SHE metal with certain impurities or other means.
Abstract:
In one aspect, a vertical Hall effect sensor (14) includes a semiconductor wafer (12) having a first conductivity type and a plurality of semiconductive electrodes (118,120A,120B,122A,122B) disposed on the semiconductor wafer. The plurality of semiconductive electrodes have the first conductivity type and include a source electrode (118), a first sensing electrode (120A) and a second sensing electrode (120B), arranged such that the source electrode is between the first sensing electrode and the second sensing electrode and a first drain electrode (122A) and a second drain electrode (122B), arranged such that the first sensing electrode, second sensing electrode, and source electrode are between the first drain electrode and the second drain electrode. The vertical Hall effect sensor also includes a plurality of semiconductor fingers (124A,124B,124C,124D) disposed on the semiconductor wafer and interdigitated with the plurality of semiconductive electrodes, the semiconductor fingers having a second conductivity type.
Abstract:
Methods and apparatus to provide an integrated circuit package having a conductive leadframe (204), a non-conductive die paddle (200) mechanically coupled to the leadframe, and a die (206) disposed on the die paddle and electrically connected (208) to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.
Abstract:
An ST-MRAM structure, a method for fabricating the ST-MRAM structure and a method for operating an ST-MRAM device that results from the ST-MRAM structure each utilize a spin Hall effect base layer that contacts a magnetic free layer and effects a magnetic moment switching within the magnetic free layer as a result of a lateral switching current within the spin Hall effect base layer. This resulting ST-MRAM device uses an independent sense current and sense voltage through a magnetoresistive stack that includes a pinned layer, a non-magnetic spacer layer and the magnetic free layer which contacts the spin Hall effect base layer. Desirable non-magnetic conductor materials for the spin Hall effect base layer include certain types of tantalum materials and tungsten materials that have a spin diffusion length no greater than about five times the thickness of the spin Hall effect base layer and a spin Hall angle at least about 0.05.
Abstract:
L'invention concerne un composant électronique (1), tel que notamment un capteur à effet Hall ainsi qu'un procédé de fabrication associé. Selon l'invention le composant électronique (1) comporte une pluralité de pattes de connexion (2, 2 '2") dont au moins deux pattes (2,2") sont entourées par un élément capacitif torique (3), les différents éléments capacitifs (3) étant reliés électriquement à une patte de mise à la masse électrique (2'), au niveau de leurs parois extérieures (5) permettant de constituer un composant électronique à filtrage intégré.
Abstract:
The invention relates to a hall sensor (1) comprising two opposite-lying power supply contact electrodes (7a, 7c) between which an active region (5) is defined. Said electrodes are provided for generating a current flow through the active region. The inventive hall sensor also comprises two opposite-lying voltage tapping contact electrodes (7b, 7d) for tapping a hall voltage, whereby a section of each contact electrode facing the active region (5) is shaped in such a way that the interfering influence of the contacts on the offset-reducing effect of the spinning current operation is reduced.
Abstract:
In one aspect, a Hall Effect sensing element (100) includes a Hall plate (114) having a thickness less than about 100 nanometers an adhesion layer (110) directly in contact with the Hall plate and having a thickness in a range about 0.1 nanometers to 5 nanometers. In another aspect, a sensor includes a Hall Effect sensing element. The Hall Effect sensing element (100') includes a substrate (102) that includes one of a semiconductor material or an insulator material, an insulation layer (106) in direct contact with the substrate, an adhesion layer (110) having a thickness in a range of about.1 nanometers to 5 nanometers and in direct contact with the insulation layer and a Hall plate (114) in direct contact with the adhesion layer and having a thickness less than about 100 nanometers.
Abstract:
Offenbart wird ein Verfahren zur Herstellung eines Hallsensors, wobei auf einem Wafer (10) mit einem ASIC zuerst eine Isolierschicht (20) aufgebracht oder in den Wafer integriert wird, darauf eine Hallschicht (30), beispielsweise aus InSb oder einem anderen III-V-Halbleitermaterial, angeordnet wird und diese dann mittels eines Lasers (40) wenigstens abschnittsweise rekristallisiert wird. Zum thermischen Schutz des ASICs kann die Isolierschicht porös sein oder eine Kaverne oder Reflexionsschicht aufweisen.