Abstract:
Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.
Abstract:
A method for controlling a brazing process, including the steps of applying a welding current through an electrode (52) pressed to a metal surface (83) of a workpiece to form a welding arc. Further steps are continuously measuring the welding current and the welding time, continuously determining supplied energy on the basis of the welding current and the welding time, digitally switching current supplied from batteries of a DC source (10) and to maintain a substantially constant welding current, interrupting the supply of welding current when a predetermined amount of energy has been supplied and supplying heat to batteries when a temperature of the batteries is below a predetermined value. The apparatus comprises a control module (31 ) with a central unit (26)and a power control unit (28) wherein the central unit (26) and the control unit (28) are operatively connected for continuously measuring the welding current, a switched circuit module (12) producing a substantially constant welding current of a predetermined value and a first temperature transducer (36) provided in the vicinity of batteries included in the DC source (10). A heat transfer means (34; 70) is activated when the temperature of the batteries is below a predetermined value.
Abstract:
A heater chip for thermocompression bonding, where the degree of heating at a thermocompression bonding part does not vary among individual heater chips and durability is enhanced. In a heater chip for thermocompression bonding, a small projection-like thermocompression bonding portion (2) heating up by conduction resistance is provided on a small plate-like body (1), on the head end side having a reduced width. A cut (3) is provided in the body, from the base end side toward the vicinity of the thermocompression bonding portion. Each of both sides of the cut serves as a conducting terminal portion (1a, 1b). A thermocouple (5) for temperature detection is installed in the vicinity of the thermocompression bonding portion (2). A projection portion (7) for thermo-welding a temperature detection portion of the thermocouple is provided on an inner side surface of the cut or on the outer peripheral side surface of the body.
Abstract:
A heater tip for thermocompression bonding capable of eliminating the possibilities of separation of the thermo-detecting part of a thermocouple and breakage of leads by heating and vibration, wherein a set of power terminal parts, a heat-pressure welded part (2) heated by an energization resistance, and a part for a thermocouple for temperature control are provided in a small plate piece (1) manufactured by forging a tungsten alloy, a cutout part (5) for inserting the connected end part of the thermocouple (6) is recess-formed near the heat-pressure welded part (2) starting from the edge part of the small plate piece, and the thermo-detecting part (7) formed by thermally fusing the connected end part is fitted to the small plate piece so as to cover the side end face of the small plate piece and the mouth edge part of the cut-in part.
Abstract:
Die Erfindung betrifft eine Fertigungslinie zum Löten von Bauteilen (1) auf eine Leiterplatte (2), umfassend: einen Lötofen (3) mit mindestens zwei Temperaturzonen (Z1,Z2,..), in denen ein vorgegebenes Temperaturprofil (Tp) herrscht, eine Transportvorrichtung (4), die dazu ausgestaltet ist, die Leiterplatten (2) durch die Temperaturzonen (Z1,Z2,..) des Lötofens (3) in einer Transportrichtung (Rt) zu transportieren, sowie eine Steuereinrichtung (5); wobei in zumindest einer Temperaturzone (Z1;Z2;..) mindestens zwei Heizelemente (60,61,..) so ausgestaltet und/oder angeordnet sind, dass eine zu verlötende Oberfläche (10) der durch den Lötofen (3) transportierten Leiterplatten (2) von den Heizelementen (60,61,..) geheizt wird, wobei die Heizelemente (60,61,..) in Transportrichtung (Rt) hintereinander versetzt angeordnet und der zu verlötenden Oberfläche (10) zugewandt sind, wobei in zumindest einer der Temperaturzonen (Z1;Z2;..) zumindest zwei in Transportrichtung (Rt) hintereinander versetzt angeordnete und der zu verlötenden Oberfläche (10) zugewandte Lüfter (70,71,..) vorgesehen sind, und wobei die Steuereinrichtung (5) dazu ausgestaltet ist, die Heizelemente (60,61,..) und die Lüfter (70,71,..) so anzusteuern, dass an der zu verlötenden Oberfläche (10) der Leiterplatte (3) das vorgegebene Temperaturprofil (Tp) in den Temperaturzonen (Z1;Z2;..) vorliegt.
Abstract:
Procédé de fabrication amélioré d'une pièce aéronautique notamment de grandes dimensions Procédé de fabrication d'une pièce finale métallique de nacelle de turboréacteur (4) comprenant le brasage d'au moins deux pièces l'une interne (5) présentant une surface interne et l'autre externe (6) présentant une surface externe, le procédé comprenant une étape de chauffage de la surface externe de la pièce externe par un moyen de chauffage externe (2) et étant caractérisé en ce qu'il comprend une étape de chauffage de la surface interne de la pièce interne par un moyen de chauffage interne (9).
Abstract:
Ein Verfahren zum Hartlöten wird bereitgestellt, bei dem eine amorphe oder teilamorphe Hartlotfolie mit einer Zusammensetzung, die einen Metalloidgehalt von 10 bis 30 Atom% aufweist, an einer Verbindungsstelle zweier oder mehrerer Teile angeordnet wird. Die Hartlotfolie weist die Gestalt eines gewickelten Ringbands auf, das einen kurzgeschlossenen Strompfad zwischen mindestens zwei aufeinanderliegenden Lagen aufweist. Die Hartlotfolie wird induktiv erwärmt geschmolzen und eine hartgelötete Verbindung der Teile erzeugt.
Abstract:
Bei einem Verfahren zum Löten von Kontaktdrähten an eine Seite einer Solarzelle zur Herstellung der elektrischen Kontaktierung weisen die Solarzellen mindestens einen metallischen streifenförmigen Bereich auf. Auf diesen wird ein Kontaktdraht zum elektrischen Anschluss der Solarzelle aufgelötet wobei die Lötdauer bzw. die Dauer des Energieeintrags von außen an den Lötbereich sehr kurz ist und weniger als 800 ms beträgt.
Abstract:
A hot iron such as a soldering iron, a plastic welding machine, iron, hair iron, and others, which is used while a workpiece is being observed, particularly those which can be used several seconds after a switch is turned on, wherein a hot iron is formed by thinning a metal plate made of an iron chromium alloy as a heater wire (3) to a limit at which the shape of that metal can be maintained, forming an electrical insulation body (2) with a thin plate such as an aluminum nitride which is approx. 10 times higher in thermal conductivity than the heater wire (3), using, as an iron tip heat storing part (1), a steel which is 2 times or more higher in thermal conductivity and which is larger in thermal capacity than the electrical insulation body (2), and sticking them closely to each other by pressing them with a heat insulated supporting device; a method of controlling the hot iron such as a soldering iron, comprising the steps of feeding a large set power to the heater wire (3) for a set short time every time switches (4, 7) are operated so as to raise the temperature of the iron tip heat storing part (1) rapidly so that a desired temperature can be obtained by several simple operations of the switches (4, 7).