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91.发明公开
公开(公告)号：EP3840040A1
公开(公告)日：2021-06-23
申请号：EP20214010.9
申请日：2020-12-15
Applicant: STMicroelectronics S.r.l.
Inventor： TIZIANI, Mr. Roberto , MAZZOLA, Mr. Mauro
IPC: H01L23/495
Abstract: A leadframe (10) for semiconductor devices, the leadframe (10) comprising a die pad portion (14) having a first planar die-mounting surface (14a) and a second planar surface (14b) opposed the first surface (14a), the first surface (14a) and the second surface (14b) having facing peripheral rims jointly defining a peripheral outline of the die pad (14), wherein:
the die pad (14) comprises at least one package molding compound receiving cavity (18) opening at the periphery of said first planar surface (14a),
the peripheral rims of said first surface (14a) and said second surface (14b) are mutually offset to provide a stepped peripheral outline of the die pad (14) with the periphery of said first planar surface (14a) having a peripheral region protruding with respect to the second planar surface (14b), wherein said at least one package molding compound receiving cavity (18) is provided at said protruding region of the first planar surface (14a), and
the at least one package molding compound receiving cavity (18) partially overlaps and goes through said stepped peripheral outline of the die pad (14).-
公开(公告)号：EP3839957A1
公开(公告)日：2021-06-23
申请号：EP20215193.2
申请日：2020-12-17
Applicant: STMicroelectronics S.r.l.
Inventor： PERRONI, Maurizio Francesco , DISEGNI, Fabio Enrico Carlo , MANFRE', Davide , TORTI, Cesare
IPC: G11C13/00
Abstract: The column decoder of a PCM device is divided into two portions that can be governed independently of one another, and the driving signals of the two portions are configured so as to guarantee comparable capacitive loads at the two inputs of a sense amplifier in both of the operations of single-ended reading (used, for example, during verification of data previously written in the memory) and double-ended reading (reading proper of the data during use). In particular, during single-ended reading, the sense amplifier has a first input that receives a capacitive load corresponding to the direct memory cell selected, i.e., the cell that is being read, and a second input that receives a capacitive load associated to a non-selected complementary memory cell, i.e., a cell that is off.
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公开(公告)号：EP3839956A1
公开(公告)日：2021-06-23
申请号：EP20213992.9
申请日：2020-12-15
Applicant: STMicroelectronics S.r.l.
Inventor： DISEGNI, Fabio Enrico Carlo , PERRONI, Maurizio Francesco , TORTI, Cesare , MANFRE', Davide
Abstract: A non-volatile memory device (100) including an array (102A_R) of memory cells (3), coupled to word lines (WL_dx), and a row decoder (105) including a pull-down stage (110L, 110R) and a pull-up stage (118), which includes, for each word line (WL_dx): a corresponding control circuit (199), which generates a corresponding control signal (Vcomm ); and a corresponding pull-up switch circuit (122R, 126R), which is controlled via the control signal (Vcomm ) so as to couple/decouple the word line (WL_dx) to/from the supply (V DD ). The control circuit (199) includes: a current mirror (200,300), which injects a current (11) into an internal node (INT); and a series circuit (202,204,206,208,210), which couples/decouples the corresponding internal node (INT) to/from ground, on the basis of selection/deselection of the corresponding word line (WL_dx) so as to cause a decrease/increase in a voltage on the corresponding internal node (INT). Each control signal (Vcomm ) is a function of the voltage on the corresponding internal node (INT).
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公开(公告)号：EP3839520A1
公开(公告)日：2021-06-23
申请号：EP20212118.2
申请日：2020-12-07
Applicant: STMicroelectronics S.r.l.
Inventor： DARMANIN, Jean Marie , VALZASINA, Carlo , TOCCHIO, Alessandro , GATTERE, Gabriele
IPC: G01P15/125 , B81B3/00 , B81B5/00 , G01L1/14 , G01P15/08
Abstract: A micromechanical device (50) comprising: a semiconductor body (51); a first mobile structure (53; 253); an elastic assembly (57, 59; 259), coupled to the first mobile structure and to the semiconductor body (51) and adapted to undergo deformation in a direction (X) ; and at least one abutment element (66b; 66a). The elastic assembly (57, 59; 259) is configured to enable an oscillation of the first mobile structure (53; 253) as a function of a force applied thereto. The first mobile structure (53; 253), the abutment element (66b; 66a) and the elastic assembly (57, 59; 259) are arranged with respect to one another in such a way that: when said force is lower than a force threshold, the elastic assembly (57, 59; 259) operates with a first elastic constant (K 1 ; K 4 ); and when said force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant (K 1 + K 2 ; K 5 ) different from the first elastic constant.
Main figure: Figure 2-
95.发明公开
公开(公告)号：EP3838315A1
公开(公告)日：2021-06-23
申请号：EP20212023.4
申请日：2020-12-04
Applicant: STMicroelectronics S.r.l.
Inventor： GIUSTI, Domenico , MARTINI, Irene
Abstract: The microfluidic dispensing device (50) has a plurality of chambers (52) arranged in sequence, each having an inlet receiving a liquid to be dispensed and a nozzle for emitting a drop of liquid; a plurality of actuators (59), one per chamber, receiving an actuation quantity and causing a drop of liquid to be emitted by the nozzle of the respective chamber; a plurality of drop emission detection elements (51), one for each chamber (52), generating an actuation command upon detecting the emission of a drop of liquid; and a sequential activation electric circuit including a plurality of sequential activation elements (60B, 60C, 60D), one for each chamber (52), each coupled to the drop emission detection element (51) of the respective chamber and to an actuator (59) associated with a subsequent chamber in the sequence of chambers. Each sequential activation element receives the actuation command from the drop emission detection element (51) associated with the respective chamber and, in response thereto, activates the actuator associated with the subsequent chamber in the sequence of chambers.
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Patent Agency Ranking96.发明公开
公开(公告)号：EP3832701A1
公开(公告)日：2021-06-09
申请号：EP20210546.6
申请日：2020-11-30
Applicant: STMicroelectronics S.r.l.
Inventor： ZIGLIOLI, Federico Giovanni , PINTUS, Alberto , MAGNI, Pierangelo
IPC: H01L21/48 , H01L23/498 , H01L23/538
Abstract: A method of manufacturing semiconductor devices (10) comprises:
- providing a plastic material substrate (100) having at least one die mounting location (102) for a semiconductor die (104),
- forming metallic traces (108a, 108b) on selected areas of the plastic material substrate (100), wherein the metallic traces (108a, 108b) provide electrically-conductive paths for coupling to the semiconductor die (104),
- attaching the semiconductor die (104) onto the at least one die mounting location (102),
- bonding the semiconductor die (104) attached onto the at least one die mounting location (102) to selected ones of the metallic traces (108a, 108b) formed on the plastic material substrate (100),
- molding package material (110) onto the semiconductor die (104) attached onto the at least one die mounting location (102).-
公开(公告)号：EP3828130A1
公开(公告)日：2021-06-02
申请号：EP20207910.9
申请日：2020-11-16
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar
Abstract: A packaged environmental sensor includes: a supporting structure (17); a sensor die (18), which incorporates an environmental sensor and is arranged on a first side (17a) of the supporting structure (17); a control chip (20), which is coupled to the sensor die (18) and is arranged on a second side (17b) of the supporting structure opposite to the first side (17a); and a ring (21), which is bonded to the first side (17a) of the supporting structure (17) and is open towards the outside in a direction opposite to the supporting structure (17), the sensor die (18) being housed within the ring (21).
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公开(公告)号：EP3761236A3
公开(公告)日：2021-05-19
申请号：EP20178074.9
申请日：2020-06-03
Inventor： CHAWLA, Nitin , ROY, Tanmoy , GROVER, Anuj , DESOLI, Giuseppe
IPC: G06N3/063 , G11C7/10 , G11C11/54 , G06F17/10 , G06F7/509 , G06F7/544 , G06N3/04 , G06N3/08 , G06G7/16
Abstract: A memory array arranged in multiple columns and rows. Computation circuits that each calculate a computation value from cell values in a corresponding column. A column multiplexer cycles through multiple data lines that each corresponds to a computation circuit. Cluster cycle management circuitry determines a number of multiplexer cycles based on a number of columns storing data of a compute cluster. A sensing circuit obtains the computation values from the computation circuits via the column multiplexer as the column multiplexer cycles through the data lines. The sensing circuit combines the obtained computation values over the determined number of multiplexer cycles. A first clock may initiate the multiplexer to cycle through its data lines for the determined number of multiplexer cycles, and a second clock may initiate each individual cycle. The multiplexer or additional circuitry may be utilized to modify the order in which data is written to the columns.
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公开(公告)号：EP3799384A1
公开(公告)日：2021-03-31
申请号：EP20196213.1
申请日：2020-09-15
Applicant: STMicroelectronics S.r.l.
Inventor： ALFARANO, Marco , MASSASCUSA, Sofia
Abstract: Method for introducing personalization data in non volatile memories of a plurality of integrated circuits, comprising
writing in the non volatile memory (61) of a given integrated circuit a static data image (SI), corresponding to an invariant part of non volatile memory common to said plurality of integrated circuits (60) including an operating system, and personalization data images (DI) representing data specific of the given integrated circuit,
said personalization data pertaining a given integrated circuit being arranged in a set of personalization data fields,
wherein said method includes a procedure of generation (205-235) of test data images (I j ) to be stored in said non volatile memory comprising
for each data field (T j ) in said set of personalization data fields (T 1 ...T m ) performing an iterative procedure comprising at each iteration the operations of:
erasing (210) a non volatile memory (61) of a test integrated circuit (60') corresponding to said plurality of integrated circuits,
storing (220) said operating system in said non volatile memory,
storing (230) test personalization data in said non volatile memory,
said storing (230) comprising
generating (232) instances (TPD 1 ...TPD m ) of said test personalization data (TPD) on the basis of a provided (231) reference version (U1) of test personalization data (TPD) arranged in said set of data fields (T 1 ...T m ),
the first instance (TPD 1 ) at the first iteration corresponding to said provided reference version (U1) and the following instances (TPD 2 ...TPD m ) in following iterations corresponding to the reference version (U1 subject to an alteration applied on a different data field (T 1 ...T m ) for each iteration,
dumping (234) an image (I j ) of the non volatile memory (61) corresponding to the current test instance (TPD j ),
performing (235) iteratively said procedure of generation till the last data field in the set of data fields personalization obtaining a corresponding set of test dumped images (I 1 ...I m ) one for each data field (T j ) in said set of personalization data fields (T 1 ...T m ),
comparing (240) each test dumped image (I 1 ...I m ) with the test dumped image (I 1 ) obtained from the reference version (U1) extracting respective location information (LM j ) regarding the memory area in the non volatile memory (61)at which said test dumped image (I 1 ...I m ) differs from the test dumped image (I 1 ) obtained from the reference version,
processing (250) said location information to identify a static memory image (SI) containing only invariant memory slices and a dynamic memory image (DMI) associated to a substitution table (ST) indicating the location of memory area corresponding to each data field (T j ),
writing (270) in an integrated circuit (60) of said plurality of integrated circuits said static image (SI) and a dynamic personalized image (PMI) obtained filling at corresponding locations of memory area in the dynamic memory image (DMI) obtained from the substitution table (ST) the content of respective data fields (T j ) in personalization data (PD) to be specifically associated to said integrated circuit (60).-
100.发明公开
公开(公告)号：EP3799311A1
公开(公告)日：2021-03-31
申请号：EP20196998.7
申请日：2020-09-18
Applicant: STMicroelectronics S.r.l.
Inventor： GATTERE, Gabriele , VALZASINA, Carlo , DUQI, Enri
IPC: H03K17/975
Abstract: A button device (6) includes a MEMS sensor (30), having a MEMS strain detection structure (42) and a deformable substrate (37) configured to undergo deformation under the action of an external force (F). In particular, the MEMS strain detection structure (42) includes a mobile element (62) carried by the deformable substrate (37) via at least a first and a second anchorage (67, 69), the latter fixed with respect to the deformable substrate (37) and are configured to displace and generate a deformation force (F t ) on the mobile element (62) in the presence of the external force (F); and stator elements (70, 72) capacitively coupled to the mobile element (62). The deformation of the mobile element (62) causes a capacitance variation (ΔC) between the mobile element (62) and the stator elements (70, 72). Furthermore, the MEMS sensor (30) is configured to generate detection signals (s C1 , S C2 ; S MEMS , s ref ) correlated to the capacitance variation (ΔC).
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