公开(公告)号：EP2636766A3

公开(公告)日：2016-09-21

申请号：EP13157673.8

申请日：2013-03-04

申请人： The Boeing Company

发明人： PINGREE, Liam ,  WARE, Michael

IPC分类号： C23C16/04 ,  C23C16/26

CPC分类号： C23C16/042 ,  C23C16/26 ,  Y10T428/24802

摘要： Wear parts (12) having run-out and methods of producing the same, systems and control structures used to produce wear parts (12) having run-out, and associated methods and software are disclosed. Some methods utilize a plasma-enhanced chemical vapor deposition process to produce a coating with a desired coating profile (28) on a wear part.

公开(公告)号：EP2910358A3

公开(公告)日：2015-12-02

申请号：EP15157416.7

申请日：2011-07-15

申请人： SiO2 Medical Products, Inc.

发明人： Felts, John T. ,  Giraud, Jean-Pierre ,  Fisk, Thomas ,  Abrams, Robert ,  Ferguson, John ,  Freedman, Jonathan ,  Pangborn, Robert ,  Sagona, Peter J. ,  Rabinne, Bruce ,  Pichot, Herve

IPC分类号： B29C45/40 ,  A61M5/31 ,  A61B5/15

CPC分类号： B29C45/73 ,  A61B5/1438 ,  A61B5/15003 ,  A61B5/150236 ,  A61B5/150244 ,  A61B5/150259 ,  A61B5/150274 ,  A61B5/150351 ,  A61B5/150389 ,  A61B5/150519 ,  A61B5/153 ,  A61B5/154 ,  A61M5/178 ,  A61M5/3129 ,  A61M5/3137 ,  A61M5/31511 ,  A61M5/31513 ,  A61M5/343 ,  A61M2005/3131 ,  A61M2005/3139 ,  A61M2207/00 ,  A61M2207/10 ,  B29C45/0001 ,  B29C45/0053 ,  B29C45/261 ,  B29C45/40 ,  B29C45/78 ,  B29C2045/0079 ,  B29C2045/4063 ,  B29C2045/7343 ,  B29C2045/7393 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2055/00 ,  B29K2995/0012 ,  B29L2031/7544 ,  C23C16/042 ,  C23C16/345 ,  C23C16/401 ,  C23C16/50 ,  C23C16/505

摘要： A method of molding a solid article such as a syringe with zero draft or low draft is disclosed. The method includes heating a low draft mold to expand it, then injection molding the part, followed by cooling at least part of the low draft mold element to thermally contract at least a portion of the low draft element away from the solid low draft formed surface sufficiently to release the low draft element from the low draft formed surface. Syringes and other articles formed by this method are also disclosed having and interior draft angle of 0 to 0.5 degrees, optionally at least substantially zero degrees. The syringe plunger can be selectively coated with lubricity coatings and other functional coatings to improve performance of the syringe.

摘要翻译： 公开了一种模制诸如具有零吃水或低吃水的注射器的固体制品的方法。 该方法包括加热低速通风模具以使其膨胀，然后注塑该部件，然后冷却低通风模具元件的至少一部分以使低通风元件的至少一部分热接触远离实心低通风形成表面 足以将低吃水元件从低吃水形成表面释放。 也公开了由该方法形成的注射器和其他物品具有0至0.5度的内部拔模角度，可选地至少基本上为零度。 注射器柱塞可以选择性地涂覆润滑性涂层和其他功能涂层以改善注射器的性能。

公开(公告)号：EP2943289A1

公开(公告)日：2015-11-18

申请号：EP14738293.1

申请日：2014-01-07

申请人： hZo, Inc.

发明人： ASTLE, David, James ,  CHILD, Tyler, Christensen ,  KASAGANI, Vimal, Kumar ,  LOOSE, Cameron, LaMar ,  STEVENS, Blake, LeRoy ,  SORENSON, Max, Ernest

IPC分类号： B05D1/32

CPC分类号： B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2203/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

摘要： A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

摘要翻译： 用于从诸如电子设备的基板选择性地去除保护涂层的部分的方法包括从基板去除保护涂层的部分。 去除过程可以包括在特定位置切割保护涂层，然后从衬底去除保护涂层的期望部分，或者其可以包括烧蚀待除去的保护涂层的部分。 还公开了涂层和除去系统。

公开(公告)号：EP2920339A1

公开(公告)日：2015-09-23

申请号：EP12794899.0

申请日：2012-11-15

申请人： Applied Materials, Inc.

发明人： LINDENBERG, Ralph ,  KOPARAL, Erkan

IPC分类号： C23C14/56 ,  C23C14/04 ,  C23C14/50 ,  B65G49/06 ,  H01L21/67 ,  H01L21/677 ,  C23C16/04 ,  C23C16/44

CPC分类号： H01J37/3441 ,  C23C14/042 ,  C23C14/50 ,  C23C14/564 ,  C23C14/568 ,  C23C16/042 ,  C23C16/4401 ,  H01J2237/3323 ,  H01L21/67173 ,  H01L21/67751 ,  H01L21/6776

摘要： A method for extracting a shielding element from a processing chamber of a substrate processing system or inserting the shielding element into the processing chamber is provided. The substrate processing system includes the processing chamber, a first shielding element for excluding application of material onto parts of a substrate, and a substrate transportation system for transporting substrates or substrate carriers into and out of the processing chamber. The method includes transporting the first shielding element by the substrate transportation system.

摘要翻译： 提供了一种从基板处理系统的处理室中提取屏蔽元件或将屏蔽元件插入处理室的方法。 基板处理系统包括处理室，用于排除将材料施加到基板的部件上的第一屏蔽元件和用于将基板或基板载体输入和移出处理室的基板输送系统。 该方法包括通过基板输送系统输送第一屏蔽元件。

公开(公告)号：EP2839052A4

公开(公告)日：2015-06-10

申请号：EP13777473

申请日：2013-04-19

申请人： INTEVAC INC ,  BLUCK TERRY ,  LATCHFORD IAN ,  SHAH VINAY ,  RIPOSAN ALEX

发明人： BLUCK TERRY ,  LATCHFORD IAN ,  SHAH VINAY ,  RIPOSAN ALEX

IPC分类号： C23C14/04 ,  H01L21/673 ,  H01L31/18

CPC分类号： H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

公开(公告)号：EP2243858B1

公开(公告)日：2015-04-29

申请号：EP09709857.8

申请日：2009-02-10

申请人： iMott Inc.

发明人： OHTAKE, Naoto ,  MATSUO, Makoto ,  IWAMOTO, Yoshinao

IPC分类号： C23C16/27 ,  C23C16/44 ,  C23C16/505 ,  C23C16/515 ,  C23C16/04

CPC分类号： C23C16/26 ,  C23C16/042 ,  C23C16/517 ,  H01J37/32091 ,  H01J37/32165 ,  H01J37/32174 ,  H01J37/32871 ,  H01J2237/2001

公开(公告)号：EP2767612A4

公开(公告)日：2015-03-25

申请号：EP12840633

申请日：2012-10-12

申请人： TOYO TANSO CO

发明人： KITA MASAAKI ,  KUBOTA TAKESHI ,  HIRANO HIROYUKI

IPC分类号： C23C16/458 ,  C23C16/04 ,  C23C16/32 ,  C23C16/44 ,  C30B35/00 ,  H01L21/205

CPC分类号： C30B35/00 ,  C04B41/009 ,  C04B41/5057 ,  C04B41/5059 ,  C04B41/87 ,  C23C16/042 ,  C23C16/325 ,  C23C16/4404 ,  C23C16/4588 ,  C04B35/52 ,  C04B41/4531 ,  C04B41/4572

公开(公告)号：EP2264213B1

公开(公告)日：2014-11-12

申请号：EP10250962.7

申请日：2010-05-24

申请人： Samsung Display Co., Ltd.

发明人： Lee, Choong-Ho ,  Lee, Jung-Min

IPC分类号： C23C14/24 ,  H05B33/10

CPC分类号： C23C14/04 ,  C23C14/24 ,  C23C14/243 ,  C23C16/04 ,  C23C16/042 ,  Y10T29/49826 ,  Y10T29/49828

摘要： A thin film deposition apparatus used to produce large substrates on a mass scale and improve manufacturing yield. The thin film deposition apparatus comprises: a deposition source arranged to discharge a deposition material; a first nozzle disposed downstream of the deposition source and including a plurality of first openings arranged in a first direction; a second nozzle disposed downstream of the first nozzle and including a plurality of second openings arranged in the first direction; a barrier wall assembly including a plurality of barrier walls arranged in the first direction between the first nozzle and the second nozzle so as to partition a space between the first nozzle and the second nozzle into a plurality of sub-deposition spaces.

公开(公告)号：EP2780935A2

公开(公告)日：2014-09-24

申请号：EP14700800.7

申请日：2014-01-07

申请人： hZo, Inc.

发明人： ASTLE, David James ,  CHILD, Tyler Christensen ,  KASAGANI, Vimal Kumar ,  LOOSE, Cameron LaMar ,  STEVENS, Blake LeRoy ,  SORENSON, Max Ernest

IPC分类号： H01L21/64 ,  H05K7/02 ,  H01L21/67

CPC分类号： B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2203/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

摘要： A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

摘要翻译： 用于从诸如电子设备的基板选择性地去除保护涂层的部分的方法包括从基板去除保护涂层的部分。 去除过程可以包括在特定位置切割保护涂层，然后从衬底去除保护涂层的期望部分，或者其可以包括烧蚀待除去的保护涂层的部分。 还公开了涂层和除去系统。

公开(公告)号：EP2748349A1

公开(公告)日：2014-07-02

申请号：EP11749406.2

申请日：2011-08-25

申请人： Applied Materials, Inc.

发明人： HANIKA, Markus ,  LINDENBERG, Ralph ,  ZENGEL, Claus

IPC分类号： C23C14/04 ,  C23C16/04 ,  C23C8/04 ,  C23C10/04 ,  C23C2/00 ,  C23C4/02 ,  C23C4/00

CPC分类号： C23C8/04 ,  C23C2/006 ,  C23C4/01 ,  C23C10/04 ,  C23C14/042 ,  C23C16/042

摘要： A mask structure configured for deposition of a layer on a rectangular substrate, e.g. an edge exclusion mask configured for deposition of a layer on a rectangular substrate is described. The mask structure includes a mask frame adapted for masking the edge of the substrate during layer deposition, wherein the mask frame comprises at least two mask frame side portions forming a corner in a corner area there between, wherein the mask frame is shaped to overlap the edge of the rectangular substrate such that a first overlap width at the side portions is larger than a second overlap width in the corner area.