公开(公告)号：EP2986088A1

公开(公告)日：2016-02-17

申请号：EP15183336.5

申请日：2008-12-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： YANG, Ruiquan ,  SHENG, Haiqiang ,  LI, Hongcai

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0243 ,  H05K1/021 ,  H05K1/024 ,  H05K1/025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/11 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/4688 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material (1), a second prepreg (2), and a third ordinary board material (3) that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole (70) is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Abstract translation: 提供印刷电路板（PCB）。 PCB包括被压在一起的第一微波板材料（1），第二预浸料坯（2）和第三普通板材（3）。 第一微波板材料，第二预浸料坯和第三普通板材分别设置有开口。 至少两个开口具有不同的尺寸。 在具有不同尺寸的至少两个开口的边界之间的区域中，提供钻孔（70）以穿过该区域中的板材料。 有选择地使用后钻孔。 进一步提供射频装置及其制造方法。 因此，它适用于在同一单板上设计不同的电源模块和其他电路模块，并且与现有的基本PCB制造技术兼容，其进一步具有低成本，并且可以满足大功率射频 不同频率的电路

公开(公告)号：EP2932805A1

公开(公告)日：2015-10-21

申请号：EP13803059.8

申请日：2013-12-13

Applicant: Valeo Systemes Thermiques

Inventor： CHAUVIN, Karen

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/205 ,  H05K2201/10416

Abstract: The invention relates to a printed circuit device comprising a first surface, a second surface, and at least one insert of a heat-transport material, characterized in that: the insert is permanent, and a second surface of the insert projects from the second surface of the printed circuit in order to dissipate calories.

公开(公告)号：EP2752922B1

公开(公告)日：2015-10-21

申请号：EP12858230.1

申请日：2012-11-20

Applicant: LG Chem, Ltd.

Inventor： LEE, Hyun min ,  LEE, Jae Chan

IPC: H01M2/34 ,  H01M10/42 ,  H01M10/48 ,  B60L11/18 ,  H02J7/00 ,  H02J7/04 ,  H01H13/00 ,  H05K1/11

CPC classification number: H01M10/613 ,  B60L3/12 ,  B60L11/187 ,  B60L11/1879 ,  B60L2240/545 ,  H01M2/348 ,  H01M10/425 ,  H01M10/486 ,  H01M2200/10 ,  H01M2220/20 ,  H02J7/0029 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/115 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10416 ,  Y02T10/7011 ,  Y02T10/705

Abstract: Disclosed herein is a switching board having switching elements for temperature measurement mounted on a printed circuit board (PCB) having a circuit electrically connected to a unit cell constituting a battery module, the switching board including an upper board having a pair of switching elements, a temperature detection element, and one or more vertical through holes, the switching elements being electrically connected to the circuit, the temperature detection element and the vertical through holes being disposed between the switching elements, and a lower board having a heating pad at a position corresponding to the vertical through holes and the temperature detection element.

公开(公告)号：EP2919287A1

公开(公告)日：2015-09-16

申请号：EP12888036.6

申请日：2012-11-06

Applicant: NGK Insulators, Ltd.

Inventor： YANO Shinsuke ,  TANI Makoto ,  NAKANISHI Hirokazu

IPC: H01L33/64

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基体和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种发光二极管的基板，其通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而显示出高的散热能力。

公开(公告)号：EP2777368A1

公开(公告)日：2014-09-17

申请号：EP12737203.5

申请日：2012-06-29

Applicant: Schoeller-Electronics GmbH

Inventor： ZWICK, Thomas

IPC: H05K1/02 ,  B29C65/64 ,  F16B37/12

CPC classification number: H05K1/0204 ,  H05K2201/10416 ,  H05K2201/1059

Abstract: The invention relates to a plate-shaped moulded part (1) for pressing into a planar circuit board (2) in a vertical pressing direction perpendicular to the circuit board, wherein the moulded part (1) has an upper flat face (3) and a lower flat face (4), wherein a plurality of ribs (6) extending between the two flat faces (3, 4) are formed on the external circumferential surface (5), said ribs being capable of fastening the moulded part (1) in an opening (7) in the circuit board (2). According to the invention, the extent of at least one rib (6) deviates from a vertical extent (V) and/or the ribs (6) are distributed irregularly when viewed over the external periphery.

公开(公告)号：EP2642532A4

公开(公告)日：2014-06-25

申请号：EP12848326

申请日：2012-08-30

Applicant: DONGGUAN KINGSUN OPTOELECT CO

Inventor： BI XIAOFENG

IPC: H01L33/64 ,  H05K1/02

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

公开(公告)号：EP2683225A1

公开(公告)日：2014-01-08

申请号：EP11860278.8

申请日：2011-12-12

Applicant: Olympus Corporation

Inventor： FUJIMORI Noriyuki

IPC: H05K1/11 ,  A61B1/04 ,  G03B17/02 ,  H04N5/225 ,  H05K3/46

CPC classification number: H05K1/181 ,  A61B1/0011 ,  A61B1/051 ,  H04N5/2251 ,  H05K1/18 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0919 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10416 ,  H05K2201/10446 ,  Y10T29/49162

Abstract: A wiring board 10 includes a plurality of wiring layers 22, a plurality of insulating layers 23, and an electrode member 20 made of a conductive material, the electrode member 20 being incorporated in the wiring board 10 in a state in which the electrode member 20 includes exposed sections 20S on side surfaces 13 and 14 that cross the plurality of wiring layers 22 and the plurality of insulating layers 23.

Abstract translation: 布线基板10具有多个布线层22，多个绝缘层23和由导电材料制成的电极构件20，电极构件20在电极构件20的状态下配置在布线基板10中 包括穿过多个布线层22和多个绝缘层23的侧表面13和14上的暴露部分20S。

公开(公告)号：EP2330639A4

公开(公告)日：2012-05-23

申请号：EP08877018

申请日：2008-09-28

Applicant: CHANG YIHUI

Inventor： CHANG YI-HUI ,  HAO CHING-CHIEN

IPC: H01L33/00 ,  F21K99/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V19/003 ,  F21V29/004 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: The present invention relates to an alternating current driven light emitting diode module. The alternating current driven light emitting diode module includes an alternating current driven light emitting diode chip, a first thermal conduction plate, and a ceramic substrate. The first thermal conduction plate is arranged on the ceramic substrate. The alternating current driven light emitting diode chip is arranged on the first thermal conduction plate. The alternating current driven light emitting diode module has better heat dissipating property and better insulation property.

Abstract translation: 本发明涉及一种交流驱动发光二极管模块。 交流驱动发光二极管模块包括交流驱动发光二极管芯片，第一导热板和陶瓷基板。 第一导热板设置在陶瓷基板上。 交流驱动发光二极管芯片布置在第一导热板上。 交流驱动发光二极管模块具有更好的散热性能和更好的绝缘性能。

公开(公告)号：EP2223579A4

公开(公告)日：2012-05-09

申请号：EP07861111

申请日：2007-12-17

Applicant: ERICSSON TELEFON AB L M

Inventor： SCHOEOEN MARTIN

IPC: H05K1/02 ,  H01L23/36

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416

公开(公告)号：EP2429270A1

公开(公告)日：2012-03-14

申请号：EP11192345.4

申请日：2009-04-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Huang, Mingli ,  Zhang, Shun ,  Yang, Xichen ,  Zhao, Junying ,  Luo, Bing ,  Li, Zhihai ,  Wang, Guoliang

IPC: H05K3/46

CPC classification number: H05K1/0206 ,  H05K1/0204 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/10416 ,  H05K2203/063 ,  Y10T29/49124

Abstract: A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.

Abstract translation: 提供了多层电路板，其制造方法和通信装置。 对于多层电路板，在至少一个子板上打开槽段以形成第一子板。 至少一个子板和中间层堆叠在一起。 子板包括第一个子板。 第一子板被放置成使得第一子板的槽段被通信。 槽段被传送以形成接收槽。 导热块放置在接收槽内。 每个介质层夹在子板之间。 将堆叠的子板，中等层和导热块压在一起，将压制的子板和导热块制成多层电路板。 当电路板被按压时，导热块被嵌入，从而简化了导热块的组装过程。