利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.01 秒)

    INTEGRATED DEVICE COMPRISING COAXIAL INTERCONNECT
    12.
    发明公开
    INTEGRATED DEVICE COMPRISING COAXIAL INTERCONNECT 审中-公开
    包含同轴互连的集成器件

    公开(公告)号：EP3167483A1

    公开(公告)日：2017-05-17

    申请号：EP15741706.4

    申请日：2015-07-09

    申请人： Qualcomm Incorporated

    发明人： KIM, Dong Wook ,  SONG, Young Kyu ,  HWANG, Kyu-Pyung ,  WE, Hong Bok

    IPC分类号： H01L23/498 ,  H01L21/48

    CPC分类号： H01L23/49838 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K3/284 ,  H05K3/46 ,  H05K2203/1316

    摘要： Some novel features pertain to an integrated device that includes a substrate, a first interconnect coupled to the substrate, and a second interconnect surrounding the first interconnect. The second interconnect may be configured to provide an electrical connection to ground. In some implementations, the second interconnect includes a plate. In some implementations, the integrated device also includes a dielectric material between the first interconnect and the second interconnect. In some implementations, the integrated device also includes a mold surrounding the second interconnect. In some implementations, the first interconnect is configured to conduct a power signal in a first direction. In some implementations, the second interconnect is configured to conduct a grounding signal in a second direction. In some implementations, the second direction is different from the first direction. In some implementations, the integrated device may be a package-on-package (PoP) device.

    摘要翻译： 一些新颖特征涉及一种集成装置，其包括衬底，耦合到衬底的第一互连以及围绕第一互连的第二互连。 第二互连可以被配置为提供到地的电连接。 在一些实施方式中，第二互连件包括板。 在一些实现中，集成器件还包括介于第一互连和第二互连之间的电介质材料。 在一些实施方式中，集成装置还包括围绕第二互连的模具。 在一些实现中，第一互连被配置为在第一方向上传导功率信号。 在一些实现中，第二互连被配置为在第二方向上传导接地信号。 在一些实现中，第二方向不同于第一方向。 在一些实现中，集成设备可以是封装级封装（PoP）设备。

    ELECTROMAGNETIC INTERFERENCE ENCLOSURE FOR RADIO FREQUENCY MULTI-CHIP INTEGRATED CIRCUIT PACKAGES
    14.
    发明公开
    ELECTROMAGNETIC INTERFERENCE ENCLOSURE FOR RADIO FREQUENCY MULTI-CHIP INTEGRATED CIRCUIT PACKAGES 审中-公开
    电磁干扰射频多芯片集成电路封装HOUSING

    公开(公告)号：EP2973696A1

    公开(公告)日：2016-01-20

    申请号：EP14715158.3

    申请日：2014-03-06

    申请人： Qualcomm Incorporated

    发明人： HWANG, Kyu-Pyung ,  SONG, Young Kyu ,  KIM, Dong Wook ,  YUN, Changhan

    IPC分类号： H01L23/552 ,  H01L25/065 ,  H05K9/00 ,  H01L23/66

    摘要： One feature pertains to a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate. At least one integrated circuit is coupled to a first surface of the substrate. The EMI shield includes a metal casing configured to shield the package from radio frequency radiation, a dielectric layer coupled to at least a portion of an inner surface of the metal casing, and a plurality of signal lines. The signal lines are coupled to the dielectric layer and electrically isolated from the metal casing by the dielectric layer. At least one other integrated circuit is coupled to an inner surface of the EMI shield, and at least a portion of the inner surface of the EMI shield faces the first surface of the substrate. The signal lines are configured to provide electrical signals to the second circuit component.