摘要:
A MEMS triaxial magnetic sensor device (51) is provided with a sensing structure (2) having: a substrate (6); an outer frame (4), which internally defines a window (5) and is elastically coupled to first anchorages (7) fixed with respect to the substrate by means of first elastic elements (8); a mobile structure (10) arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements (12) and carries a conductive path (P) for flow of an electric current (I); and an elastic arrangement (22, 24) operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and of the arrangement of elastic elements, a first sensing movement in response to Lorentz forces originating from a first magnetic-field component (B x ), a second sensing movement in response to Lorentz forces originating from a second magnetic-field component (B y ), and a third sensing movement in response to Lorentz forces originating from a third magnetic-field component (B z ); the first, second, and third sensing movements are distinct and decoupled from one another.
摘要:
A MEMS acoustic transducer (20) provided with: a substrate (21) of semiconductor material, having a back surface (21b) and a front surface (21a) opposite with respect to a vertical direction (z); a first cavity (22) formed within the substrate (21), which extends from the back surface (21b) to the front surface (21a); a membrane (23) which is arranged at the upper surface (21a), suspended above the first cavity (22) and anchored along a perimeter thereof to the substrate (21); and a combfingered electrode arrangement (28) including a number of mobile electrodes (29) coupled to the membrane (23) and a number of fixed electrodes (30) coupled to the substrate (21) and facing respective mobile electrodes (29) for forming a sensing capacitor, wherein a deformation of the membrane (23) as a result of incident acoustic pressure waves causes a capacitive variation (ΔC) of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane (23) and extends parallel thereto.
摘要:
The MEMS device (20) is formed by a substrate (21) and a movable structure (22) suspended on the substrate. The movable structure has a first mass (28), a second mass (29A) and a first elastic group (30A) mechanically coupled between the first and the second masses. The first elastic group is compliant along a first direction (Y). The first mass is configured to move with respect to the substrate along the first direction. The MEMS device also has a second elastic group (23) mechanically coupled between the substrate and the movable structure and compliant along the first direction; and an anchoring control structure (33A, 40A) fixed to the substrate, capacitively coupled to the second mass and configured to exert an electrostatic force on the second mass along the first direction. The anchoring control structure controls the MEMS device in a first operating state, wherein the second mass is free to move with respect to the substrate along the first direction, and in a second operating state, wherein the anchoring control structure applies a pull-in force on the second mass which anchors the second mass to the anchoring control structure.
摘要:
MEMS actuator (20) including: a substrate (21); a first and a second semiconductive layer (31,32); a frame (27) including transverse regions (62) formed by the second semiconductive layer (32), elongated parallel to a first direction (X) and offset along a second direction (Y), the frame (27) being movable parallel to the second direction (Y). The MEMS actuator (20) includes, for each transverse region (62): corresponding front rotor regions (65), which are fixed to the transverse region (62) and are suspended above the substrate (21); a first and a second stator region (70,72), which are formed by the first semiconductive layer (31) in such a way that, when the frame (27) is in rest position, the transverse region (62) is laterally offset with respect to the first and the second stator regions (70,72) and a first front rotor region (65') partially faces the first stator region (70), and in such a way that, during a translation of the frame (27) along the second direction (Y), the first and/or a second front rotor region (65', 65") at least partially face the second stator region (72), when the transverse region (62) begins to superimpose on the first stator region (70).
摘要:
A closed-loop microelectromechanical accelerometer includes a substrate (23) of semiconductor material, an out-of-plane sensing mass (13) and feedback electrodes (17a-17d). The out-of-plane sensing mass (13), of semiconductor material, has a first side (13a) facing the supporting body (11) and a second side (13b) opposite to the first side (13a). The out-of-plane sensing mass (13) is also connected to the supporting body (11) to oscillate around a non-barycentric fulcrum axis (F) parallel to the first side (13a) and to the second side (13b) and perpendicular to an out-of-plane sensing axis (Z). The feedback electrodes (17a-17d) are capacitively coupled to the sensing mass (13) and are configured to apply opposite electrostatic forces (F FB1 , F FB2 ) to the sensing mass (13).
摘要:
A clock generator (30) having a variable-modulus frequency divider (34), receiving a high-frequency clock signal (HFCK) and outputting a divided clock signal (DIV) having a frequency controlled by a modulus-control signal (MC) generated by a temperature-compensation circuit (36). A jitter filter (35) is coupled to the output of the variable-modulus frequency divider (34) and to the temperature-compensation circuit (36) and generates a compensated clock signal (OUT) having switching edges that are delayed, with respect to the divided clock signal (DIV), by a time correlated to a quantization-error signal.
摘要:
A MEMS accelerometer, including: a support structure (3); a suspended region (2; 62; 92) made of semiconductor material, mobile with respect to the support structure; at least one modulation electrode (20; 68; 114), which is fixed to the support structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency; at least one variable capacitor (30; 80; 130), formed by the suspended region and by the modulation electrode, in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal; and a sensing assembly (12, 14, 16, 18, 5a; 12, 14, 16, 18, 65a; 102, 104, 95a), which generates, when the accelerometer is subjected to an acceleration, an electrical sensing signal, which indicates the position of the suspended region with respect to the support structure and includes a frequency-modulated component, which is a function of the acceleration and of the first frequency.
摘要:
A microelectromechanical sensor device having a sensing structure (1) with: a substrate (2); an inertial mass (3), suspended above the substrate (2) and elastically coupled to a rotor anchoring structure (6) by elastic coupling elements (8), to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes (9), integrally coupled to the inertial mass (3) to be movable due to the inertial movement; and second sensing electrodes (12), fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes (9) to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes (12) are arranged in a suspended manner above the substrate (2) and a compensation structure (20) is configured to move the second sensing electrodes (12) with respect to the first sensing electrodes (9) and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure (1).
摘要:
MEMS gyroscope (350), having a first movable mass (303, 403) configured to move with respect to a fixed structure along a first drive direction and along a first sense direction, transverse to the first drive direction; a first drive assembly (310), coupled to the first movable mass and configured to generate a first alternate drive movement; a first drive elastic structure (320), coupled to the first movable mass and to the first drive assembly, rigid in the first drive direction and compliant in the first sense direction; a second movable mass (303, 403), configured to move with respect to the fixed structure in a second drive direction parallel to the first drive direction and in a second sense direction parallel to the first sense direction; a second drive assembly (311), coupled to the second movable mass and configured to generate a second alternate drive movement in the second drive direction; and a second drive elastic structure (320), coupled to the second movable mass and to the second drive assembly, rigid in the second drive direction and compliant in the second sense direction.