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    RESIN COMPOSITION FOR MOLDING USE
    13.
    发明公开
    RESIN COMPOSITION FOR MOLDING USE 审中-公开

    公开(公告)号：EP3173444A4

    公开(公告)日：2018-03-07

    申请号：EP15824766

    申请日：2015-07-23

    Applicant: SEKISUI CHEMICAL CO LTD ,  TOKUYAMA SEKISUI CO LTD

    Inventor： MATSUMURA KENICHI ,  SEIKI ATSUSHI ,  MASHINO NORIKAZU ,  KAWANO ATSUSHI ,  YOSHIYAMA KEI

    IPC: C08K5/098 ,  C08K3/014 ,  C08K3/22 ,  C08K5/134 ,  C08L27/24

    CPC classification number: C08L27/24 ,  C08K3/014 ,  C08K3/22 ,  C08K5/005 ,  C08K5/098 ,  C08K5/1345 ,  C08K2201/014 ,  C08K2201/019 ,  C08L2201/08 ,  C08L2203/18 ,  F16L9/127

    Abstract: The present invention provides a resin composition for molding that allows production of a molded body having excellent thermal stability as well as high flexibility and strength, without using heavy metals such as lead and tin, and also provides a molded body obtained using the resin composition for molding. The present invention provides a resin composition for molding, including a chlorinated polyvinyl chloride and a thermal stabilizer, the chlorinated polyvinyl chloride having structural units (a) to (c) represented by formulae (a) to (c) shown below: €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CCl 2 -€ƒ€ƒ€ƒ€ƒ€ƒ(a), €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CHCl-€ƒ€ƒ€ƒ€ƒ€ƒ(b), €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-CH 2 -€ƒ€ƒ€ƒ€ƒ€ƒ(c), the proportion of the structural unit (a) being 17.5 mol% or less, the proportion of the structural unit (b) being 46.0 mol% or more, and the proportion of the structural unit (c) being 37.0 mol% or less, relative to the total number of moles of the structural units (a), (b), and (c), the chlorinated polyvinyl chloride having a chlorine content of 63 mass% or more and less than 72 mass%, the thermal stabilizer containing a calcium alkyl carboxylate and a zinc compound, and the resin composition for molding having a loss in quantity on heating at 230°C of less than 2 mass%.

    RESIN COMPOSITION, MOLDED OBJECT, AND MECHANICAL COMPONENT FOR PIPING
    15.
    发明公开
    RESIN COMPOSITION, MOLDED OBJECT, AND MECHANICAL COMPONENT FOR PIPING 审中-公开
    树脂组合物，成型物和用于管道的机械部件

    公开(公告)号：EP3275938A1

    公开(公告)日：2018-01-31

    申请号：EP16771760.2

    申请日：2016-03-25

    Applicant: Asahi Kasei Kabushiki Kaisha

    Inventor： SAKATA, Minoru

    IPC: C08L71/12 ,  C08K5/092 ,  C08K9/06 ,  C08L25/06 ,  C08L53/02

    CPC classification number: C08L71/123 ,  C08K5/092 ,  C08K9/06 ,  C08L25/06 ,  C08L53/02 ,  C08L71/12 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2205/03

    Abstract: Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass% and below 94 mass%; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass%; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass%; and a surface-treated inorganic filler (d) in an amount of 5 mass% or more and less than 30 mass%, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98 % in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000.

    Abstract translation: 本发明提供一种树脂组合物，其含有：含有50质量％以上94质量％以下的聚苯醚树脂和无规立构均聚苯乙烯的树脂混合物（a） 氢化嵌段共聚物（b），所述氢化嵌段共聚物（b）通过氢化至少部分含有1至20质量％聚合物嵌段A和B的嵌段共聚物而获得; 含有0.01〜0.5质量％特定官能团的含官能团化合物（c） 和5质量％以上且小于30质量％的经表面处理的无机填料（d），其中所述树脂组合物实质上不含在共轭二烯中具有小于98％的氢化率的聚合物 化合物部分中，（a-1）成分的重均分子量小于70,000，（b）成分的数均分子量为15万〜30万。

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