公开(公告)号：EP0273026B2

公开(公告)日：2003-08-20

申请号：EP87870199.4

申请日：1987-12-22

Applicant: SHIPLEY COMPANY INC.

Inventor： Daniels, Brian Kenneth ,  Madoux, David Charles ,  Templeton, Michael Karpovich ,  Trefonas III, Peter ,  Woodbrey, James Calvin ,  Zampini, Anthony

IPC: G03F7/004 ,  G03F7/022

CPC classification number: G03F7/0226 ,  G03F7/0048 ,  G03F7/022

公开(公告)号：EP0534324B1

公开(公告)日：1999-12-22

申请号：EP92115982.8

申请日：1992-09-18

Applicant: SHIPLEY COMPANY INC.

Inventor： Sinta, Roger ,  Hemond, Richard, C. ,  Medeiros, David, R. ,  Rajaratnam, Martha, M. ,  Thackeray, James W. ,  Canistro, Dianne

IPC: G03F7/039 ,  G03F7/023 ,  G03F7/004

CPC classification number: G03F7/0233 ,  G03F7/0045 ,  G03F7/039 ,  Y10S430/106 ,  Y10S430/11

公开(公告)号：EP0564780B1

公开(公告)日：1996-04-24

申请号：EP93102058.0

申请日：1993-02-10

Applicant: SHIPLEY COMPANY INC.

Inventor： Storjohann, Donald E. ,  Wiberg, Sven J.

IPC: C23C18/16 ,  G05D21/02

CPC classification number: C23C18/1617 ,  C23C18/1683 ,  H05K3/187

公开(公告)号：EP0524422A3

公开(公告)日：1994-04-13

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种提高锡铅合金沉积物的回流能力并增加其对下面基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该工艺在制造印刷电路板时非常有用。

公开(公告)号：EP0520195A2

公开(公告)日：1992-12-30

申请号：EP92108801.9

申请日：1992-05-25

Applicant: SHIPLEY COMPANY INC.

Inventor： Bladon, John J.

IPC: C25D5/54

CPC classification number: C25D5/54 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716

Abstract: A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.

Abstract translation: 一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成催化金属硫化物并在其上电解金属沉积。 催化金属硫族化物优选为硫化钯。

公开(公告)号：EP0502382A1

公开(公告)日：1992-09-09

申请号：EP92102959.1

申请日：1992-02-21

Applicant: SHIPLEY COMPANY INC.

Inventor： Daniels, George R.E. ,  Oddi, Michael J. ,  Cheetham, Kevin J. ,  Rodriguez, Stephen S.

IPC: G03F7/038

CPC classification number: G03F7/038 ,  H05K3/287 ,  Y10S430/136

Abstract: A photoimageable composition and process for use of the same. The composition comprises a binder that is a mixture of a phenolic resin and a multifunctional epoxy or vinyl compound and a curing system comprising a photoactive compound capable of generating a curing catalyst capable of crosslinking the binder components. The process for use of the composition comprises application of the composition to a substrate, drying of the same, exposing the dried coating to activating radiation, curing the binder in light exposed areas, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask.

Abstract translation: 一种可光成像的组合物及其使用方法。 该组合物包含作为酚醛树脂和多官能环氧或乙烯基化合物的混合物的粘合剂和包含能够产生能够交联粘合剂成分的固化催化剂的光活性化合物的固化体系。 使用组合物的方法包括将组合物施用于基材，干燥该组合物，将干燥的涂层暴露于活化辐射，在曝光区域中固化粘合剂，显影涂层和热固化显影图像。 该组合物作为阻焊剂特别有用。

公开(公告)号：EP0493644A1

公开(公告)日：1992-07-08

申请号：EP91100125.3

申请日：1991-01-03

Applicant: SHIPLEY COMPANY INC.

Inventor： Hawkins, Robert E. ,  Harrison, Richard L.

IPC: G03F7/16

CPC classification number: G03F7/164 ,  C25D13/24 ,  H05K3/0091 ,  Y10S204/13

Abstract: This invention provides a means of controlling the composition of electrodepositable photoresists emulsion. The system removes contaminants from the bath which may adversely effect the quality of the deposited coatings and allows for continuous monitoring of the conductivity of the system.

Abstract translation: 本发明提供一种控制电沉积光致抗蚀剂能乳化的组合物的方法。 该系统中移除从可能沉积的涂层的质量有不利影响，并允许连续监测系统的导电性的浴污染物。

公开(公告)号：EP0449022A3

公开(公告)日：1992-03-11

申请号：EP91103687.9

申请日：1991-03-11

Applicant: SHIPLEY COMPANY INC.

Inventor： Hawkins, Robert E. ,  Rodriguez, Stephen S.

IPC: G03F7/16

CPC classification number: G03F7/164 ,  H05K1/0266 ,  H05K3/0076 ,  H05K3/064 ,  H05K2203/122 ,  H05K2203/135

Abstract: It has been discovered that both water soluble or partially water soluble and water insoluble agents lower the operating temperature of electrodepositable photoresist compositions and substantially increase both lifetime stability and temperature stability of the bath. These additives, because of their low volatility and their partition coefficients, essentially remain in the emulsion system and are removed upon codeposition with the photoresist where they act to improve film quality and control thickness.

Abstract translation: 已经发现水溶性或部分水溶性和水不溶性试剂都降低了可电沉积光致抗蚀剂组合物的操作温度，并且基本上提高了浴的寿命稳定性和温度稳定性。 这些添加剂由于它们的低挥发性和分配系数而基本上保留在乳液体系中，并且在与光致抗蚀剂共沉积时除去，其中它们用于提高膜质量和控制厚度。

公开(公告)号：EP0462391A3

公开(公告)日：1992-01-22

申请号：EP91107484.7

申请日：1991-05-08

Applicant: SHIPLEY COMPANY INC.

Inventor： Thackeray, James W. ,  Orsula, George W. ,  Canistro, Dianne ,  McIlnay, Susan E.

IPC: G03F7/038 ,  G03F7/029

CPC classification number: G03F7/0295 ,  G03F7/038

Abstract: The invention is for a negative-acting, acid hardenable, deep UV photoresist comprising a phenolic resin having ring bonded hydroxyl sites, a thermally activated crosslinking agent that is an etherified aminoplast and a photoacid generator. The invention is characterized by control of the molar ratio of the ring bonded hydroxyl groups of the phenolic resin to the ether groups of the aminoplast which permits optimization of the properties such as optical absorbance, dissolution rate, photospeed, contrast, resolution and sidewall angle.

公开(公告)号：EP0397988A3

公开(公告)日：1991-10-09

申请号：EP90105228.2

申请日：1990-03-20

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Sricharoenchaikit, Prasit

IPC: G03F7/40

CPC classification number: H05K3/185 ,  G03F7/265 ,  G03F7/40

Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaning photoresist coating unprotected by the metal mask.