公开(公告)号：EP0416518A2

公开(公告)日：1991-03-13

申请号：EP90116931.8

申请日：1990-09-04

Applicant: IDEMITSU KOSAN COMPANY LIMITED

Inventor： Nakano, Akikazu

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board is disclosed, in which the following steps are sequentially conducted:

(1) a step for dispersing in at least one of the mediums of water and an organic solvent

(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure,
(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and
(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of said components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l,

(2) a sedimentation step of the dispersed solids in said slurry,
(3) a step for removing at least one of the mediums of water and an organic solvent in the slurry by filtration and drying and molding the residue,
(4) a step for melting with heating and pressure forming the molded product, and
(5) a step for providing a metal layer on the molded article.

The printed circuit board obtained by the process is excellent in impact resistance, heat resistance, mechanical strength and size stability as well as dielectric properties.

Abstract translation: 公开了一种制造印刷电路板的方法，其中依次进行以下步骤：（1）将水和有机溶剂（A）的至少一种介质分散在95〜20重量％的 具有间同立构结构的苯乙烯聚合物，（B）5-80重量％的纤维长度为1-50毫米的纤维填料，和（C）0.1-30重量份至少一种粘合剂和 与所述组分（A）和（B）的总量的100重量份成比例的粘合纤维，以制备浓度为0.5-100g / l的浆料，（2）分散固体的沉降步骤 所述浆料，（3）通过过滤并干燥和成型残渣来除去浆料中的至少一种水和有机溶剂的步骤，（4）通过加热和加压成型模制物进行熔融的步骤， 和（5）在模制品上提供金属层的步骤。 通过该方法获得的印刷电路板具有优异的耐冲击性，耐热性，机械强度和尺寸稳定性以及介电性能。

公开(公告)号：EP0240919A3

公开(公告)日：1989-04-26

申请号：EP87104811.2

申请日：1987-04-01

Applicant: International Business Machines Corporation

Inventor： Andrews, George Lewis ,  Bhatt, Anilkumar Chinuprasad ,  Doran, Donald Edward ,  Hunsinger, Leo Edwin

IPC: C03C25/02

CPC classification number: H05K1/0366 ,  C03C25/40 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31663 ,  Y10T442/2344 ,  Y10T442/3512 ,  Y10T442/3667

Abstract: A fibrous substrate is coated with a hydrolyzed amino­silane. The aminosilane is hydrolyzed in an aqueous solution having a pH of 3.4 to 3.7. The substrate is useful for preparing fiber reinforced plastics such as prepreg polyepoxide substrates. Improved adhesion between the fibrous substrate and the polymer is obtained.

公开(公告)号：EP0240919A2

公开(公告)日：1987-10-14

申请号：EP87104811.2

申请日：1987-04-01

Applicant: International Business Machines Corporation

Inventor： Andrews, George Lewis ,  Bhatt, Anilkumar Chinuprasad ,  Doran, Donald Edward ,  Hunsinger, Leo Edwin

IPC: C03C25/02

CPC classification number: H05K1/0366 ,  C03C25/40 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31663 ,  Y10T442/2344 ,  Y10T442/3512 ,  Y10T442/3667

Abstract: A fibrous substrate is coated with a hydrolyzed amino­silane. The aminosilane is hydrolyzed in an aqueous solution having a pH of 3.4 to 3.7. The substrate is useful for preparing fiber reinforced plastics such as prepreg polyepoxide substrates. Improved adhesion between the fibrous substrate and the polymer is obtained.

Abstract translation: 用水解的氨基硅烷涂覆纤维底物。 氨基硅烷在pH为3.4〜3.7的水溶液中水解。 基材可用于制备纤维增强塑料如预浸料聚环氧化物基材。 获得纤维基质和聚合物之间的粘合性提高。

公开(公告)号：EP0048992A3

公开(公告)日：1985-05-02

申请号：EP81107748

申请日：1981-09-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Oodaira, Hiroshi ,  Nagashima, Kenji ,  Matsumoto, Hiroshi ,  Tanaka, Masataka

IPC: H05K01/05 ,  H05K03/44

CPC classification number: H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2201/0239 ,  H05K2203/1147

Abstract: A printed circuit board has a substrate (11) having good heat dissipation and an insulating layer (12) of a ceramic material flame spray-coated thereon. This insulating layer (12) has a number of through pores (13). A resin with network structure strongly bonden to the ceramic material is formed in the through pores (13) of the insulating layer (12) and seals the through pores (13).

公开(公告)号：EP0048992A2

公开(公告)日：1982-04-07

申请号：EP81107748.6

申请日：1981-09-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Oodaira, Hiroshi ,  Nagashima, Kenji ,  Matsumoto, Hiroshi ,  Tanaka, Masataka

IPC: H05K1/05 ,  H05K3/44

CPC classification number: H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2201/0239 ,  H05K2203/1147

Abstract: A printed circuit board has a substrate (11) having good heat dissipation and an insulating layer (12) of a ceramic material flame spray-coated thereon. This insulating layer (12) has a number of through pores (13). A resin with network structure strongly bonden to the ceramic material is formed in the through pores (13) of the insulating layer (12) and seals the through pores (13).

Abstract translation: 印刷电路板具有散热好的基板（11）和火焰喷涂在其上的陶瓷材料绝缘层（12）。 该绝缘层（12）具有多个通孔（13）。 在绝缘层（12）的通孔（13）中形成具有与陶瓷材料牢固结合的网状结构的树脂，并密封通孔（13）。

公开(公告)号：EP2911483A1

公开(公告)日：2015-08-26

申请号：EP15151072.4

申请日：2015-01-14

Applicant: The Boeing Company

Inventor： Babilo, Peter ,  Moss, Randall Jay

IPC: H05K1/02 ,  C08K3/38 ,  C09J163/00 ,  H05K3/30

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1836 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110°C to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than -40°C.

Abstract translation: 提供了形成用于无人飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备粘合剂材料以形成这些键的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘结的电子部件的损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：EP2671919A1

公开(公告)日：2013-12-11

申请号：EP11866389.7

申请日：2011-11-28

Applicant: Panasonic Corporation

Inventor： KONNO, Yuko ,  TAKASHITA, Hiromitsu ,  TAKEDA, Tsuyoshi ,  FUJIWARA, Hiroaki ,  YOSHIOKA, Shingo

IPC: C08L33/02 ,  C08K5/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: An object of the present invention is, in a circuit board production method which includes the step of forming a circuit pattern by irradiating, with laser light, a resin film that has been formed on the surface of an insulating substrate, to increase the laser light absorptance of the resin film and improve circuit board productivity.
Use is made of a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ε1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ε1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明的目的在于，在电路板的制造方法中，包括通过用激光照射形成在绝缘基板的表面上的树脂膜形成电路图案的步骤，以增加激光 树脂膜的吸收性，提高电路板的生产率。 使用的树脂组合物包括由包含具有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 所使用的树脂组合物是当在溶剂中溶解通过将树脂组合物作为液体形成的树脂膜2溶解制备的溶液中的μ1表示树脂膜2的每单位重量的吸光度系数的树脂组合物 在树脂膜2被照射的光波长处的μ1为0.01以上（L /（g·cm））以上。

公开(公告)号：EP1863038B1

公开(公告)日：2010-09-08

申请号：EP06712764.7

申请日：2006-02-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： ONOUE, Tomoaki ,  YOSHIKAWA, Norihiro ,  HIOKI, Yasunori ,  NAKAMURA, Ichiro

IPC: H01B3/44 ,  C08K3/18 ,  C08K9/06 ,  C08L29/14 ,  H01B19/00 ,  H01G4/12 ,  H01G4/30

CPC classification number: H05K1/0373 ,  C08L29/14 ,  C08L63/00 ,  H01B3/446 ,  H01G4/206 ,  H01G4/30 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249953 ,  Y10T428/25 ,  Y10T428/2984 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31522 ,  C08L2666/22

Abstract: Disclosed is a composite dielectric sheet used for manufacturing a multilayer electronic component. This composite dielectric sheet has not only flexibility and high dielectric constant but also high withstand voltage. Specifically disclosed is a composite dielectric sheet (3) containing a polyvinyl acetal resin, a high dielectric constant filler which is present in the polyvinyl acetal resin in a dispersed state and surface-treated with a coupling agent, and a crosslinking agent having two or more functional groups which are reactive with both the polyvinyl acetal resin and the high dielectric constant filler surface. Such a composite dielectric sheet (3) can be used for a multilayer electronic component such as a multilayer capacitor (1).

公开(公告)号：EP2180019A8

公开(公告)日：2010-07-07

申请号：EP09177928.0

申请日：2005-08-05

Applicant: Nippon Shokubai Co., Ltd.

Inventor： Sugioka, Takuo ,  Tsujino, Yasunori

IPC: C08L83/02

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.

Abstract translation: 本发明的目的是提供一种树脂组合物，其能够形成具有各种优异性质例如绝缘性，耐热冲击性，成型性/可成型性和强度的固化制剂，并且表现出增强透明度的优异外观， 其固化薄膜具有优异的阻燃性，良好的机械性能和耐热性的树脂组合物，含有可赋予树脂阻燃性的无机微细颗粒的分散元件，其中加入了无机微细颗粒，并且可以减少吸湿性 尽可能的性能，其制备方法和使用该树脂组合物得到的固化制剂。 本发明涉及一种树脂组合物，其包含具有缩水甘油基和/或环氧基中的至少一个的化合物和无机微粒，树脂组合物包含酚化合物的三种组分，具有至少一种 缩水甘油基和/或环氧基和无机微粒，含有多元酚和无机微粒的阻燃性树脂组合物和含有通过醇盐和/或金属的水解缩合反应而得到的无机微粒的分散成分 羧酸酯在分散介质中。

公开(公告)号：EP1626065B1

公开(公告)日：2010-01-20

申请号：EP05291679.8

申请日：2005-08-05

Applicant: NIPPON SHOKUBAI CO., LTD.

Inventor： Sugioka, Takuo ,  Tsujino, Yasunori

IPC: C08K5/13 ,  C08L71/10 ,  C08K3/36 ,  C08L61/00 ,  C08G59/62 ,  C08G65/38 ,  H01L23/31 ,  H05K1/03 ,  H01L23/29

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance inwhich transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.