公开(公告)号：EP2525399A4

公开(公告)日：2016-11-23

申请号：EP10856616

申请日：2010-11-16

Applicant: ZTE CORP

Inventor： LV FEI ,  GE HU ,  SONG JIE

IPC: H01L23/31 ,  H01L23/48 ,  H03H9/05 ,  H05K3/34

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

公开(公告)号：EP1598931B1

公开(公告)日：2010-10-06

申请号：EP05253115.9

申请日：2005-05-19

Applicant: Nihon Dempa Kogyo Co., Ltd.

Inventor： Ito, Manabu ,  Fukudu, Minoru ,  Kudo, Tetuo ,  Uchida, Takeshi

IPC: H03B5/36 ,  H03B5/04 ,  H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

公开(公告)号：EP2091078A4

公开(公告)日：2010-03-24

申请号：EP07831416

申请日：2007-11-08

Applicant: NIHON DEMPA KOGYO CO

Inventor： YAMADA HIROAKI

IPC: H01L23/12 ,  H03H9/02 ,  H05K3/34

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

公开(公告)号：EP1624740B1

公开(公告)日：2009-09-23

申请号：EP05013421.2

申请日：2005-06-22

Applicant: ENDRESS + HAUSER WETZER GmbH + Co. KG

Inventor： Härle, Thomas ,  Konrad, Michael ,  Wöhrle, Markus

IPC: H05K9/00

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K2201/10068 ,  H05K2201/10727

公开(公告)号：EP1624740A2

公开(公告)日：2006-02-08

申请号：EP05013421.2

申请日：2005-06-22

Applicant: ENDRESS + HAUSER WETZER GmbH + Co. KG

Inventor： Härle, Thomas ,  Konrad, Michael ,  Wührle, Markus

IPC: H05K9/00

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K2201/10068 ,  H05K2201/10727

Abstract: Die Erfindung bezieht sich auf eine Vorrichtung zur Aufnahme und zur Befestigung eines elektronischen Bauelements (9) auf einer Leiterplatte (2). Das Bauelement ist in einem Gehäuse (1) mit einer Bodenfläche (3), mit einer auf die Form der Bodenfläche (3) angepassten Anzahl von Seitenflächen (4) und mit einer entsprechenden Deckfläche (8), die aus einem elektrisch leitenden Material gefertigt ist, angeordnet. Desweiteren ist zumindest ein elektrisch leitendes Verbindungselement (7) vorgesehen, das so ausgebildet und/oder angeordnet ist, dass die Abdeckfläche (5) über das Verbindungselement (7) auf einem Bezugspotential der Leiterplatte (2) liegt.

Abstract translation: 电子元件（9）被安装在电路板（2）由含实施壳体（1）与侧面（4）和顶面的导电材料（8）。 有顶盖面（5）由电绝缘中间layer.Implement从顶面绝缘包括导电连接器（一个或多个）（7）如此形成和/或嵌合做顶盖板位于在通过连接器的电路板的参考电势。 优选绝缘中间层绝缘，以便侧面。 连接器可以是焊接鳍。

公开(公告)号：EP1065915A3

公开(公告)日：2003-05-02

申请号：EP00113282.8

申请日：2000-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Suemasa, Hajime ,  Maruyama, Takashi

IPC: H05K3/40 ,  H05K3/34

CPC classification number: H05K3/3442 ,  H01P1/2053 ,  H01P1/2136 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09736 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2203/0353 ,  Y02P70/613

Abstract: There is disclosed an electronic part comprising: a printed circuit board (1') including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board (1'); a terminal electrode (2) disposed on the second major surface of the printed circuit board (1') and including a major surface opposed to the second major surface of the printed circuit board (1'); a soldering-resistant film (3) disposed on the second major surface of the printed circuit board (1') and including a major surface opposed to the second major surface of the printed circuit board (1'); wherein the distance between the major surface of the terminal electrode (2) and the second major surface of the printed circuit board (1') is substantially equal to or larger than the distance between the major surface of the soldering-resistant film (3) in the vicinity of the terminal electrode (2) and the second major surface of the printed circuit board (1').

公开(公告)号：EP0696078B1

公开(公告)日：2000-01-12

申请号：EP95305296.6

申请日：1995-07-28

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Morino, Takayoshi ,  Kashima, Yukiro

IPC: H01P7/10

CPC classification number: H01P7/10 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/10068 ,  H05K2201/10371

公开(公告)号：EP0696078A1

公开(公告)日：1996-02-07

申请号：EP95305296.6

申请日：1995-07-28

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Morino, Takayoshi ,  Kashima, Yukiro

IPC: H01P7/10

CPC classification number: H01P7/10 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/10068 ,  H05K2201/10371

Abstract: A microwave oscillator comprising:
   a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a perforated hole,
   an electronic component mounted on the top surface of the substrate,
   a metal plate fixed to the bottom surface of the substrate closing the bottom of the perforated hole, and
   a dielectric resonator fixed on the metal plate through the perforated hole.
Since the dielectric resonator is fixed on the metal plate by soldering, fixing is stronger and stabler as compared with conventional fixing using an adhesive, thereby enhancing the reliability against temperature changes, mechanical impact or humidity.

Abstract translation: 一种微波振荡器，包括：在顶表面上具有电路图案的基板，覆盖底表面的薄铜箔，以及穿孔，安装在基板的顶表面上的电子部件，固定到底表面的金属板 所述基板封闭所述穿孔的底部，以及通过所述穿孔将固定在所述金属板上的介质谐振器。 由于介电谐振器通过焊接固定在金属板上，与使用粘合剂的常规定影相比，固定更坚固和更稳定，从而提高了耐温度变化，机械冲击或湿度的可靠性。 $$

公开(公告)号：EP0437976A3

公开(公告)日：1991-09-25

申请号：EP90314303.0

申请日：1990-12-27

Applicant: NEC CORPORATION

Inventor： Norimatsu, Hidehiko, c/o NEC Corporation

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: A voltage-controlled oscillator (VCO) mounted on a laminated printed circuit board (10) which has a surface layer (12) a plurality of intermediate layers (14,16), and a back layer (18). Various component parts of the VCO are arranged on the surface layer (12). One of the intermediate layers (14,16) which underlies the surface layer (12) constitutes a ground potential layer and is removed in a part thereof corresponding to the area (4) where the parts of the VCO are positioned.

公开(公告)号：EP0437976A2

公开(公告)日：1991-07-24

申请号：EP90314303.0

申请日：1990-12-27

Applicant: NEC CORPORATION

Inventor： Norimatsu, Hidehiko, c/o NEC Corporation

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: A voltage-controlled oscillator (VCO) mounted on a laminated printed circuit board (10) which has a surface layer (12) a plurality of intermediate layers (14,16), and a back layer (18). Various component parts of the VCO are arranged on the surface layer (12). One of the intermediate layers (14,16) which underlies the surface layer (12) constitutes a ground potential layer and is removed in a part thereof corresponding to the area (4) where the parts of the VCO are positioned.

Abstract translation: 一种安装在层压印刷电路板（10）上的压控振荡器（VCO），其具有表面层（12），多个中间层（14,16）和背层（18）。 VCO的各个组成部分布置在表面层（12）上。 在表面层（12）下面的中间层（14,16）之一构成接地电位层，并且在其对应于VCO的部分所在的区域（4）的一部分中被去除。