公开(公告)号：EP2964004A2

公开(公告)日：2016-01-06

申请号：EP15001912.3

申请日：2015-06-29

Applicant: Karlsruher Institut für Technologie

Inventor： Meißer, Michael ,  Blank, Thomas

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/642 ,  H01L23/645 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/0792 ,  H05K2201/09036 ,  H05K2201/10015 ,  H01L2924/00014

Abstract: Die vorliegende Erfindung stellt eine elektronische Bauteilanordnung mit einem Leistungselektronikmodul (2) und einem übergeordneten Schaltungsträger (3) bereit. Dabei weist das Leistungselektronikmodul zumindest eine elektrisch leitende Lage (4) und der übergeordnete Schaltungsträger zumindest eine weitere elektrisch leitende Lage (5) als Oberflächenstruktur auf. Erfindungsgemäß sind das Leistungselektronikmodul und der übergeordnete Schaltungsträger durch zumindest ein plattenförmiges Verbindungselement (6) miteinander elektrisch und mechanisch verbunden, wobei das zumindest eine Verbindungselement zumindest eine elektrisch leitende Lage (7) als Oberflächenstruktur aufweist, die mit der zumindest einen elektrisch leitenden Lage des Leistungselektronikmodus und der zumindest einen elektrisch leitenden Lage des übergeordneten Schaltungsträgers elektrisch verbunden ist; und wobei das Verbindungselement zumindest einen Kondensator (6b) mit einer nicht leitenden Oberfläche aufweist, die die zumindest eine elektrisch leitende Lage trägt.

Abstract translation: 本发明提供设置有功率电子模块（2）和一个较高级别的电路板上的电子元件组件（3）。 在这种情况下包括至少一个导电层（4）和更高级的电路载体上的功率电子模块中，至少一个另外的导电层（5）的表面结构。 根据本发明的电力电子模块和由至少一个板形连接元件的更高级别的电路载体（6）的电和机械地相互连接，其中，所述至少一个连接元件包括至少一个导电层（7）具有作为表面结构，具有电力电子模式的至少一个导电层和 其至少电连接到母体电路板的导电层; 并且其中，所述连接元件具有至少一个电容器（6B）与非导电表面带有至少一个导电层。

公开(公告)号：EP2756741A1

公开(公告)日：2014-07-23

申请号：EP12773247.7

申请日：2012-09-17

Applicant: SMA Solar Technology AG

Inventor： MALLWITZ, Regine

IPC: H05K1/02 ,  H05K1/16 ,  H01L23/66 ,  H02M7/00

CPC classification number: H05K1/181 ,  H01L23/66 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/3011 ,  H02M7/003 ,  H05K1/0228 ,  H05K1/0234 ,  H05K1/0263 ,  H05K1/165 ,  H05K2201/0723 ,  H05K2201/0792 ,  H05K2201/083 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A circuitry arrangement (1) comprising several electronic parts (25, 26) mounted to a circuit board (2), at least one conductor section (4, 5) extending between the electronic parts (25, 26) within a first conductor layer, and a closed conductor loop (13) comprising at least one loop section (6, 7) running in parallel to the at least one conductor section (4, 5) within a second conductor layer neighboring the first conductor layer. The closed conductor loop (13) is configured to reduce a tendency towards oscillations of a current flowing through the conductor section (4, 5) in operation of the circuitry arrangement (1). The conductor loop (13) is closed via at least one electronic component (11) mounted to an outer surface (3) of the circuit board (2).

公开(公告)号：EP0617568B1

公开(公告)日：1997-07-02

申请号：EP94301987.7

申请日：1994-03-21

Applicant: Compaq Computer Corporation

Inventor： Stoddard, D Joe

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K2201/0792 ,  H05K2201/09772 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：EP0437976B1

公开(公告)日：1995-08-30

申请号：EP90314303.0

申请日：1990-12-27

Applicant: NEC CORPORATION

Inventor： Norimatsu, Hidehiko, c/o NEC Corporation

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

公开(公告)号：EP0617568A1

公开(公告)日：1994-09-28

申请号：EP94301987.7

申请日：1994-03-21

Applicant: Compaq Computer Corporation

Inventor： Stoddard, D Joe

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0094 ,  H05K2201/0792 ,  H05K2201/09772 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor mounting structure for printed circuit boards wherein the capacitor includes first and second terminals (15a,15b) which are connected to first and second conductor planes (44,45) in the printed circuit board (B). Three vias (41,42,43) are mounted in the printed circuit board (B) in a position to be aligned with the middle of the capacitor. A first conductor pad (45) is mounted underneath one end of the capacitor and includes spaced apart extension portions (45b,45c) which electrically attach to the first (41) and third via (43). A second conductor pad (44) is mounted under the other end of the capacitor and includes a central extension portion (44b) which attaches to the second or middle via (42). In this manner, the region available for generation of parasitic inductance is minimized thereby increasing the operating efficiency of the capacitor.

Abstract translation: 一种用于印刷电路板的电容器安装结构，其中电容器包括连接到印刷电路板（B）中的第一和第二导体平面（44,45）的第一和第二端子（15a，15b）。 三个通孔（41,42,43）安装在印刷电路板（B）中以与电容器的中间对准的位置。 第一导体焊盘（45）安装在电容器的一端下方，并且包括电连接到第一（41）和第三通孔（43）的间隔开的延伸部分（45b，45c）。 第二导体焊盘（44）安装在电容器的另一端之下，并且包括连接到第二或中间通孔（42）的中心延伸部分（44b）。 以这种方式，可用于产生寄生电感的区域被最小化，从而提高了电容器的工作效率。

公开(公告)号：EP2984714B1

公开(公告)日：2018-12-26

申请号：EP14717441.1

申请日：2014-04-10

Applicant: Brightloop

Inventor： LIFFRAN, Florent ,  RABOT, Olivier

IPC: H01S5/042 ,  H05K1/18 ,  H05K1/02 ,  H03K3/57

CPC classification number: H01S5/0428 ,  H03K3/57 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10446 ,  H05K2201/10545 ,  Y02P70/611

公开(公告)号：EP2984714A1

公开(公告)日：2016-02-17

申请号：EP14717441.1

申请日：2014-04-10

Applicant: Brightloop

Inventor： LIFFRAN, Florent ,  RABOT, Olivier

IPC: H01S5/042 ,  H05K1/18 ,  H05K1/02 ,  H03K3/57

CPC classification number: H01S5/0428 ,  H03K3/57 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10446 ,  H05K2201/10545 ,  Y02P70/611

Abstract: The invention concerns a device for controlling at least one diode 2, the control device comprising an electrical card 4 comprising a printed circuit 5 on which the following are mounted: a diode 2, a front component 7 and a storage capacitor 9 connected in such a way as to form a circuit loop 17 extending substantially in a thickness of the electrical card 4.

公开(公告)号：EP1850384A3

公开(公告)日：2014-04-30

申请号：EP07002771.9

申请日：2007-02-08

Applicant: Oclaro Japan, Inc.

Inventor： Sasada, Michihide Hitachi, Ltd. Intell.Prop.Office ,  Kagaya, Osamu Hitachi, Ltd. Intell.Prop.Office ,  Okamura, Yukitoshi Hitachi Ltd. Intell.Prop.Office

IPC: H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01L25/167 ,  H01L2224/48137 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K1/189 ,  H05K3/306 ,  H05K2201/0191 ,  H05K2201/0792 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A photodetector module that can achieve impedance matching and power saving. A photodetector (11) and an amplifier (12) for amplifying an electric signal from the photodetector (11) are mounted on a stem (14). A dielectric plate (18) is arranged between the stem (14) and a flexible substrate (20). To transfer an electric signal from the amplifier (12) to the substrate (20), a lead pin (15d) is provided to pass through the stem (14) and the dielectric plate (18). The output of the amplifier (12) includes a capacitance component, and the output impedance of the amplifier (12) is higher than the impedance that matches with the substrate (20). Further, the thickness d of the dielectric plate (18) is such that the inductance component of the lead pin (15d) includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate (20) can be achieved.

公开(公告)号：EP1037328B1

公开(公告)日：2003-10-22

申请号：EP00202137.6

申请日：1996-02-07

Applicant: JOHNSTECH INTERNATIONAL CORPORATION

Inventor： Johnson, David A. ,  Kline, Eric V.

IPC: H01R13/66 ,  H01L23/64

CPC classification number: H01R13/2464 ,  H01L23/64 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/2407 ,  H01R13/6464 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6608 ,  H01R13/719 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K7/1092 ,  H05K2201/0792 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

公开(公告)号：EP1063733A2

公开(公告)日：2000-12-27

申请号：EP00203339.7

申请日：1996-02-07

Applicant: JOHNSTECH INTERNATIONAL CORPORATION

Inventor： Johnson, David A. ,  Kline, Eric V.

IPC: H01R13/66

CPC classification number: H01R13/2464 ,  H01L23/64 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/2407 ,  H01R13/6464 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6608 ,  H01R13/719 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K7/1092 ,  H05K2201/0792 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

Abstract: The invention concerns an electrical connector apparatus for transmitting a signal between a first terminal (18), for connection to a first device, and a second terminal (20), for connection to second device, characterised in that it comprises:

a rigid contact for electro-mechanically interconnecting the first terminal to the second terminal, said contact comprising electrical affecting means (10) for electrically affecting the signal as the signal is transmitted between the first terminal and the second terminal, said electrical affecting means comprising a controlled impedance formed between two components within said connector.