Abstract:
The invention relates to a method of making an RFID tag comprising the steps of: a) providing a dielectric substrate (502); b) forming on said substrate an antenna circuit (515), said antenna circuit comprising more than one turn (515) and a first (521) and second (522) antenna terminals, said first terminal comprising an arm portion (5211) and a terminal end (5212), c) cutting out said dielectric substrate to form a dielectric tongue (540), d) bending said dielectric tongue so that a portion of said dielectric tongue is used as an insulating layer between said more than one turn and a conductive path between said first and second.
Abstract:
Ein Verteiler (1) umfasst ein Gehäuse (2), das eine Mehrzahl erster Anschlüsse für externe Feldgeräte wie Sensoren, Aktoren, Initiatoren und dgl. aufweist und wenigstens ein oder mehrere zweite Anschlüsse zum Anschluss des Verteilers z.B. an ein übergeordnetes Bussystem oder zur Verbindung des Verteilers mit weiteren Verteilern. Die ersten und zweiten Anschlüsse sind auf einer Leiterplatte (9) angeordnet und über eine elektrische Schaltung, die zumindest Leiterbahnen umfasst, leitend miteinander verbunden, wobei eine zwei Punkte (P1, P2) auf der Leiterplatte (9) leitend miteinander verbindende und mit einem Schneidwerkzeug wie einem Seitenscheider durchtrennbare leitende Brücke zwischen den Punkten (P1, P2) vorgesehen ist.
Abstract:
The invention relates to a solder element for making electrically conducting connections on either side of a printed circuit board, comprising an electrically conducting wire which is provided with at least one body composed of solder material and flux material, wherein the body is preferably composed of solder material and provided with a recess in which the flux material is received, or the flux material is preferably accommodated between two bodies of solder material arranged on the wire.
Abstract:
Conductive wiring members, such as copper foil wiring (2a), (2b) printed on both sides of an insulating substrate (1), or the like, are connected by passing a conducting wire (7), (9) provided with a solder ball (8), (10) through a through-hole (3) in the vicinity of the conductive wiring members (2a), (2b), and then soldering the conductive wiring member (2a) or (2b) to the part of the conducting wire (7) or (9) on one surface by dip soldering or flow soldering, thereby melting the solder ball (8) to connect the part of the conducting wire (7) or (9) to the conductive wiring member (2a) or (2b) on the other surface.
Abstract:
A programmable header constructed from an integral lamina circuit arrangement comprising a plurality of electrically conductive pins in fixed spaced relationship, at least one electrically conductive highway, an electrically conductive lowway, a plurality of electrically conductive cross-links each connecting a separate one of said pins to said lowway and a plurality of electrically conductive side-links each connecting a separate one of said pins to a said highway, wherein said highway or highways lie in a plane or planes spaced from and parallel to a plane in which lies said lowway and are superimposed on but spaced from said cross-links, and wherein said pins project normal to said planes in spaced parallel relationship, said lowway and portions of said links being free from said superimposition thereby to facilitate selective removal of desired portions of said links and lowway to break electrical continuity thereof so as to program interconnection between said pins in a desired manner.
Abstract:
The present invention relates to a gearbox control module (10) of a motor vehicle gearbox, wherein the gearbox control module has a circuit-supporting device (12), a baseplate (14) and a cover (16), wherein the circuit-supporting device is arranged at least partially between the baseplate and the cover. The circuit-supporting device has at least a first circuit carrier (18) and a second circuit carrier (20), wherein the first circuit carrier has a recess (22), and the second circuit carrier is arranged in the recess. The second circuit carrier is completely covered by the cover, and the cover is connected in a seal-forming fashion to the baseplate via the first circuit carrier. The first and second circuit carriers each have multiplicity of contact points (24) which are connected to a multiplicity of connections (26). In order to make available an arrangement of a circuit device which is easy to manufacture and reliable in terms of a seal, the first and the second circuit carriers are embodied in a planar and a plate-shaped fashion and the connections of the second and first circuit carriers are embodied with bridge connections which each penetrate the first and second circuit carriers at the end sides, for example solder bridges (28).
Abstract:
A light emitting device array is provided comprising a printed circuit board on which a plurality of electrode patterns having the same width is formed, a light emitting device package disposed on a predetermined number of electrode patterns and a power supply line disposed on at least one of the remaining electrode pattern except for the predetermined number of electrode patterns.