公开(公告)号：EP0420604A1

公开(公告)日：1991-04-03

申请号：EP90310520.3

申请日：1990-09-26

Applicant: MOTOROLA, INC.

Inventor： Leicht, John Laurence

IPC: H01R4/04 ,  H05K1/14

CPC classification number: H05K3/321 ,  H01R4/04 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K2203/167

Abstract: An adhesive interconnection device of Figure 2 (115) providing a simplified simultaneous electrical and mechanical interconnection using one preformed member, comprised of a pattern of non-pressure activated electrically conductive adhesive members (140) and nonconductive adhesive members (145), which must be aligned with the conductive pads of at least two planar electrical devices (100 and 105). Sandwiching the device (115) between at least two electrical devices causes simultaneous electrical conduction paths and mechanical bonds (230) between the two electrical devices. An additional heat curing step may be introduced to achieve the proper conductivity level in the electrically conductive members required for a specific application.

Abstract translation: 图2的（115）提供使用由非压力的图案的一个预成型件的简化同时电气和机械互连的粘合剂互连设备中启动的导电粘接部件（140）和非导电粘接件（145）必须被 具有至少两个平面的电气设备（100和105）的导电垫对齐。 至少两个电装置之间夹持所述装置（115）使两个电设备之间的同时导电路径和机械键（230）。 附加的热固化步骤可以被引入以实现特定应用所需的导电构件的适当的导电性水平。

公开(公告)号：EP0338447A2

公开(公告)日：1989-10-25

申请号：EP89106709.2

申请日：1989-04-14

Applicant: Bodenseewerk Gerätetechnik GmbH

Inventor： Ohlenburger, Hans

IPC: H05K1/02 ,  H05K3/34 ,  H05K7/20 ,  H05K3/22

CPC classification number: H05K1/09 ,  H05K1/0206 ,  H05K3/244 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0338 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2203/0723

Abstract: Zur Wärmeabfuhr von auf einer Leiterplatte montierten Bauelementen ist auf die Leiterplatte (10) eine Kupferschicht (14) aufgebracht und auf diese Kupferschicht (14) eine Schicht (16) aus Reinaluminium aufgavanisiert. Die Leiterplatte (10) ist auf beiden Seiten mit Kupfer- und Reinaluminiumschichten (14,16) versehen, wobei die Bauelemente (12) jeweils auf einer solchen Kupfer- und Reinaluminiumschicht montiert sind. Die Leiterplatte (10) weist im Bereich der Bauelemente (12) Bohrungen (22) auf. Die Kupfer- und Reinaluminiumschicht (14, 16) erstreckt sich über die Innenwandung der Bohrung (22), so daß eine Verbindung (24) zwischen der mit dem Bauelement (12) in Kontakt befindlichen Kupfer- und Reinaluminiumschicht (14,16) und der Kupfer- und Reinaluminiumschicht auf der gegenüberliegenden Seite der Leiterplatte (10) hergestellt ist. Die aufgalvanisierte Reinaluminiumschicht (16) ist im Bereich der Bauteile (12) zur Erzielung einer planen Ober­fläche mechanisch bearbeitet. In der Kupfer- und Rein­aluminiumschicht (14,16) sind Bereiche (18) ausgespart, in denen Lötanschlüsse (20) und Leiterbahnen angeordnet sind.

Abstract translation: 为了从安装在印刷电路板上的部件散发热量，将铜层（14）施加到印刷电路板上，并将纯铝层（16）镀锌到该铜层（14）上。 印刷电路板（10）在两侧设置有铜和纯铝层（14,16），每种情况下的部件（12）安装在这种铜和纯铝层上。 印刷电路板（10）在部件（12）的区域中具有孔（22）。 铜和纯铝层（14,16）在孔（22）的内壁上延伸，使得在铜和纯铝层（14,16）之间产生连接（24），该铝和纯铝层与部件 （12）和在印刷电路板（10）的相对侧上的铜和纯铝层。 镀锌的纯铝层（16）在组件（12）的区域中被机械加工，以实现平坦的表面。 在铜和纯铝层（14,16）中切出区域（18），其中布置有焊料连接（20）和导体轨道。 ... ...

公开(公告)号：EP0276062A2

公开(公告)日：1988-07-27

申请号：EP88300153.9

申请日：1988-01-08

Applicant: TEKTRONIX, INC.

Inventor： Berg, William E.

IPC: H05K7/10

CPC classification number: H05K7/1061 ,  H01L2224/48091 ,  H05K3/325 ,  H05K2201/10303 ,  H05K2201/10393 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49133 ,  H01L2924/00014

Abstract: A substrate structure (10) having contact pads (14) is mounted to a circuit board (70) which has pads (74) of con­ductive material exposed at one main face of the board and has registration features (78) which are in predetermined positions relative to the contact pads of the circuit board. The substrate structure (10) is provided with leads (34) which are electrically con­nected to the contact pads (14) of the substrate struc­ture and project from the substrate structure in cantilever fashion. A registration element has a plate portion and also has registration features (78) which are distributed about the plate portion and are engageable with the registration features (76) of the circuit board, and when so engaged, maintain the registration element against movement parallel to the general plane of the circuit board. The substrate structure is attached to the plate por­tion of the registration element so that the leads are in predetermined positions relative to the registration features of the registration element. The registration features of the registration ele­ment are brought into engagement with the registra­tion features of the circuit board, and in this position of the registration element the leads of the substrate structure (34) overlie the contact pads (74) of the circuit board. A clamp member (90) maintains the leads in electrically conductive pressure contact with the contact pads of the circuit board.

Abstract translation: 具有接触焊盘（14）的基板结构（10）安装到电路板（70），电路板（70）具有在板的一个主面处露出的导电材料的焊盘（74），并具有位于预定位置的配准特征（78） 相对于电路板的接触焊盘。 衬底结构（10）设置有引线（34），引线（34）电连接到衬底结构的接触焊盘（14）并以悬臂方式从衬底结构突出。 配准元件具有板部分并且还具有分布在板部分周围并且可与电路板的配准特征（76）接合的配准特征（78），并且当被接合时，保持配准元件抵抗平行于 电路板的一般平面。 衬底结构附着到配准元件的板部分，使得引线相对于配准元件的配准特征处于预定位置。 配准元件的对准特征与电路板的配准特征相配合，并且在配准元件的该位置，衬底结构（34）的引线覆盖电路板的接触焊盘（74）。 夹持构件（90）将引线保持与电路板的接触焊盘的导电压力接触。

公开(公告)号：EP0030167A1

公开(公告)日：1981-06-10

申请号：EP80401428.0

申请日：1980-10-07

Applicant: THOMSON-CSF

Inventor： Val, Christian ,  Vergnolle, Claude

IPC: H05K3/36

CPC classification number: H05K3/363 ,  H05K1/0289 ,  H05K2201/053 ,  H05K2201/09145 ,  H05K2201/10136 ,  H05K2201/10477

Abstract: L'invention concerne les moyens de connexions entre des éléments de commande de petites dimensions -circuits intégrés- et des éléments commandés de plus grandes dimensions -têtes d'écriture ou panneau d'affichage-.
Dans le but de réaliser une connectique de multiplexage simple, fiable et ne comportant qu'un seul niveau de conducteurs, le circuit souple (14) sur lequel sont portés les éléments de commande est directement utilisé comme moyen de connexion, et certains conducteurs sont dérivés (22), à la surface des pastilles (12) de semiconducteurs, pour éviter les croisements de liaisons multiplexées.
Application aux dispositifs répétitifs à résistances chauffantes, photodiodes, plasmas, pour têtes de lecture ou écriture, ou pour panneau d'affichage.

Abstract translation: 1.插件和用于微电路的电子控制（12），在具有受控元件（11），在为特征的双向连接复用插座装置做了它包括： - 用于使导体的单级（13，18的柔性电路氢化物（14） ）; - 电子微电路（12），通过所述柔性电路支撑和多个连接的连接到（13）朝向所述控制元件（11）; - 当前合成微电路进料（18）从朝向由微电路发射机胶囊的表面改性其他微电路的第一微电路被分布，并包括一个补充绝缘层的红利（121），其中脱离预先存在连接端子（ 21，微电路（12）和沉积在绝缘层上的金属化条带（22）的红利的表面上，形成向输入端子（21）和每个微电路的输出端（23）之间的桥23）。

公开(公告)号：EP2424339A1

公开(公告)日：2012-02-29

申请号：EP11178699.2

申请日：2011-08-24

Applicant: Samsung Mobile Display Co., Ltd.

Inventor： Choi, Gyeong-Im ,  Seo, Sung-Gon ,  Chung, Jae-Mo

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/341 ,  H01L2224/45139 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component (100) which can be readily miniaturized and made compact, and which has a simple manufacturing process, and a method of manufacturing the same, the electronic component including a printed circuit board (PCB) (110) having a first surface (110a) and a through-hole (110c), a semiconductor device (120) mounted in the through-hole and combined with the first surface of the PCB and at least one passive device combined with the first surface of the PCB and at leat one passive device (130) combined with the first surface of the PCB.

Abstract translation: 一种电子部件（100），其可以容易地小型化并且制造得紧凑，并且具有简单的制造工艺及其制造方法，该电子部件包括具有第一表面的印刷电路板（PCB）（110） 110a）和通孔（110c），安装在通孔中并与PCB的第一表面组合的半导体器件（120）和与PCB的第一表面组合的至少一个无源器件 无源器件（130）与PCB的第一表面组合。

公开(公告)号：EP2322853A3

公开(公告)日：2011-09-21

申请号：EP11153366.7

申请日：2005-09-27

Applicant: Immobiliare Eder S.R.L.

Inventor： Cucchi, Mauro ,  Incerti, Edda

IPC: F21K99/00 ,  F21V29/00 ,  H05K1/18 ,  F21V19/00 ,  F21Y101/02

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/0055 ,  F21V23/002 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  H05K2201/1056

Abstract: The device is of the type comprising: - a laminate (6, 30, 38, 54, 57, 60, 64, 79, 91, 109, 127) with a printed circuit; - at least one power LED (1, 16, 56, 59, 62, 63, 78, 89, 90, 107, 108, 125, 126) comprising a main body (4, 144) with two electrical terminals (3, 35, 44, 47) protruding from this, connected to such printed circuit, and with a slug (5, 20, 29, 37,49, 53) on one side acting as heat sink for dispersion of heat; - a metallic body (9, 22, 33, 42, 67, 82, 96, 114, 132) where such slug is connected indirectly in order to permit such dispersion of heat, such metallic body having a flat face parallel and opposed to such laminate and on which the laminate is fastened; and is characterized by the fact that: - the LED is not outside the laminate of the printed circuit but is inserted in the same through a hole (7, 31, 39, 65, 80, 92, 93, 110, 111, 128, 129) present in the printed circuit; - the aforesaid face is covered, at least at a position opposite to the aforesaid LED, by a thin layer (8, 32, 41, 66, 81, 94, 95, 112, 113, 130, 131) of insulating material in contact with such slug, to assure not only electrical insulation but also thermal coupling with the slug; - the edges of such hole, pressing on the body of the LED, maintain the aforesaid slug in contact with such thin layer of insulating material.

Abstract translation: 该装置的类型包括： - 具有印刷电路的层压板（6,30,38,54,57,60,64,79,91,109,127） - 至少一个功率LED（1,16,56,59,62,63,78,89,90,107,108,125,126），包括具有两个电端子（3,35）的主体（4,144） ，44,47），与该印刷电路连接，并且在一侧上具有用作散热器的散热片（5,20,29,37,49,53），用于散热; - 金属体（9,22,33,42,67,82,96,114,132），其中这种金属块间接连接以允许这种散热，这种金属体具有平坦的表面，并且与这种金属表面平行并与之相对 层压材料并且其上固定层压材料; 其特征在于： - LED不在印刷电路的层压板之外，而是通过孔（7,31,39,65,80,92,93,110,111， 存在于印刷电路中; - 至少在与上述LED相对的位置处，通过绝缘材料接触的薄层（8,32,41,66,81,94,95,112,113,130,131）覆盖上述表面 用这样的塞子，不仅能保证电绝缘，还能保证与塞子的热耦合; - 这种孔的边缘压在LED的主体上，保持上述塞块与这种绝缘材料薄层接触。

公开(公告)号：EP2010452B1

公开(公告)日：2011-07-13

申请号：EP07735462.9

申请日：2007-04-11

Applicant: NXP B.V.

Inventor： WEEKAMP, Johannes, W. ,  SLOB, Cornelis ,  SCHEER, Jacob, M. ,  VAN STRATEN, Freerk, E.

IPC: B81C1/00

CPC classification number: B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

Abstract: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; -providing an electronic component (10) having a first pattern with a substantially closed configuration; -providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; -providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; -disposing solder material at the solder pad; -positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; -reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

公开(公告)号：EP2322853A2

公开(公告)日：2011-05-18

申请号：EP11153366.7

申请日：2005-09-27

Applicant: Immobiliare Eder S.R.L.

Inventor： Cucchi, Mauro ,  Incerti, Edda

IPC: F21V29/00 ,  H05K1/18 ,  F21K99/00 ,  F21Y101/02

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V19/0055 ,  F21V23/002 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  H05K2201/1056

Abstract: The device is of the type comprising: - a laminate (6, 30, 38, 54, 57, 60, 64, 79, 91, 109, 127) with a printed circuit; - at least one power LED (1, 16, 56, 59, 62, 63, 78, 89, 90, 107, 108, 125, 126) comprising a main body (4, 144) with two electrical terminals (3, 35, 44, 47) protruding from this, connected to such printed circuit, and with a slug (5, 20, 29, 37,49, 53) on one side acting as heat sink for dispersion of heat; - a metallic body (9, 22, 33, 42, 67, 82, 96, 114, 132) where such slug is connected indirectly in order to permit such dispersion of heat, such metallic body having a flat face parallel and opposed to such laminate and on which the laminate is fastened; and is characterized by the fact that: - the LED is not outside the laminate of the printed circuit but is inserted in the same through a hole (7, 31, 39, 65, 80, 92, 93, 110, 111, 128, 129) present in the printed circuit; - the aforesaid face is covered, at least at a position opposite to the aforesaid LED, by a thin layer (8, 32, 41, 66, 81, 94, 95, 112, 113, 130, 131) of insulating material in contact with such slug, to assure not only electrical insulation but also thermal coupling with the slug; - the edges of such hole, pressing on the body of the LED, maintain the aforesaid slug in contact with such thin layer of insulating material.

Abstract translation: 该装置的类型包括：具有印刷电路的层压板（6,30,38,54,57,60,64,79,91,109,127）; - 至少一个功率LED（1,16,56,59,62,63,78,89,90,107,108,125,126,126）包括具有两个电端子（3,35）的主体（4,144） ，44,47），连接到这种印刷电路，并且在作为用于散热的散热器的一侧上的芯块（5,20,29,37,49,53）上; - 金属体（9,22,33,42,67,82,96,114,132），其中这样的塞子间接连接以允许这种热分散，这样的金属体具有平行并与之相对的平坦面 层压板，并在其上固定层压板; 并且其特征在于：LED不在印刷电路层叠体的外部，而是通过孔（7,31,39,65,80,92,93,110,111,128， 129）存在于印刷电路中; - 至少在与上述LED相对的位置处，上述面被接触绝缘材料的薄层（8,32,31,66,81,94,95,112,113,130,131）覆盖 具有这种块状物，以确保不仅电绝缘，而且确保与块塞的热耦合; - 这种孔的边缘压在LED的主体上，保持上述的块与这种绝缘材料薄层接触。

公开(公告)号：EP2312921A1

公开(公告)日：2011-04-20

申请号：EP10181898.7

申请日：2010-09-29

Applicant: FUJITSU LIMITED

Inventor： Koide, Masateru

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/498

CPC classification number: H05K3/4608 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2924/00

Abstract: An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate.

Abstract translation: 1.一种互连板，用于互连并布置在第一电路板和第二电路板之间，所述互连板包括第一导电板，所述第一导电板包括第一连接端子，除所述第一连接端子之外的包裹所述第一导电板的第一绝缘构件， 导电板，其包括第二连接端子;第二绝缘构件，其包裹除了所述第二连接端子之外的所述第二导电板;绝缘衬底，其布置在所述第一绝缘构件和所述第二绝缘构件之间;以及导电构件，其穿过所述第一绝缘构件， 第二绝缘部件和绝缘基板。

公开(公告)号：EP2312920A2

公开(公告)日：2011-04-20

申请号：EP10179078.0

申请日：2010-09-23

Applicant: FUJITSU LIMITED

Inventor： Koide, Masateru ,  Mizutani, Daisuke

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/498 ,  H05K3/00

CPC classification number: H05K1/141 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2224/0401

Abstract: An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a conductive plate including a connection terminal to be electrically connected to a power supply terminal or a ground terminal of each of the first circuit board and the second circuit board, an insulating member wrapping the conductive plate except for the connection terminal, and a conductive member penetrating the insulating member to electrically connect a signal terminal of the first circuit board to a signal terminal of the second circuit board.

Abstract translation: 一种用于互连并布置在第一电路板和第二电路板之间的互连板，所述互连板包括导电板，所述导电板包括电连接到所述第一电路板的电源端子或接地端子的连接端子，以及 所述第二电路板，除了所述连接端子之外包覆所述导电板的绝缘构件以及穿过所述绝缘构件的导电构件，以将所述第一电路板的信号端子电连接到所述第二电路板的信号端子。