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    HYBRID INTERCONNECT
    41.
    发明公开
    HYBRID INTERCONNECT 有权
    混合VERBINDUNG

    公开(公告)号：EP3017665A1

    公开(公告)日：2016-05-11

    申请号：EP14737123.1

    申请日：2014-06-18

    Applicant: Gyrus ACMI, Inc., d.b.a. Olympus Surgical Technologies America

    Inventor： FINKMAN, Shai ,  NAVVE, Adi

    IPC: H05K1/11 ,  H05K3/36

    CPC classification number: H01R12/712 ,  A61B1/00124 ,  A61B1/00131 ,  A61B1/051 ,  H01L24/81 ,  H01L27/1469 ,  H01R12/718 ,  H04N2005/2255 ,  H05K1/117 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10151 ,  H05K2203/041 ,  H05K2203/049

    Abstract: A connector (12) for connection to terminals (18) of an integrated circuit. The connector consists of a dielectric substrate (40) having a first side and a second side. The connector has wire bond terminals (50) which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals (60), attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls (64) with a second set of the terminals of the integrated circuit.

    Abstract translation: 用于连接到集成电路的端子的连接器。 连接器由具有第一侧和第二侧的电介质基板组成。 连接器具有连接到基板的第一侧的引线接合端子，并且被配置为接收连接到集成电路的第一组端子的引线键合。 连接器还具有焊料凸块端子，附接到基板的第二侧以与引线接合端子绝缘，焊料凸块端子被配置为通过焊球与集成电路的第二组端子耦合 。

    Terminals of circuit board
    44.
    发明公开
    Terminals of circuit board 审中-公开
    电路板的终端

    公开(公告)号：EP1992491A2

    公开(公告)日：2008-11-19

    申请号：EP08015764.7

    申请日：2001-12-19

    Applicant: Seiko Epson Corporation

    Inventor： Ishizawa, Taku ,  Fukano, Takakazu ,  Saruta, Toshihisa

    IPC: B41J2/175

    CPC classification number: B41J2/17546 ,  B41J2/17503 ,  B41J2/17526 ,  B41J2/1753 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10159

    Abstract: A circuit board (10) mounted on a marking material receptacle and having a storage device for storing data relating to a marking material for print, said circuit board (10) comprising a plurality of terminals (21-27) arranged on said circuit board (10) in a single direction and connected to the storage device, wherein two of said plurality of terminals (21-27) arranged at two edges of the circuit board (10) are ground terminals (24, 27) used for determining if the marking material receptacle has been installed correctly, wherein one of said ground terminals (24, 27) receives ground potential from a printer when the marking material receptacle is installed on the printer, and another of said ground terminals (24, 27) is connected to the one of said ground terminals (24, 27) on the circuit board (10) and to be connected to a cartridge out detecting pin of the printer when the marking material receptacle is installed on the printer.

    Abstract translation: 一种电路板（10），其安装在标记材料容器上并且具有用于存储与用于打印的标记材料有关的数据的存储装置，所述电路板（10）包括布置在所述电路板上的多个端子（21-27） （10）的两个边缘处的所述多个端子（21-27）中的两个是接地端子（24,27），所述接地端子用于确定所述标记 所述接地端子（24,27）中的一个接地端子（24,27）在所述标记材料插座安装在所述打印机上时从打印机接收地电位，并且所述接地端子（24,27）中的另一个连接到所述接地端子 （10）上的所述接地端子（24,27）中的一个，并且当所述标记材料容器安装在所述打印机上时连接到所述打印机的盒出检测引脚。

    ELECTRONIC COMPONENT MODULE
    46.
    发明公开
    ELECTRONIC COMPONENT MODULE 有权
    电子元件模块

    公开(公告)号：EP1873826A2

    公开(公告)日：2008-01-02

    申请号：EP06730385.9

    申请日：2006-03-29

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： SUESADA, Tsuyoshi c/o MURATA MANUFACTURING ,  HIGASHIBATA, Kazuaki c/o MURATA MANUFACTURING ,  HOSOKAWA, Toshihiro c/o MURATA MANUFACTURING ,  KAWATA, Masaki c/o MURATA MANUFACTURING

    IPC: H01L23/12 ,  H01L25/04 ,  H01L25/18

    CPC classification number: H01L23/49816 ,  H01L23/15 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/81385 ,  H01L2924/09701 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/10727 ,  Y02P70/613

    Abstract: An electronic component module (27i) is provided with a ceramic substrate and a plurality of bonding material applying lands (3). The ceramic substrate has a rear face (27a) that is rectangular. The plurality of bonding material applying lands (3) are arranged on the rear face (27a). The plurality of bonding material applying lands (3) include outer peripheral land rows (4), each of which is arranged in a line along each side of the rear face (27a) with the exception of corner portions (7) of the rear face (27a). The plurality of bonding material applying lands (3) include corner portion inner lands (5), each of which is arranged on the rear face (27a) at a position that is shifted inwardly in a substantially diagonal direction from the corner portion (7) and is adjacent to the bonding material applying lands (3) closest to the corner portion (7) at ends of the outer peripheral land rows (4) that are arranged in lines along two sides that are connected by the corner portion (7).

    Abstract translation: 电子元件模块（27i）设置有陶瓷衬底和多个接合材料施加焊盘（3）。 陶瓷衬底具有矩形的后表面（27a）。 多个接合材料施加区域（3）布置在背面（27a）上。 除了背面的角部（7）之外，多个接合材料施加平台（3）包括外周接地排（4），其中每个沿着后表面（27a）的每个边排列成一行 （27A）。 所述多个接合材料施加平台3包括角部内平台5，所述角部内平台5中的每一个均布置在背面27a上的位置处，该位置从角部7朝向大致对角线方向向内移动， 并且在沿着由所述角部（7）连接的两侧排成一行的所述外周陆地列（4）的端部处与靠近所述角部（7）的所述结合材料施加岸台（3）相邻。

    Terminals for circuit board
    47.
    发明公开
    Terminals for circuit board 有权
    电路板端子

    公开(公告)号：EP1598198A2

    公开(公告)日：2005-11-23

    申请号：EP05018578.4

    申请日：2001-12-19

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Ishizawa, Taku ,  Fukano, Takakazu ,  Saruta, Toshihisa

    IPC: B41J2/175

    CPC classification number: B41J2/17546 ,  B41J2/17503 ,  B41J2/17526 ,  B41J2/1753 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10159

    Abstract: A circuit board (10; 200) for a marking material receptacle (40, 48), comprising a storage device (30) for storing data relating to a marking material for print, a plurality of terminals (21-27; 201-207) arranged on said circuit board (10; 200), said terminals comprising a power supply terminal (22; 202) and being arranged in a plurality of rows, characterized by two ground terminals (24, 27; 204, 207) arranged for allowing a printing device (100) to determine if said marking material receptacle has been installed correctly, where said ground terminals (24, 27; 204, 207) are located at the outermost ends of a row that is different than the row that contains said power supply terminal (22; 202), and where said ground terminals (24, 27; 202, 204) are not the terminals in closest proximity to said power supply terminal (22; 202).

    Abstract translation: 一种用于标记材料容器（40,48）的电路板（10; 200），包括用于存储与用于印刷的标记材料有关的数据的存储装置（30），多个端子（21-27; 201-207） ，布置在所述电路板（10; 200）上，所述端子包括电源端子（22; 202）并排列成多行，其特征在于两个接地端子（24,27; 204,207） 打印装置（100），以确定所述标记材料容器是否已被正确安装，其中所述接地端子（24,27; 204,207）位于与包含所述电源的行不同的行的最外端 （22; 202），并且其中所述接地端子（24,27; 202,204）不是与所述电源端子（22; 202）最接近的端子。

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