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公开(公告)号：EP0607532B1
公开(公告)日：1996-03-20
申请号：EP93118917.9
申请日：1989-12-28
Applicant: JAPAN RADIO CO., LTD
Inventor： Yamashita, Kazuo, c/o Japan Radio Co., Ltd. , Takahashi, Eiki, c/o Japan Radio Co., Ltd. , Teshigawara, Osamu, c/o Japan Radio Co., Ltd. , Kinoshita, Masaki, c/o Japan Radio Co., Ltd. , Eimura, Takeshi, c/o Japan Radio Co., Ltd. , Ohiwa, Takao, c/o Japan Radio Co., Ltd.
IPC: H05K3/46
CPC classification number: H05K3/462 , H05K1/182 , H05K1/185 , H05K3/28 , H05K3/3484 , H05K3/4038 , H05K3/4623 , H05K2201/0215 , H05K2201/0305 , H05K2201/09536 , H05K2201/10666 , H05K2201/2036 , H05K2203/1189 , H05K2203/1572 , Y10T29/49126 , Y10T29/49144
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公开(公告)号：EP0649562A1
公开(公告)日：1995-04-26
申请号：EP93917069.0
申请日：1993-07-08
Applicant: RAYCHEM CORPORATION
Inventor： GRAVES, Gregory, A. , ZHANG, Michael , CHANDLER, Daniel , CHANG, Chi-Ming Dep.of Chemical Engineering , FANG, Shou-Mean
CPC classification number: H01C7/005 , H01C1/14 , H01C1/1406 , H01C7/027 , H05K1/184 , H05K3/0097 , H05K3/3442 , H05K3/403 , H05K2201/09181 , H05K2201/09954 , H05K2201/10022 , H05K2201/10469 , H05K2201/10643 , H05K2201/10666 , Y02P70/613
Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.
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43.发明授权A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board 失效系统用于互连具有用于安装在电路板上的部件不同的连接要求电气部件。
公开(公告)号：EP0478879B1
公开(公告)日：1994-10-19
申请号：EP91104477.4
申请日：1991-03-21
Applicant: Hewlett-Packard Company
Inventor： Chang, Cheng-Cheng , Hanlon, Lawrence
IPC: H05K3/36 , H01L23/538
CPC classification number: H01L23/5385 , H01L23/04 , H01L23/5384 , H01L2924/0002 , H01L2924/01079 , H05K1/141 , H05K3/3468 , H05K3/363 , H05K2201/096 , H05K2201/10666 , H05K2201/10681 , H05K2203/0455 , H01L2924/00
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公开(公告)号：EP0529577A3
公开(公告)日：1993-08-04
申请号：EP92114444.0
申请日：1992-08-25
Applicant: Hughes Aircraft Company
Inventor： Feigenbaum, Haim , Crumly, William R. , Schreiber, Christopher M.
CPC classification number: G01R1/073 , H05K3/205 , H05K3/365 , H05K3/4007 , H05K2201/0367 , H05K2201/10666 , H05K2203/0113 , H05K2203/0152 , H05K2203/0726 , H05K2203/167
Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a, 24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical or pyramidal shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads, to which the contacts are to be connected to ensure a good contact without any need for wiping action.
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45.发明公开
公开(公告)号：EP0478879A3
公开(公告)日：1992-07-01
申请号：EP91104477.4
申请日：1991-03-21
Applicant: Hewlett-Packard Company
Inventor： Chang, Cheng-Cheng , Hanlon, Lawrence
IPC: H05K3/36 , H01L23/538
CPC classification number: H01L23/5385 , H01L23/04 , H01L23/5384 , H01L2924/0002 , H01L2924/01079 , H05K1/141 , H05K3/3468 , H05K3/363 , H05K2201/096 , H05K2201/10666 , H05K2201/10681 , H05K2203/0455 , H01L2924/00
Abstract: A system of interconnecting electrical components having conflicting bonding requirements for mounting the components to a printed circuit board. The system includes a primary printed circuit board (12) having a pattern of through-holes and having arrangements of connection sites to receive electrical components. For example, the connection sites of the primary printed circuit board may be of the type to receive components associated with the bonding requirements of surface mounting. A secondary printed circuit board (10) has a pattern of through-holes (14,16,18) corresponding to the pattern of through-holes of the primary printed circuit board. The circuit boards are wave soldered or surface mounted together by means of the corresponding patterns of through-holes. Attached to the secondary printed circuit board is one or more electrical component having bonding requirements which conflict with those of the primary printed circuit board. Preferably, a tape automated bonding frame (24) is in pressure contact with the through-holes of the secondary printed circuit board for electrical communication between the board via the through-holes.
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Patent Agency Ranking
公开(公告)号：EP0263222B1
公开(公告)日：1992-03-25
申请号：EP86430037.1
申请日：1986-10-08
Applicant: International Business Machines Corporation
Inventor： Bitaillou, Alexis , Grandguillot, Michel Joseph
IPC: H01L21/48
CPC classification number: H05K3/3478 , H01L21/4853 , H01L21/486 , H01L2224/11334 , H01L2924/15311 , H05K1/0306 , H05K3/3489 , H05K2201/09572 , H05K2201/10666 , H05K2201/10734 , H05K2203/041 , H05K2203/043 , H05K2203/0485
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公开(公告)号：EP0379736A1
公开(公告)日：1990-08-01
申请号：EP89124088.9
申请日：1989-12-28
Applicant: JAPAN RADIO CO., LTD
Inventor： Yamashita, Kazuo c/o Japan Radio Co., Ltd. , Takahashi, Eiki c/o Japan Radio Co., Ltd. , Teshigawara, Osamu c/o Japan Radio Co., Ltd. , Kinoshita, Masaki c/o Japan Radio Co., Ltd. , Eimura, Takeshi c/o Japan Radio Co., Ltd. , Ohiwa, Takao c/o Japan Radio Co., Ltd.
IPC: H05K3/46
CPC classification number: H05K3/462 , H05K1/182 , H05K1/185 , H05K3/28 , H05K3/3484 , H05K3/4038 , H05K3/4623 , H05K2201/0215 , H05K2201/0305 , H05K2201/09536 , H05K2201/10666 , H05K2201/2036 , H05K2203/1189 , H05K2203/1572 , Y10T29/49126 , Y10T29/49144
Abstract: A method of manufacturing a multilayered printed-wiring-board comprises attaching conductive members (136a, 136b; 236a, 236b; 336; 436a, 436b; 542, 642) on conductive layers (228, 230; 328, 330; 428, 430; 528, 530) superimposing a plurality of printed-wiring boards, (220, 222; 320, 322; 420, 422; 520, 522) and electrically connecting the conductive layers (228, 230; 328, 330; 428, 430; 528, 530) with one another by the conductive members (136a, 136b; 236a, 236b; 336; 436a, 436b; 542, 642).
Abstract translation: 制造多层印刷电路板的方法包括附加的导电部件（136A，136B; 542，642 236A，236B; 336; 436A，436B）上的导电层（228，230; 328,330; 428，430; 528，530）叠加印制线路板的复数，（220，222; 320,322; 420，422; 520，522）和电连接所述导电层（228，230; 328,330; 428，430; 528 ，530）彼此通过导电部件（136A，136B; 236A，236B; 336; 436A，436B; 542，642）。
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48.发明授权
公开(公告)号：EP0115460B1
公开(公告)日：1987-08-19
申请号：EP84400150.3
申请日：1984-01-24
Inventor： Servol, Jacques , Tonella, Claude
CPC classification number: H05K3/363 , H05K1/0393 , H05K1/141 , H05K3/0058 , H05K3/225 , H05K3/305 , H05K3/3447 , H05K3/386 , H05K2201/096 , H05K2201/09845 , H05K2201/10666 , H05K2201/10977 , H05K2203/066
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49.发明公开
公开(公告)号：EP0117809A1
公开(公告)日：1984-09-05
申请号：EP84400337.6
申请日：1984-02-17
Inventor： Servol, Jacques , Tonella, Claude
IPC: H05K3/36
CPC classification number: H01R12/62 , H05K1/118 , H05K3/0058 , H05K3/282 , H05K3/305 , H05K3/3468 , H05K3/36 , H05K3/363 , H05K3/386 , H05K3/4691 , H05K2201/096 , H05K2201/09781 , H05K2201/10666 , H05K2201/10977 , H05K2203/0455 , H05K2203/166
Abstract: @ L'invention concerne un dispositif de connexion électrique entre deux cartes de circuits imprimés et un procédé de connexion de deux cartes de circuits imprimés à l'aide d'un tel dispositif.
Dispositif de connexion électrique entre deux cartes de circuits imprimés, chacune de ces deux cartes comportant au moins un trou métallisé et le dispositif de connexion étant réalisé à partir d'un matériau isolant souple comportant en plus des dépôts conducteurs formant des pistes sur toute sa longueur et connectées entre au moins deux trous métallisés (23) destinés à coopérer électriquement avec les trous métallisés (16) des cartes de circuits imprimés (4 et 5) et une couche de colle recouvrant partiellement la face située en regard des cartes de circuits imprimés, destinée à assurer la liaison mécanique avec celles-ci.
Procédé de connexion électrique entre deux cartes de circuits imprimés.Abstract translation: 所述两个板包括至少一个镀通孔和连接装置由柔性绝缘材料除了所述包含导电沉积物形成在其整个长度和轨道连接的至少两个镀覆孔之间构建（23） 用于与所述印刷电路板的镀通孔（16）（4和5）和粘合剂层电配合，部分地覆盖位于所述印刷电路板相对的表面上，用于提供机械连接的目的的目的 与后者。 电的方法连接两个印刷电路板。
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50.发明公开
公开(公告)号：EP0115460A3
公开(公告)日：1984-08-29
申请号：EP84400150
申请日：1984-01-24
Inventor： Servol, Jacques , Tonella, Claude
CPC classification number: H05K3/363 , H05K1/0393 , H05K1/141 , H05K3/0058 , H05K3/225 , H05K3/305 , H05K3/3447 , H05K3/386 , H05K2201/096 , H05K2201/09845 , H05K2201/10666 , H05K2201/10977 , H05K2203/066
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