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    Prepreg, process for producing the same and printed circuit substrate using the same
    52.
    发明公开
    Prepreg, process for producing the same and printed circuit substrate using the same 失效
    预浸料坯，其制造方法以及使用其的印刷电路基板

    公开(公告)号：EP0768334A3

    公开(公告)日：1997-06-04

    申请号：EP96116329.2

    申请日：1996-10-11

    Applicant: SUMITOMO CHEMICAL COMPANY LIMITED

    Inventor： Takahashi, Tsutomu ,  Tsujimoto, Yoshifumi ,  Kumada, Hiroaki ,  Sato, Hiroyuki

    IPC: C08J5/24 ,  C08J5/04 ,  H05K1/03

    CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2457/08 ,  C08J5/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

    Abstract: The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same. A process for producing for producing a prepreg comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or thermosetting resin, which comprises the following steps (a) to (d):
    step (a) of forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkaline metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent; step (b) of maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide from the film-like material; step (c) of immersing the film-like material obtained in the step (b) in an aqueous solution or an alcoholic solution to elute the solvent and the chloride of the alkaline metal or alkaline earth metal, followed by drying to obtain a para-aramid porous film; and step (d) of impregnating the porous film obtained in the step (c) as a substrate with the thermoplastic resin and/or thermosetting resin to produce a prepreg.

    Abstract translation: 本发明提供一种具有均匀形成，低线性热膨胀系数和良好机械强度的轻质预浸料坯，其包含多孔对位取向芳香族聚酰胺膜和热塑性树脂和/或热固性树脂，所述多孔对位取向芳香族聚酰胺膜为 浸渍有热塑性树脂和/或热固性树脂，其制造方法以及使用其的印刷电路基板/基板。 一种用于生产包含多孔对位取向芳香族聚酰胺膜和热塑性树脂和/或热固性树脂的预浸料坯的制造方法，所述多孔对位取向芳香族聚酰胺膜浸渍有热塑性树脂和/或热固性树脂，所述方法包括： （a）至（d）：由含有1至10重量％特性粘度为1.0至2.8dl / g的对位芳族聚酰胺的溶液形成膜状材料的步骤（a） 和在极性酰胺溶剂或极性尿素溶剂中的1-10重量％的碱金属或碱土金属的氯化物; 步骤（b）：将膜状材料保持在不低于20℃或不高于-5℃的温度下，以从薄膜状材料沉积对位取向的芳族聚酰胺; 步骤（c）：将步骤（b）中获得的膜状材料浸入水溶液或醇溶液中以洗脱溶剂和碱金属或碱土金属的氯化物，然后干燥，得到对 - 芳族聚酰胺多孔膜; 和将步骤（c）中获得的多孔膜作为基底用热塑性树脂和/或热固性树脂浸渍以制备预浸料坯的步骤（d）。

    Laminate
    54.
    发明公开
    Laminate 失效

    公开(公告)号：EP0399219A3

    公开(公告)日：1991-07-17

    申请号：EP90107621.6

    申请日：1990-04-23

    Applicant: NITTO BOSEKI CO., LTD.

    Inventor： Matsui, Tetsuo ,  Yamaguchi, Shigeo ,  Sato, Tadashige

    IPC: B32B17/04 ,  B32B5/26 ,  B32B15/14

    CPC classification number: B32B5/26 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2311/12 ,  B32B2457/08 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0011 ,  D10B2331/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293

    Abstract: The invention relates to a laminate comprising a plurality of stacked woven fabric layers and a synthetic resin impregnated into the woven fabric layers and integrating therewith the layers, said fabric having warp yarns (1; 2) and weft yarns (3), the weft yarns (3) comprising Z-twist yarns or S-twist yarns, and the warp yarns (1; 2) comprising S-twist yarns, or Z-twist yarns and S-twist yarns, in a ratio ranging from 1/2 to 1/8 distributed nearly uniformly depending on number of twist, yarn count and thread count (threads/25 mm) of the weft yarn (3). Another laminate is also disclosed, comprising a plurality of stacked nonwoven fabric layers, woven fabric layers stacked on both faces of the nonwoven fabric layers, and a synthetic resin impregnated into the nonwoven fabric layers and the woven fabric layers and integrating with the layers, said woven fabric having warp yarns (1; 2) and weft yarns (3), the weft yarns (3) comprising Z-twist yarns or S-twist yarns, and the warp yarns (1; 2) comprising S-twist yarns and Z-twist yarns, or Z-twist yarns and S-twist yarns, in a ratio ranging from 1/2 to 1/8 distributed nearly uniformly depending on the number of twist, yarn count and thread count (threads/25 mm) of the weft yarn ((3).

    Flame retardant electrical laminate
    57.
    发明公开
    Flame retardant electrical laminate 失效
    Feuerhemmender elektrischer Schichtstoff。

    公开(公告)号：EP0304693A1

    公开(公告)日：1989-03-01

    申请号：EP88112636.1

    申请日：1988-08-03

    Applicant: Hitachi Chemical Co., Ltd.

    Inventor： Tanaka, Kazuyuki ,  Iwami, Etsuji ,  Hanawa, Akinori ,  Yokota, Mitsuo

    IPC: H05K1/03 ,  B32B15/08 ,  D21H3/60

    CPC classification number: H05K1/0366 ,  D21H17/53 ,  H05K1/034 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/921 ,  Y10T428/31616 ,  Y10T428/31627 ,  Y10T428/3179 ,  Y10T428/31866 ,  Y10T428/31964

    Abstract: A flame retardant electrical laminate prepared by impregnating a base material with a halogen-containing unsaturated polyester resin which is prepared by dissolving a halogen-containing unsaturated polyester into a polymerizable monomer; and then curing the halogen-­containing unsaturated polyester resin; wherein the halogen-containing unsaturated polyester has a molecular weight per 1 mole of unsaturated group of 350 to 1,000, and the cured halogen-containing unsaturated polyester resin has a glass transition temperature of 30 to 90°C.
    Such electrical laminates not only have excellent flame redardancy but also excellent punching quality at wide temperature range including room temperature.

    Abstract translation: 通过将含卤素的不饱和聚酯溶解在可聚合单体中制备的含卤素的不饱和聚酯树脂浸渍基材制成的阻燃电气层压板; 然后固化含卤素的不饱和聚酯树脂; 其中所述含卤素的不饱和聚酯的每1摩尔不饱和基团的分子量为350至1,000，并且所述固化的含卤素不饱和聚酯树脂的玻璃化转变温度为30至90℃。这种电层压板不仅具有优异的 在宽温度范围（包括室温）下仍具有优良的冲孔质量。

    Laminated products from inorganic papers
    60.
    发明公开
    Laminated products from inorganic papers 失效
    Mehrschichtige Erzeugnisse aus anorganischen Papieren。

    公开(公告)号：EP0283608A1

    公开(公告)日：1988-09-28

    申请号：EP87302567.0

    申请日：1987-03-25

    Applicant: Corning Glass Works

    Inventor： Bartholomew, Roger Frank ,  Sawyer, Constance Bradley

    IPC: D21H5/18 ,  D21H3/02 ,  H05K1/03

    CPC classification number: D21H27/30 ,  D21H13/40 ,  D21H13/44 ,  D21H17/07 ,  D21H17/52 ,  D21H17/56 ,  D21H17/72 ,  H05K1/0366 ,  H05K2201/0293

    Abstract: Laminated board products such as electronic circuit boards are prepared from laminating-resin-impregnated inorganic papers formed of synthetic or naturally occurring micas, vermiculites, or other sheet silicate crystals which are substantially lithium-free. The presence of an octylamine conditioner during flocculation of the lithium-free silicate gel to a paper-making silicate slurry improves the compatibility of the inorganic paper with the laminating resin, improving board properties.

    Abstract translation: 层压板产品如电子电路板由层合树脂浸渍的由合成或天然存在的云母，蛭石或其它基本上不含锂的片状硅酸盐晶体形成的无机纸制备。 在将无锂硅酸盐凝胶絮凝成造纸硅酸盐浆料期间，存在辛胺调理剂提高了无机纸与层压树脂的相容性，从而改善了板的性能。

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